1. 2019
  2. A Wafer-Scale Process for the Monolithic Integration of CVD Graphene and CMOS Logic for Smart MEMS/NEMS Sensors

    Romijn, J., Vollebregt, S., van Zeijl, H. W. & Sarro, P. M., 2019, 2019 IEEE 32nd International Conference on Micro Electro Mechanical Systems (MEMS). Piscataway: IEEE, p. 260-263 4 p. 8870741

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  3. MEMS Enabled Fast Time-Resolved X-Ray Diffraction Characterization Platform for Copper Nanoparticle Sintering in Heterogeneous Integration Applications

    Zhang, B., Wei, J., Bottger, A. J., van Zeijl, H. W., Sarro, P. M. & Zhang, G., 2019, 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII): Proceedings. Danvers: IEEE, p. 1772-1775 4 p. 8808192

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  4. 2018
  5. Corrigendum to “Vaporizing liquid microthrusters with integrated heaters and temperature measurement” [Sens. Actuators A 265 (2017) 261–274](S0924424717306490)(10.1016/j.sna.2017.07.032)

    Silva, M. A. C., Guerrieri, D. C., van Zeijl, H., Cervone, A. & Gill, E., 1 Jul 2018, In : Sensors and Actuators, A: Physical. 277, 1 p.

    Research output: Contribution to journalComment/Letter to the editorScientificpeer-review

  6. Designing a 100 [aF/nm] capacitive transducer

    Middelburg, L. M., Mansouri, B. E., Poelma, R. H., Van Zeijl, H. W., Wei, J., Zhang, G. Q. & Van Driel, W. D., 2018, 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018. Piscataway, NJ: IEEE, p. 1-3 3 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  7. Non-linear bulk micromachined accelerometer for high sensitivity applications

    Middelburg, L. M., Mansouri, B. E., Poelma, R., Zhang, G. Q., van Zeijl, H. & Wei, J., 2018, 2018 IEEE SENSORS Proceedings. Roy, A. & Gianchandani, Y. (eds.). Piscataway, NJ: IEEE, Vol. 2018-October. p. 1-4 4 p. 8589630

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  8. Three dimensional thermoacoustic device composed of nanoporous material and the method to fabricate such a device

    Poelma, R., Zhang, G. Q., Yi, H. & van Zeijl, H., 2018, IPC No. H04R, Priority date 1 Aug 2016, Priority No. NL 2017268

    Research output: PatentOther research output

  9. 2017
  10. Fabrication and characterization of low pressure micro-resistojets with integrated heater and temperature measurement

    Guerrieri, D. C., Silva, M. A. C., Van Zeijl, H., Cervone, A. & Gill, E., 30 Oct 2017, In : Journal of Micromechanics and Microengineering. 27, 12, 11 p., 125005.

    Research output: Contribution to journalArticleScientificpeer-review

  11. Vaporizing Liquid Microthrusters with integrated heaters and temperature measurement

    Silva, M. A. C., Cordeiro Guerrieri, D., van Zeijl, H., Cervone, A. & Gill, E., 1 Oct 2017, In : Sensors and Actuators A: Physical: an international journal devoted to research and development of physical and chemical transducers. 265, p. 261-274 14 p.

    Research output: Contribution to journalArticleScientificpeer-review

  12. Effect of droplet shrinking on surface acoustic wave response in microfluidic applications

    Bui, T. H., Nguyen, V., Vollebregt, S., Morana, B., van Zeijl, H., Chu Duc, T. & Sarro, P. M., 2017, In : Applied Surface Science. 426, p. 253-261 9 p.

    Research output: Contribution to journalArticleScientificpeer-review

  13. High aspect ratio spiral resonators for process variation investigation and MEMS applications

    Middelburg, L. M., Mansouri, B. E., Van Zeijl, H. W., Zhang, G. Q. & Poelma, R. H., 2017, Proceedings of IEEE Sensors Conference 2017. Piscataway, NJ: IEEE, p. 1-3 3 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  14. Insitu 3D Wafer Level Monitor/Control Unit for LED Color-shifting

    Zhang, G. Q., Kolahdouz Esfahani, Z. & van Zeijl, H., 2017, IPC No. H05B; H01L, Priority date 9 Oct 2015, Priority No. NL 2015596

    Research output: PatentOther research output

  15. MEMS Based Micro-Propulsion System for CubeSats and PocketQubes

    Pallichadath, V., Silvestrini, S., Silva, M. A. C., Maxence (Student TU Delft), D., Guerrieri, D. C., Mestry, S., Pérez Soriano, T., Bacaro, M., van Zeijl, H., Zandbergen, B. & Cervone, A., 2017, Proceedings of the 68th International Astronautical Congress (IAC), Adelaide, Australia, 25-29 September 2017. IAF, 13 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  16. Monolithically Integrated Light Feedback Control Circuit for Blue/UV LED Smart Package

    Koladouz Esfahani, Z., Tohidian, M., Van Zeijl, H., Kolahdouz, M. & Zhang, G., 2017, In : IEEE Photonics Journal. 9, 2, 7870601.

