1. 2014
  2. Fabrication and application of temperature triggered MEMS switch for active cooling control in solid state lighting system

    Ye, H., Wei, J., van Zeijl, HW., Sarro, PM. & Zhang, GQ., 2014, In : Microelectronics Reliability. 54, 6-7, p. 1338-1343 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

  3. High aspect ratio lithography for litho-defined wire bonding

    Esfahani, ZK., van Zeijl, HW. & Zhang, GQ., 2014, Proceedings - 64th Electronic Components and Technology Conference. Sauter, W. & Huffman, A. (eds.). Piscataway, NJ, USA: IEEE Society, p. 1556-1561 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  4. Modeling and simulation of monolithic integration of rectifiers for solid state lighting applications

    Ramachandrappa Venkatesh, M., Liu, P., van Zeijl, HW. & Zhang, GQ., 2014, Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. Piscataway, NJ, USA: IEEE Society, p. 1-6 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  5. Self-healing thermally conductive adhesives

    Lafont, UL., Moreno Belle, C., van Zeijl, HW. & van der Zwaag, S., 2014, In : Journal of Intelligent Material Systems and Structures. 25, 1, p. 67-74 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  6. Tailoring the Mechanical Properties of High-Aspect-Ratio Carbon Nanotube Arrays using Amorphous Silicon Carbide Coatings

    Poelma, R. H., Morana, B., Vollebregt, S., Schlangen, E., van Zeijl, HW., Fan, X. & Zhang, GQ., 2014, In : Advanced Functional Materials. 24, 36, p. 5737-5744 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  7. Through-Polymer-Via for 3D heterogeneous integration and packaging, and method of manufacture thereof

    Poelma, RH., Zhang, GQ. & van Zeijl, HW., 2014, Patent No. 2010077, Priority date 3 Jul 2014

    Research output: PatentOther research output

  8. 2013
  9. Advanced LED package with temperature sensors and microfluidic cooling

    Ye, H., van Zeijl, HW., Sokolovskij, R., Gielen, AWJ. & Zhang, GQ., 2013, Proceedings 63rd Electronic Components and Technology Conference (ECTC 2013). Sauter, W. (ed.). Piscataway, NJ, USA: IEEE Society, p. 1920-1925 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  10. Fully back-end TSV process by Cu electro-less plating for 3D smart sensor systems

    Santagata, F., Farriciello, C., Fiorentino, G., van Zeijl, HW., Silvestri, C., Zhang, GQ. & Sarro, PM., 2013, In : Journal of Micromechanics and Microengineering. 23, 5, p. 1-10 10 p.

    Research output: Contribution to journalArticleScientificpeer-review

  11. Geometric optimization of high performance interconnect of rigid/flexible/rigid substrate for wafer level packaging in solid state lighting applications by numerical simulations

    Liu, P., Zhang, J., Sokolovskij, R., van Zeijl, HW., Mimoun, BAZ. & Zhang, GQ., 2013, Proceedings of the 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2013). Zhang, GQ. (ed.). Piscataway: IEEE Society, p. 1-6 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  12. Low temperature hybrid wafer bonding for 3D integration

    Damian, AA., Poelma, RH., van Zeijl, HW. & Zhang, GQ., 2013, Proceedings of the 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2013). Zhang, GQ. (ed.). Piscataway, NJ: IEEE Society, p. 1-5 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

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