1. 2006
  2. A novel dual-side fabrication method for silicon plate springs with high out-of-plane stiffness

    Su, J., van Zeijl, HW., Paalvast, SL., Sarro, PM. & van Eijk, J., 2006, Proceedings of SAFE 2006 Workshop on Semiconductor Advances for Future Electronics and Sensors. s.n. (ed.). Veldhoven: s.l., p. 394-397 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  3. Copper electroplating for 3D interconnects

    Saadaoui, M., Wien, WHA., van Zeijl, HW. & Sarro, PM., 2006, Proceedings of SAFE 2006 Workshop on Semiconductor Advances for Future Electronics and Sensors. s.n. (ed.). Veldhoven: s.l., p. 523-526 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  4. Low-Temperature Solid-Phase Epitaxy of Defect-Free Aluminum p+-doped Silicon for Nanoscale Device Applications

    Civale, Y., Nanver, LK., Hadley, P., van Zeijl, HW., Goudena, EJG. & Schellevis, H., 2006, Material Research Society Symposium Proceedings (940E, Warrendale, PA) Semiconductor Nanowires Symposium Proceedings. Schmidt, V. (ed.). San Francisco, USA: Material Research Society, p. -

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  5. a noval dual-side fabriation method for silicon plate springs with high out-of plane stifness

    Su, J., van Zeijl, HW., Paalvast, SL., Sarro, PM. & van Eijk, J., 2006, SAFE conferentie. SN (ed.). Veldhoven: SAFE, p. 394-397 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  6. 2005
  7. 3D align overlay verification using glass wafers

    Smeets, EMJ., Bijnen, FGC., Slabbekoorn, JHCM. & van Zeijl, HW., 2005, Proceedings of SPIE, MEMS/MOEMS Technologies and Applications II. Ma, Z., Jin, G. & Chen, X. (eds.). Bellingham (WA), USA: SPIE, p. 152-162 11 p. (Proceedings of SPIE- International Society for Optical Engineering; vol. 5641).

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  8. Base-contact proximity effects in bipolar transistors with nitride-spacer technology

    van Zeijl, HW. & Nanver, LK., 2005, Proceedings of the 35th European solid-state device research conference (ESSDERC). Cristoloveanu, S., Brillouët, M. & Skotnicki, T. (eds.). Piscataway: IEEE Society, p. 461-464 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  9. Bipolar transistors with self-aligned emitter-base metallization and back-wafer aligned collector contacts

    van Zeijl, HW., 2005, s.l.: s.n.. 185 p.

    Research output: ThesisDissertation (TU Delft)Scientific

  10. Front-to back-side overlay optimization after wafer bonding for 3D integration

    van Noort, WD., Marinier, L., Pellens, R., Sutedja, B., Dekker, R. & van Zeijl, HW., 2005, Proceedings of the 31st international conference of micro- and nano-engineering 2005. s.n. (ed.). Amsterdam: Elsevier, p. 1-4 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  11. LPCVD silicon nitride-on-silicon spacer technology

    van Zeijl, HW. & Nanver, LK., 2005, Electrochemical Society Proceedings. s.n. (ed.). Pennington (NJ), USA: The Electrochemical Society, Inc., p. 153-162 10 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  12. Lithographic alignment offset compensation for substrate transfer processes

    van Zeijl, HW., Nanver, LK., Bijnen, FGC., Goudena, EJG. & Slabbekoorn, JHCM., 2005, Proceedings of the STW annual workshop on semiconductor advances for future electronics and sensors (SAFE 2005). s.n. (ed.). Utrecht, The Netherlands: STW, p. 121-126 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

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