    Research output: Contribution to journalArticleScientificpeer-review

  17. Smart Systems Integration in the era of Solid State Lighting

    van Driel, W., Zhang, G. Q., van Zeijl, H., Poelma, R., Koladouz Esfahani, Z., Ramachandrappa Venkatesh, M., Middelburg, L. & El Mansouri, B., 2017, Smart Systems Integration 2017: International Conference and Exhibition on Integration Issues of Miniaturized Systems. Otto, T. (ed.). Frankfurt: Mesago Messe Frankfurt GmbH, p. 160-165 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  18. 2016
  19. A transfer-free wafer-scale CVD graphene fabrication process for MEMS/NEMS sensors

    Vollebregt, S., Alfano, B., Ricciardella, F., Giesbers, A. J. M., Grachova, Y., van Zeijl, H., Polichetti, T. & Sarro, L., Jan 2016, 2016 IEEE 29th International Conference on Micro Electro Mechanical Systems (MEMS). Piscataway, NJ: IEEE, p. 17-20 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  20. 3D interconnect technology based on low temperature copper nanoparticle sintering

    Zhang, B., Carisey, Y., Damian, A., Poelma, R., Zhang, G. Q. & van Zeijl, H., 2016, Proceedings of the 17th International Conference on Electronic Packaging Technology (ICEPT). Bi, K., Liu, S. & Zhou, S. (eds.). IEEE, p. 1163-1167

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  21. Design, Fabrication, Testing and Modeling of a Vaporizing Liquid Micro-Propulsion System

    van Wees, T., Hanselaar, C., Jansen, E., Cervone, A., Zandbergen, B. & van Zeijl, H., 2016, Space propulsion 2016. 12 p. SPC2016_3124914

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  22. Effects of Nanostructure and Coating on the Mechanics of Carbon Nanotube Arrays

    Poelma, RH., Fan, X., Hu, Z-Y., Van Tendeloo, G., van Zeijl, H. & Zhang, GQ., 2016, In : Advanced Functional Materials. 26, 8, p. 1233-1242 10 p.

    Research output: Contribution to journalArticleScientificpeer-review

  23. Green micro-resistojet research at Delft University of Technology: the new frontiers of Cubesat propulsion

    Cervone, A., Zandbergen, BTC., Cordeiro Guerrieri, D., de Athayde Costa e Silva, M. & van Zeijl, H., 2016, In : CEAS Space Journal. 9, 1, p. 111-125 15 p.

    Research output: Contribution to journalArticleScientificpeer-review

  24. Metallic Nanoparticle Based Interconnect for Heterogeneous 3D Integration

    van Zeijl, H., Carisey, Y., Damian, A., Poelma, R., A, Z. & Zhang, G. Q., 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC). O'Conner, L. (ed.). Piscataway: IEEE, p. 217-224 8 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  25. Output blue light evaluation for phosphor based smart white LED wafer level packages

    Kolahdouz Esfahani, Z., Rostamian, A., Kolahdouz, M., Ma, T., van Zeijl, H. & Zhang, K., 2016, In : Optics Express. 24, 4, p. 3216-3229 14 p.

    Research output: Contribution to journalArticleScientificpeer-review

  26. Tailoring material properties for 3D microfabrication: In-situ experimentation and multi-scale modelling

    Poelma, R., Fan, X. J., Schlangen, E., van Zeijl, H. & Zhang, G. Q., 2016, 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE, p. 1-6 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  27. 2015
  28. Design and fabrication of a foldable 3D silicon based package for solid state lighting applications

    Sokolovskij, R., Liu, P., van Zeijl, HW., Mimoun, BAZ. & Zhang, GQ., 2015, In : Journal of Micromechanics and Microengineering. 25, 5, p. 055017-1-055017-10

