1. 2008
  2. Design and characterization of a novel icp plasma tool for high speed and accuracy drie processing

    Launay, N., van Zeijl, HW. & Sarro, PM., 2008, Proc. IEEE MEMS 2008. Brand, O. & Zohar, Y. (eds.). Tucson, Arizona: IEEE Society, p. 311-314 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  3. Front to back-side 3D interconnects fabrication process based on controlled cu electroplating of high aspect ratio through silicon vias (HAR-TSVs)

    Saadaoui, M., Wien, WHA., van Zeijl, HW., Schellevis, H., Laros, M. & Sarro, PM., 2008, 10th electronics packaging technology conference. Yang, T. & Kheng, T. (eds.). Singapore: IEEE Society, p. 219-223 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  4. Grayscale lithography characterization for 3D structuring

    Lui, D., van Zeijl, HW. & Sarro, PM., 2008, Proc. 19th micromechanics europe (MME 2008). SChnakenberg, U. (ed.). Aachem, Germany: Instituut of Materials in Electrical Engineering, p. 133-136 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  5. 2007
  6. A dual-side fabrication method for silicon plate springs with high out-of-plane stiffness

    Paalvast, SL., van Zeijl, HW., Sarro, PM. & van Eijk, J., 2007, In : Journal of Micromechanics and Microengineering. 17, p. S197-S203

    Research output: Contribution to journalArticleScientificpeer-review

  7. Fabrication and characterization of high aspect ratio silicon plate springs with high out-of plane stiffness

    van Zeijl, HW., Paalvast, SL., Su, J., van Eijk, J. & Sarro, PM., 2007, the 14th International Conference on Solid-State Sensors, Actuators and Microsystems. IEEE (ed.). Lyon: Transducers & Eurosensors '07, p. 1605-1608 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  8. Improvement of wettability of silicon nitride in PECVD environment for copper electrodeposition in HAR vias

    Saadaoui, M., Wien, WHA., van Zeijl, HW., van Bogaard, A. & Sarro, PM., 2007, SAFE 2007 Semiconductor advances for future electornics. s.n. (ed.). Veldhoven, The Netherlands: STW, p. 543-546 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  9. Local Sealing of High Aspect Ratio Vias for Single Step Bottom-up Copper Electroplating of Through Wafer Interconnects

    Saadaoui, M., Wien, WHA., van Zeijl, HW., Schellevis, H., Laros, M. & Sarro, PM., 2007, Proc. IEEE Sensors 2007 Conference. Mizaikoff, B. & French, PJ. (eds.). Atlanta, Georgia: IEEE Society, p. 974-977 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  10. Oxide to oxide wafer bonding for three dimensional (3D) IC integration technologies

    Cannavo, M., van Zeijl, HW., Pandraud, G., Driel, JV., Alan, T. & Sarro, PM., 2007, SAFE 2007 Semiconductor advances for future electornics. s.n. (ed.). Veldhoven, The Netherlands: STW, p. 509-512 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  11. 2006
  12. A Noval dual-side fabrication method for Silicon Plate Springs with high ouf-of-plane stiffness

    van Zeijl, HW., Paalvast, SL., Sarro, PM. & van Eijk, J., 2006, Micromechanics Europe 2006. sn (ed.). Southampton: MMEW, p. 1-8 8 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  13. A novel dual-side fabrication method for silicon plate springs with high out-of plane stiffness

    van Zeijl, HW., Su, J., Paalvast, SL., Sarro, PM. & van Eijk, J., 2006, Proceedings of the 17th MME MicroMechanics Europe Workshop. s.n. (ed.). Southampton: H.Morgan Ed., p. 209-212 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

ID: 145194