1. 2007
  2. Improvement of wettability of silicon nitride in PECVD environment for copper electrodeposition in HAR vias

    Saadaoui, M., Wien, WHA., van Zeijl, HW., van Bogaard, A. & Sarro, PM., 2007, SAFE 2007 Semiconductor advances for future electornics. s.n. (ed.). Veldhoven, The Netherlands: STW, p. 543-546 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  3. Local Sealing of High Aspect Ratio Vias for Single Step Bottom-up Copper Electroplating of Through Wafer Interconnects

    Saadaoui, M., Wien, WHA., van Zeijl, HW., Schellevis, H., Laros, M. & Sarro, PM., 2007, Proc. IEEE Sensors 2007 Conference. Mizaikoff, B. & French, PJ. (eds.). Atlanta, Georgia: IEEE Society, p. 974-977 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  4. Oxide to oxide wafer bonding for three dimensional (3D) IC integration technologies

    Cannavo, M., van Zeijl, HW., Pandraud, G., Driel, JV., Alan, T. & Sarro, PM., 2007, SAFE 2007 Semiconductor advances for future electornics. s.n. (ed.). Veldhoven, The Netherlands: STW, p. 509-512 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  5. 2006
  6. A Noval dual-side fabrication method for Silicon Plate Springs with high ouf-of-plane stiffness

    van Zeijl, HW., Paalvast, SL., Sarro, PM. & van Eijk, J., 2006, Micromechanics Europe 2006. sn (ed.). Southampton: MMEW, p. 1-8 8 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

  7. A novel dual-side fabrication method for silicon plate springs with high out-of plane stiffness

    van Zeijl, HW., Su, J., Paalvast, SL., Sarro, PM. & van Eijk, J., 2006, Proceedings of the 17th MME MicroMechanics Europe Workshop. s.n. (ed.). Southampton: H.Morgan Ed., p. 209-212 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  8. A novel dual-side fabrication method for silicon plate springs with high out-of-plane stiffness

    Su, J., van Zeijl, HW., Paalvast, SL., Sarro, PM. & van Eijk, J., 2006, Proceedings of SAFE 2006 Workshop on Semiconductor Advances for Future Electronics and Sensors. s.n. (ed.). Veldhoven: s.l., p. 394-397 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  9. Copper electroplating for 3D interconnects

    Saadaoui, M., Wien, WHA., van Zeijl, HW. & Sarro, PM., 2006, Proceedings of SAFE 2006 Workshop on Semiconductor Advances for Future Electronics and Sensors. s.n. (ed.). Veldhoven: s.l., p. 523-526 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  10. Low-Temperature Solid-Phase Epitaxy of Defect-Free Aluminum p+-doped Silicon for Nanoscale Device Applications

    Civale, Y., Nanver, LK., Hadley, P., van Zeijl, HW., Goudena, EJG. & Schellevis, H., 2006, Material Research Society Symposium Proceedings (940E, Warrendale, PA) Semiconductor Nanowires Symposium Proceedings. Schmidt, V. (ed.). San Francisco, USA: Material Research Society, p. -

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  11. a noval dual-side fabriation method for silicon plate springs with high out-of plane stifness

    Su, J., van Zeijl, HW., Paalvast, SL., Sarro, PM. & van Eijk, J., 2006, SAFE conferentie. SN (ed.). Veldhoven: SAFE, p. 394-397 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

  12. 2005
  13. 3D align overlay verification using glass wafers

    Smeets, EMJ., Bijnen, FGC., Slabbekoorn, JHCM. & van Zeijl, HW., 2005, Proceedings of SPIE, MEMS/MOEMS Technologies and Applications II. Ma, Z., Jin, G. & Chen, X. (eds.). Bellingham (WA), USA: SPIE, p. 152-162 11 p. (Proceedings of SPIE- International Society for Optical Engineering; vol. 5641).

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

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