    Research output: Contribution to journalArticleScientificpeer-review

  29. Effects of silicon via profile on passivation and metallization in TSV interposers for 2.5D integration

    Lin, P., Zhang, GQ., van Zeijl, HW., Lian, BH., Wang, Y. & Yao, QB., 2015, In : Microelectronic Engineering. 134, p. 22-26 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  30. Review on retrofit G4 LED lamps: Technology, challenges, and future trends

    Liu, P., van Zeijl, HW., Venkatesh, MR., Sokolovskij, R., Kurt, R. & Zhang, GQ., 2015, Proceedings - 65th Electronic Components and Technology Conference. Keser, B. & Braunisch, H. (eds.). Piscataway, NJ, USA: IEEE Society, p. 2277-2282 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  31. 2014
  32. A polymer based miniature loop heat pipe with silicon substrate and temperature sensors for high brightness light-emitting diodes

    Ye, H., Sokolovskij, R., van Zeijl, HW., Gielen, AWJ. & Zhang, GQ., 2014, In : Microelectronics Reliability. 54, 6-7, p. 1355-1362 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  33. Blue selective photodiodes for optical feedback in LED wafer level packages

    Kolahdouz Esfahani, Z., Ma, T., van Zeijl, HW., Zhang, GQ., Rostamian, A. & Kolahdouz, M., 2014, Proceedings of the 44th European Solid-State Device Research Conference. Bez, R., Pavan, P. & Meneghesso, G. (eds.). Piscataway, NJ, USA: IEEE Society, p. 174-177 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  34. Electrical-thermal-luminous-chromatic model of phosphor-converted white light-emitting diodes

    Ye, H., Koh, SW., Yuan, CA., van Zeijl, HW., Gielen, AWJ., Lee, SWR. & Zhang, GQ., 2014, In : Applied Thermal Engineering. 63, 2, p. 588-597 10 p.

    Research output: Contribution to journalArticleScientificpeer-review

  35. Fabrication and application of temperature triggered MEMS switch for active cooling control in solid state lighting system

    Ye, H., Wei, J., van Zeijl, HW., Sarro, PM. & Zhang, GQ., 2014, In : Microelectronics Reliability. 54, 6-7, p. 1338-1343 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

  36. High aspect ratio lithography for litho-defined wire bonding

    Esfahani, ZK., van Zeijl, HW. & Zhang, GQ., 2014, Proceedings - 64th Electronic Components and Technology Conference. Sauter, W. & Huffman, A. (eds.). Piscataway, NJ, USA: IEEE Society, p. 1556-1561 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  37. Modeling and simulation of monolithic integration of rectifiers for solid state lighting applications

    Ramachandrappa Venkatesh, M., Liu, P., van Zeijl, HW. & Zhang, GQ., 2014, Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. Piscataway, NJ, USA: IEEE Society, p. 1-6 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  38. Self-healing thermally conductive adhesives

    Lafont, UL., Moreno Belle, C., van Zeijl, HW. & van der Zwaag, S., 2014, In : Journal of Intelligent Material Systems and Structures. 25, 1, p. 67-74 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  39. Tailoring the Mechanical Properties of High-Aspect-Ratio Carbon Nanotube Arrays using Amorphous Silicon Carbide Coatings

    Poelma, R. H., Morana, B., Vollebregt, S., Schlangen, E., van Zeijl, HW., Fan, X. & Zhang, GQ., 2014, In : Advanced Functional Materials. 24, 36, p. 5737-5744 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  40. Through-Polymer-Via for 3D heterogeneous integration and packaging, and method of manufacture thereof

    Poelma, RH., Zhang, GQ. & van Zeijl, HW., 2014, Patent No. 2010077, Priority date 3 Jul 2014

    Research output: PatentOther research output

  41. 2013
  42. Advanced LED package with temperature sensors and microfluidic cooling

    Ye, H., van Zeijl, HW., Sokolovskij, R., Gielen, AWJ. & Zhang, GQ., 2013, Proceedings 63rd Electronic Components and Technology Conference (ECTC 2013). Sauter, W. (ed.). Piscataway, NJ, USA: IEEE Society, p. 1920-1925 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  43. Fully back-end TSV process by Cu electro-less plating for 3D smart sensor systems

    Santagata, F., Farriciello, C., Fiorentino, G., van Zeijl, HW., Silvestri, C., Zhang, GQ. & Sarro, PM., 2013, In : Journal of Micromechanics and Microengineering. 23, 5, p. 1-10 10 p.

