1. 2009
  2. Alignment and Overlay Characterization for 3D Integration and Advanced Packaging

    van Zeijl, HW. & Sarro, PM., 2009, Proc. of 11th Electronic packaging and Technology conference 2009 (EPTC 2009). s.n. (ed.). Singapore: IEEE Society, p. 1-5 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  3. Oxidized ALD-deposited titanium nitride films as a low-temperature alternative for enhancing the wettability of through-silicon vias

    Saadaoui, M., van Zeijl, HW., Pham, HTM., MKnoops, HC., Kessels, WMM., van de Sanden, MCM., Roozeboom, F., Lamy, Y., Jinesh, KB., Besling, W. & Sarro, PM., 2009, MRS Proceedings Volume 1112, Materials and Technologies for 3-D Integration. Roozeboom, F. & Bower, C. (eds.). Warrendale, PA, US: MRS, p. 1-8 8 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  4. Stretchable array of ISFET devices for applications in biomedical imagers

    Zoumpoulidis, T., Prodromakis, T., Michelakis, K., van Zeijl, HW., Bartek, M., Toumazou, C. & Dekker, R., 2009, Proc. IEEE Sensors 2009 Conference. Mukhopadhyay, SC. (ed.). IEEE Society, p. 7-12 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  5. Through Silicon Interconnect Using grayscale Lithography for MEMS Applications

    van Zeijl, HW., Liu, D. & Sarro, PM., 2009, Eurosensors XXIII. Brugger, J. & Briand, D. (eds.). Elsevier, p. 1543-1546 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  6. 2008
  7. A study of cross-bridge kelvin resistor structures for reliable measurement of low contact resistances

    Stavitski, N., Klootwijk, JH., van Zeijl, HW., Kovalging, AY. & Wolters, RAM., 2008, Proceedings of the 21st International Conference on Microelectronic Test structures (ICMTS). s.n (ed.). Edinburgh, Schotland: IEEE Society, p. 199-204 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  8. Design and characterization of a novel icp plasma tool for high speed and accuracy drie processing

    Launay, N., van Zeijl, HW. & Sarro, PM., 2008, Proc. IEEE MEMS 2008. Brand, O. & Zohar, Y. (eds.). Tucson, Arizona: IEEE Society, p. 311-314 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  9. Front to back-side 3D interconnects fabrication process based on controlled cu electroplating of high aspect ratio through silicon vias (HAR-TSVs)

    Saadaoui, M., Wien, WHA., van Zeijl, HW., Schellevis, H., Laros, M. & Sarro, PM., 2008, 10th electronics packaging technology conference. Yang, T. & Kheng, T. (eds.). Singapore: IEEE Society, p. 219-223 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  10. Grayscale lithography characterization for 3D structuring

    Lui, D., van Zeijl, HW. & Sarro, PM., 2008, Proc. 19th micromechanics europe (MME 2008). SChnakenberg, U. (ed.). Aachem, Germany: Instituut of Materials in Electrical Engineering, p. 133-136 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  11. 2007
  12. A dual-side fabrication method for silicon plate springs with high out-of-plane stiffness

    Paalvast, SL., van Zeijl, HW., Sarro, PM. & van Eijk, J., 2007, In : Journal of Micromechanics and Microengineering. 17, p. S197-S203

    Research output: Contribution to journalArticleScientificpeer-review

  13. Fabrication and characterization of high aspect ratio silicon plate springs with high out-of plane stiffness

    van Zeijl, HW., Paalvast, SL., Su, J., van Eijk, J. & Sarro, PM., 2007, the 14th International Conference on Solid-State Sensors, Actuators and Microsystems. IEEE (ed.). Lyon: Transducers & Eurosensors '07, p. 1605-1608 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

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