1. 2012
  2. Self-healing composites with oriented fillers

    Lafont, UL., Kunnamkuzhakkal James, N., Groen, WA., van Zeijl, HW. & van der Zwaag, S., 2012, Proceedings of the 15th International Conference on Deformation, Yield and Fracture Polymers. McKenna, GB. (ed.). Eindhoven: Eindhoven University of Technology, p. 379-382 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  3. Self-healing thermal conductive composites

    Lafont, UL., Moreno Belle, C., van Zeijl, HW. & van der Zwaag, S., 2012, p. 1-1. 1 p.

    Research output: Contribution to conferenceAbstractScientific

  4. Single-mask fabrication of temperature triggered MEMS switch for cooling control in SSL system

    Wei, J., Ye, H., van Zeijl, HW., Sarro, PM. & Zhang, GQ., 2012, Procedia Engineering - Proceedings 26th European Conference on Solid-State Transducers, EUROSENSOR 2012. Walczak, R. & Dziuban, J. (eds.). Amsterdam, The Netherlands: Elsevier, p. 849-852 4 p. (Procedia Engineering; vol. 47).

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  5. 2011
  6. A review of passive thermal management of LED module

    Ye, H., Koh, SW., van Zeijl, HW., Gielen, AWJ. & Zhang, GQ., 2011, In : Semiconductors. 32, 1, p. 1-4 4 p.

    Research output: Contribution to journalArticleScientificpeer-review

  7. Numerical modeling of thermal performance: Natural convection and radiation of solid state lighting

    Ye, H., Gielen, AWJ., van Zeijl, HW., Werkhoven, RJ. & Zhang, GQ., 2011, 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2011). Ernst, LJ., Zhang, GQ., van Driel, WD., Rodgers, P., Bailey, C. & de Saint Leger, O. (eds.). Piscataway, NJ: IEEE Society, p. 1-6 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  8. 2009
  9. Alignment and Overlay Characterization for 3D Integration and Advanced Packaging

    van Zeijl, HW. & Sarro, PM., 2009, Proc. of 11th Electronic packaging and Technology conference 2009 (EPTC 2009). s.n. (ed.). Singapore: IEEE Society, p. 1-5 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  10. Oxidized ALD-deposited titanium nitride films as a low-temperature alternative for enhancing the wettability of through-silicon vias

    Saadaoui, M., van Zeijl, HW., Pham, HTM., MKnoops, HC., Kessels, WMM., van de Sanden, MCM., Roozeboom, F., Lamy, Y., Jinesh, KB., Besling, W. & Sarro, PM., 2009, MRS Proceedings Volume 1112, Materials and Technologies for 3-D Integration. Roozeboom, F. & Bower, C. (eds.). Warrendale, PA, US: MRS, p. 1-8 8 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  11. Stretchable array of ISFET devices for applications in biomedical imagers

    Zoumpoulidis, T., Prodromakis, T., Michelakis, K., van Zeijl, HW., Bartek, M., Toumazou, C. & Dekker, R., 2009, Proc. IEEE Sensors 2009 Conference. Mukhopadhyay, SC. (ed.). IEEE Society, p. 7-12 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  12. Through Silicon Interconnect Using grayscale Lithography for MEMS Applications

    van Zeijl, HW., Liu, D. & Sarro, PM., 2009, Eurosensors XXIII. Brugger, J. & Briand, D. (eds.). Elsevier, p. 1543-1546 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  13. 2008
  14. A study of cross-bridge kelvin resistor structures for reliable measurement of low contact resistances

    Stavitski, N., Klootwijk, JH., van Zeijl, HW., Kovalging, AY. & Wolters, RAM., 2008, Proceedings of the 21st International Conference on Microelectronic Test structures (ICMTS). s.n (ed.). Edinburgh, Schotland: IEEE Society, p. 199-204 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

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