    Research output: Contribution to journalArticleScientificpeer-review

  44. Geometric optimization of high performance interconnect of rigid/flexible/rigid substrate for wafer level packaging in solid state lighting applications by numerical simulations

    Liu, P., Zhang, J., Sokolovskij, R., van Zeijl, HW., Mimoun, BAZ. & Zhang, GQ., 2013, Proceedings of the 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2013). Zhang, GQ. (ed.). Piscataway: IEEE Society, p. 1-6 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  45. Low temperature hybrid wafer bonding for 3D integration

    Damian, AA., Poelma, RH., van Zeijl, HW. & Zhang, GQ., 2013, Proceedings of the 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2013). Zhang, GQ. (ed.). Piscataway, NJ: IEEE Society, p. 1-5 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  46. Monitoring the restoration of interfacial contact for self healing thermal interface materials for led and microelectronic applications

    Lafont, UL., van Zeijl, HW. & van der Zwaag, S., 2013, Proceedings 4th International Conference on Self-Healing Materials. de Belie, N., van der Zwaag, S., Gruyaert, E., van Tittelboom, K. & Debbaut, B. (eds.). Ghent, Belgium: Magnel Laboratory for Concrete Research, p. 164-167 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  47. Multi-LED package design, fabrication and thermal analysis

    Poelma, RH., Tarashioon, S., van Zeijl, HW., Goldbach, S., Zijl, JLJ. & Zhang, GQ., 2013, In : Journal of Semiconductors. 34, 5, p. 1-5 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  48. Multiple healing in multi-functional polymer composites

    Lafont, UL., van Zeijl, HW. & van der Zwaag, S., 2013, Proceedings 4th International Conference on Self-Healing Materials. de Belie, N., van der Zwaag, S., Gruyaert, E., van Tittelboom, K. & Debbaut, B. (eds.). Ghent, Belgium: Magnel Laborator for Concrete Research, p. 467-470 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  49. On the use of high precision electrical resistance measurement for analyzing the damage development during accelerated test of Pb-free solder interconnects

    Zhang, J., van der Zwaag, S., van Zeijl, HW. & Zhang, GQ., 2013, Proceedings 63rd Electronic Components and Technology Conference (ECTC 2013). Sauter, W. (ed.). Piscataway: IEEE Society, p. 192-199 8 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  50. Thermal transient effect and improved junction temperature measurement method in high-voltage light-emitting diodes

    Ye, H., Chen, X., van Zeijl, HW., Gielen, AWJ. & Zhang, GQ., 2013, In : IEEE Electron Device Letters. 34, 9, p. 1172-1174 3 p.

    Research output: Contribution to journalArticleScientificpeer-review

  51. Titanium nitride (TiN) as a gate material in BiCMOS devices for biomedical implants

    Lawand, NS., van Zeijl, HW., French, PJ., Briaire, JJ. & Frijns, JHM., 2013, Proceedings IEEE Sensors 2013. Brown, E., Gianchandani, Y. & Trew, R. (eds.). Piscataway, NJ, USA: IEEE Society, p. 1-4 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  52. Two-phase cooling of light emitting diode for higher light output and increased efficiency

    Ye, H., Mihailovic, M., Wong, KY., van Zeijl, HW., Gielen, AWJ., Zhang, GQ. & Sarro, PM., 2013, In : Applied Thermal Engineering. 52, 2, p. 353-359 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  53. 2012
  54. Dynamic thermal simulation of high brightness LEDs with unsteady driver power output

    Ye, H., Koh, SW., Wei, J., van Zeijl, HW. & Zhang, GQ., 2012, Proceedings 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. De Saint Leger et al, O. (ed.). Piscataway, NJ, USA: IEEE Society, p. 451-455 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  55. High accuracy dual side overlay with wet anisotropic etching for HAR MEMS

    van Zeijl, HW., Best, K. & Sarro, PM., 2012, Technical Proceedings of the 2012 NSTI Nanotechnology Conference and Expo, Volume 2. Gaura et al, EI. (ed.). Austin, TX, USA: NSTI, p. 180-183 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  56. Increasing the reliability of solid state lighting systems via self healing approaches: a review

    Lafont, UL., van Zeijl, HW. & van der Zwaag, S., 2012, In : Microelectronics Reliability. 52, 1, p. 71-89 19 p.

    Research output: Contribution to journalArticleScientificpeer-review

  57. Influence of cross-linkers on the cohesive and adhesive self-healing ability of polysulfide-based thermosets

    Lafont, UL., van Zeijl, HW. & van der Zwaag, S., 2012, In : ACS Applied Materials and Interfaces. 4, 11, p. 6280-6288 9 p.

    Research output: Contribution to journalArticleScientificpeer-review

  58. Materials with self-healing cohesive and adhesive properties

    Lafont, UL., Vega Vega, JM., van Zeijl, HW., Garcia Espallargas, SJ. & van der Zwaag, S., 2012, Proceedings of the 15th DYFP Conference. McKenna, GB. (ed.). Eindhoven: Eindhoven University of Technology, p. 373-376 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  59. Self-healing composites with oriented fillers

    Lafont, UL., Kunnamkuzhakkal James, N., Groen, WA., van Zeijl, HW. & van der Zwaag, S., 2012, Proceedings of the 15th International Conference on Deformation, Yield and Fracture Polymers. McKenna, GB. (ed.). Eindhoven: Eindhoven University of Technology, p. 379-382 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  60. Self-healing thermal conductive composites

    Lafont, UL., Moreno Belle, C., van Zeijl, HW. & van der Zwaag, S., 2012, p. 1-1. 1 p.

    Research output: Contribution to conferenceAbstractScientific

  61. Single-mask fabrication of temperature triggered MEMS switch for cooling control in SSL system

    Wei, J., Ye, H., van Zeijl, HW., Sarro, PM. & Zhang, GQ., 2012, Procedia Engineering - Proceedings 26th European Conference on Solid-State Transducers, EUROSENSOR 2012. Walczak, R. & Dziuban, J. (eds.). Amsterdam, The Netherlands: Elsevier, p. 849-852 4 p. (Procedia Engineering; vol. 47).

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  62. 2011
  63. A review of passive thermal management of LED module

    Ye, H., Koh, SW., van Zeijl, HW., Gielen, AWJ. & Zhang, GQ., 2011, In : Semiconductors. 32, 1, p. 1-4 4 p.

    Research output: Contribution to journalArticleScientificpeer-review

  64. Numerical modeling of thermal performance: Natural convection and radiation of solid state lighting

    Ye, H., Gielen, AWJ., van Zeijl, HW., Werkhoven, RJ. & Zhang, GQ., 2011, 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2011). Ernst, LJ., Zhang, GQ., van Driel, WD., Rodgers, P., Bailey, C. & de Saint Leger, O. (eds.). Piscataway, NJ: IEEE Society, p. 1-6 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  65. 2009
  66. Alignment and Overlay Characterization for 3D Integration and Advanced Packaging

    van Zeijl, HW. & Sarro, PM., 2009, Proc. of 11th Electronic packaging and Technology conference 2009 (EPTC 2009). s.n. (ed.). Singapore: IEEE Society, p. 1-5 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  67. Oxidized ALD-deposited titanium nitride films as a low-temperature alternative for enhancing the wettability of through-silicon vias

    Saadaoui, M., van Zeijl, HW., Pham, HTM., MKnoops, HC., Kessels, WMM., van de Sanden, MCM., Roozeboom, F., Lamy, Y., Jinesh, KB., Besling, W. & Sarro, PM., 2009, MRS Proceedings Volume 1112, Materials and Technologies for 3-D Integration. Roozeboom, F. & Bower, C. (eds.). Warrendale, PA, US: MRS, p. 1-8 8 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  68. Stretchable array of ISFET devices for applications in biomedical imagers

    Zoumpoulidis, T., Prodromakis, T., Michelakis, K., van Zeijl, HW., Bartek, M., Toumazou, C. & Dekker, R., 2009, Proc. IEEE Sensors 2009 Conference. Mukhopadhyay, SC. (ed.). IEEE Society, p. 7-12 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  69. Through Silicon Interconnect Using grayscale Lithography for MEMS Applications

    van Zeijl, HW., Liu, D. & Sarro, PM., 2009, Eurosensors XXIII. Brugger, J. & Briand, D. (eds.). Elsevier, p. 1543-1546 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  70. 2008
  71. A study of cross-bridge kelvin resistor structures for reliable measurement of low contact resistances

    Stavitski, N., Klootwijk, JH., van Zeijl, HW., Kovalging, AY. & Wolters, RAM., 2008, Proceedings of the 21st International Conference on Microelectronic Test structures (ICMTS). s.n (ed.). Edinburgh, Schotland: IEEE Society, p. 199-204 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  72. Design and characterization of a novel icp plasma tool for high speed and accuracy drie processing

    Launay, N., van Zeijl, HW. & Sarro, PM., 2008, Proc. IEEE MEMS 2008. Brand, O. & Zohar, Y. (eds.). Tucson, Arizona: IEEE Society, p. 311-314 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  73. Front to back-side 3D interconnects fabrication process based on controlled cu electroplating of high aspect ratio through silicon vias (HAR-TSVs)

    Saadaoui, M., Wien, WHA., van Zeijl, HW., Schellevis, H., Laros, M. & Sarro, PM., 2008, 10th electronics packaging technology conference. Yang, T. & Kheng, T. (eds.). Singapore: IEEE Society, p. 219-223 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  74. Grayscale lithography characterization for 3D structuring

    Lui, D., van Zeijl, HW. & Sarro, PM., 2008, Proc. 19th micromechanics europe (MME 2008). SChnakenberg, U. (ed.). Aachem, Germany: Instituut of Materials in Electrical Engineering, p. 133-136 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  75. 2007
  76. A dual-side fabrication method for silicon plate springs with high out-of-plane stiffness

    Paalvast, SL., van Zeijl, HW., Sarro, PM. & van Eijk, J., 2007, In : Journal of Micromechanics and Microengineering. 17, p. S197-S203

    Research output: Contribution to journalArticleScientificpeer-review

  77. Fabrication and characterization of high aspect ratio silicon plate springs with high out-of plane stiffness

    van Zeijl, HW., Paalvast, SL., Su, J., van Eijk, J. & Sarro, PM., 2007, the 14th International Conference on Solid-State Sensors, Actuators and Microsystems. IEEE (ed.). Lyon: Transducers & Eurosensors '07, p. 1605-1608 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  78. Improvement of wettability of silicon nitride in PECVD environment for copper electrodeposition in HAR vias

    Saadaoui, M., Wien, WHA., van Zeijl, HW., van Bogaard, A. & Sarro, PM., 2007, SAFE 2007 Semiconductor advances for future electornics. s.n. (ed.). Veldhoven, The Netherlands: STW, p. 543-546 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  79. Local Sealing of High Aspect Ratio Vias for Single Step Bottom-up Copper Electroplating of Through Wafer Interconnects

    Saadaoui, M., Wien, WHA., van Zeijl, HW., Schellevis, H., Laros, M. & Sarro, PM., 2007, Proc. IEEE Sensors 2007 Conference. Mizaikoff, B. & French, PJ. (eds.). Atlanta, Georgia: IEEE Society, p. 974-977 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  80. Oxide to oxide wafer bonding for three dimensional (3D) IC integration technologies

    Cannavo, M., van Zeijl, HW., Pandraud, G., Driel, JV., Alan, T. & Sarro, PM., 2007, SAFE 2007 Semiconductor advances for future electornics. s.n. (ed.). Veldhoven, The Netherlands: STW, p. 509-512 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  81. 2006
  82. A Noval dual-side fabrication method for Silicon Plate Springs with high ouf-of-plane stiffness

    van Zeijl, HW., Paalvast, SL., Sarro, PM. & van Eijk, J., 2006, Micromechanics Europe 2006. sn (ed.). Southampton: MMEW, p. 1-8 8 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  83. A novel dual-side fabrication method for silicon plate springs with high out-of plane stiffness

    van Zeijl, HW., Su, J., Paalvast, SL., Sarro, PM. & van Eijk, J., 2006, Proceedings of the 17th MME MicroMechanics Europe Workshop. s.n. (ed.). Southampton: H.Morgan Ed., p. 209-212 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  84. A novel dual-side fabrication method for silicon plate springs with high out-of-plane stiffness

    Su, J., van Zeijl, HW., Paalvast, SL., Sarro, PM. & van Eijk, J., 2006, Proceedings of SAFE 2006 Workshop on Semiconductor Advances for Future Electronics and Sensors. s.n. (ed.). Veldhoven: s.l., p. 394-397 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  85. Copper electroplating for 3D interconnects

    Saadaoui, M., Wien, WHA., van Zeijl, HW. & Sarro, PM., 2006, Proceedings of SAFE 2006 Workshop on Semiconductor Advances for Future Electronics and Sensors. s.n. (ed.). Veldhoven: s.l., p. 523-526 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  86. Low-Temperature Solid-Phase Epitaxy of Defect-Free Aluminum p+-doped Silicon for Nanoscale Device Applications

    Civale, Y., Nanver, LK., Hadley, P., van Zeijl, HW., Goudena, EJG. & Schellevis, H., 2006, Material Research Society Symposium Proceedings (940E, Warrendale, PA) Semiconductor Nanowires Symposium Proceedings. Schmidt, V. (ed.). San Francisco, USA: Material Research Society, p. -

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  87. a noval dual-side fabriation method for silicon plate springs with high out-of plane stifness

    Su, J., van Zeijl, HW., Paalvast, SL., Sarro, PM. & van Eijk, J., 2006, SAFE conferentie. SN (ed.). Veldhoven: SAFE, p. 394-397 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  88. 2005
  89. 3D align overlay verification using glass wafers

    Smeets, EMJ., Bijnen, FGC., Slabbekoorn, JHCM. & van Zeijl, HW., 2005, Proceedings of SPIE, MEMS/MOEMS Technologies and Applications II. Ma, Z., Jin, G. & Chen, X. (eds.). Bellingham (WA), USA: SPIE, p. 152-162 11 p. (Proceedings of SPIE- International Society for Optical Engineering; vol. 5641).

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  90. Base-contact proximity effects in bipolar transistors with nitride-spacer technology

    van Zeijl, HW. & Nanver, LK., 2005, Proceedings of the 35th European solid-state device research conference (ESSDERC). Cristoloveanu, S., Brillouët, M. & Skotnicki, T. (eds.). Piscataway: IEEE Society, p. 461-464 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  91. Bipolar transistors with self-aligned emitter-base metallization and back-wafer aligned collector contacts

    van Zeijl, HW., 2005, s.l.: s.n.. 185 p.

    Research output: ThesisDissertation (TU Delft)Scientific

  92. Front-to back-side overlay optimization after wafer bonding for 3D integration

    van Noort, WD., Marinier, L., Pellens, R., Sutedja, B., Dekker, R. & van Zeijl, HW., 2005, Proceedings of the 31st international conference of micro- and nano-engineering 2005. s.n. (ed.). Amsterdam: Elsevier, p. 1-4 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  93. LPCVD silicon nitride-on-silicon spacer technology

    van Zeijl, HW. & Nanver, LK., 2005, Electrochemical Society Proceedings. s.n. (ed.). Pennington (NJ), USA: The Electrochemical Society, Inc., p. 153-162 10 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  94. Lithographic alignment offset compensation for substrate transfer processes

    van Zeijl, HW., Nanver, LK., Bijnen, FGC., Goudena, EJG. & Slabbekoorn, JHCM., 2005, Proceedings of the STW annual workshop on semiconductor advances for future electronics and sensors (SAFE 2005). s.n. (ed.). Utrecht, The Netherlands: STW, p. 121-126 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  95. 2004
  96. A back-wafer contacted silicon-on-glass integrated bipolar process - Part I: the conflict electrical versus thermal isolation

    Nanver, LK., Nenadovic, N., d' Alessandro, V., Schellevis, H., van Zeijl, HW., Dekker, R., de Mooij, DB., Zieren, V. & Slotboom, JW., 2004, In : IEEE Transactions on Electron Devices. 51, 1, p. 42-50 9 p.

    Research output: Contribution to journalArticleScientificpeer-review

  97. Characterization of waferstepper and process related front- to backwafer overlay errors in bulk micro machining using electrical overlay test structures

    van Zeijl, HW., Bijnen, FGC. & Slabbekoorn, J., 2004, MEMS, MOEMS, and Micromachining. Urey, H. & El-Fatatry, A. (eds.). Bellingham: SPIE, p. 398-406 9 p. (Proceedings of SPIE- International Society for Optical Engineering; vol. 5455).

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  98. 2003
  99. Characterization of front- to backwafer bulk micromachining using electrical overlay test structures

    van Zeijl, HW. & Slabbekoorn, JHCM., 2003, In : Journal of Micromechanics and Microengineering. 13, 4, p. 108-112 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  100. Characterization of front-to backwafer alignment and bulk micromachining using electrical overlay test structures

    van Zeijl, HW. & Slabbekoorn, JHCM., 2003, Smart Sensors, Actuators, and MEMS. Chiao, JC., Varadan, VK. & Cané, C. (eds.). Bellingham, WA, USA: SPIE, p. 617-626 10 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  101. 2002
  102. Characterization of front to backwafer bulk micromachining using electrical overlay test structures

    van Zeijl, HW. & Slabbekoorn, J., 2002, MME 2002 The 13th Micromechanics Europe Workshop. s.l.: s.n., p. 343-346 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  103. Single step cryogenic SF6/O2 plasma etching process for the development of inertial devices

    Craciun, G., Yang, H., van Zeijl, HW., Pakula, L., Blauw, MA., van der Drift, EWJM. & French, PJ., 2002, Proceedings of SeSens 2002. Utrecht: STW Stichting voor de Technische Wetenschappen, p. 612-614 3 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  104. Waferstepper alignment for MEMS applications using diffraction gratings

    van Zeijl, HW., Simon, K., Slabbekoorn, JHCM., van Buel, W. & Gui, CQ., 2002, BioMEMS and Bionanotechnology: Symposium Proceedings of the Materials Research Society. Manginell, RP. & et al. (eds.). Warrendale, Penn. USA: Materials Research Society, p. 235-240 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  105. 2001
  106. Applied I-line lithography

    van Zeijl, HW., 2001, Delft: DIMES, TU Delft. 403 p.

    Research output: Book/ReportReportProfessional

  107. Electrical detection and simulation of stress in silicon nitride spacer technology

    van Zeijl, HW., Mijalkovic, S. & Nanver, LK., 2001, In : Journal of Materials Science: Materials in Electronics. 12, p. 339-341 3 p.

    Research output: Contribution to journalArticleScientificpeer-review

  108. Electrothermal characterization of NPNs fabricated in a backwafer contacted silicon-on glass integrated bipolar process

    Nenadovic, N., Nanver, LK., Schellevis, H., van Zeijl, HW. & Slotboom, JW., 2001, SAFE 2001: proceedings CD-ROM. Utrecht: STW Technology Foundation, p. 123-131 9 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  109. Epitaxy and device behaviour of collector-up SiGe HBTs with a partial p-type collector

    van Oever, LCM., Nanver, LK., Scholtes, TLM., van Zeijl, HW., van Noort, WD., Ren, Q. & Slotboom, JW., 2001, In : Solid-State Electronics. 45, p. 1899-1904 6 p.

    Research output: Contribution to journalArticleScientific

  110. Front-to back-wafer overlay accuracy in substrate transfer technologies

    van Zeijl, HW. & Slabbekoorn, JHCM., 2001, Semiconductor Technology (ISTC2001), Proceedings. New Jersey: The Electrochemical Society, p. 356-367 12 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  111. Integrated circuit fabrication technology

    van Zeijl, HW., 2001, Delft: DIMES, TU Delft. 433 p.

    Research output: Book/ReportReportProfessional

  112. Shallow trench insulation for SiGe Heterojunction bipolar transistors with 25% Ge epitaxial base

    van Zeijl, HW. & Nanver, LK., 2001, SAFE 2001: proceedings CD-ROM. Utrecht: STW Technology Foundation, p. 224-228 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  113. Thermal issues in a backwafer contacted silicon-on-glass integrated bipolar process

    Nenadovic, N., Nanver, LK., Schellevis, H., van Zeijl, HW. & Slotboom, JW., 2001, Proceedings. GE Ponchak (ed.). Piscataway: IEEE Society, p. 114-121 8 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  114. VLSI lithography

    van Zeijl, HW., 2001, Delft: DIMES, TU Delft. 481 p.

    Research output: Book/ReportReportProfessional

  115. Varying characteristics of bipolar transistors with emitter contact window width

    Fu, J., Mijalkovic, S., Eysenga, WJ., van Zeijl, HW. & Crans, W., 2001, SISPAD'01: proceedings. Wien-NewYork: Springer Verlag, p. 1-4 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  116. Varying characteristics of bipolar transistors with emitter contact window width

    Fu, J., Mijalkovic, S., Eysenga, WJ., van Zeijl, HW. & Crans, W., 2001, SISPAD 01: proceedings. D Tsoukalas & C Tsamis (eds.). Wien: Springer, p. 308-311 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  117. 2000
  118. A low-cost BiCMOS process with metal gates

    van Zeijl, HW. & Nanver, LK., 2000, Symposium proceedings. Vol. 611. LA Clevenger & ... [et Al] (eds.). Warrendale: Material Research Society, p. 1-6 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  119. Backwafer optical lithography and wafer distortion in substrate transfer technologies

    van Zeijl, HW., Slabbekoorn, JHCM., Nanver, LK., van Dijk, PWL., Berthold, A. & Machielsen, T., 2000, Proceedings of SPIE, vol. 4181. D Burnett, S Kimura & B Singh (eds.). Bellingham: International Society for Optical Engineering, p. 200-207 8 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

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