1. 2019
  2. A Wafer-Scale Process for the Monolithic Integration of CVD Graphene and CMOS Logic for Smart MEMS/NEMS Sensors

    Romijn, J., Vollebregt, S., van Zeijl, H. W. & Sarro, P. M., 2019, 2019 IEEE 32nd International Conference on Micro Electro Mechanical Systems (MEMS). Piscataway: IEEE, p. 260-263 4 p. 8870741

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  3. MEMS Enabled Fast Time-Resolved X-Ray Diffraction Characterization Platform for Copper Nanoparticle Sintering in Heterogeneous Integration Applications

    Zhang, B., Wei, J., Bottger, A. J., van Zeijl, H. W., Sarro, P. M. & Zhang, G., 2019, 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII): Proceedings. Danvers: IEEE, p. 1772-1775 4 p. 8808192

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  4. 2018
  5. Corrigendum to “Vaporizing liquid microthrusters with integrated heaters and temperature measurement” [Sens. Actuators A 265 (2017) 261–274](S0924424717306490)(10.1016/j.sna.2017.07.032)

    Silva, M. A. C., Guerrieri, D. C., van Zeijl, H., Cervone, A. & Gill, E., 1 Jul 2018, In : Sensors and Actuators, A: Physical. 277, 1 p.

    Research output: Contribution to journalComment/Letter to the editorScientificpeer-review

  6. Designing a 100 [aF/nm] capacitive transducer

    Middelburg, L. M., Mansouri, B. E., Poelma, R. H., Van Zeijl, H. W., Wei, J., Zhang, G. Q. & Van Driel, W. D., 2018, 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018. Piscataway, NJ: IEEE, p. 1-3 3 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  7. Non-linear bulk micromachined accelerometer for high sensitivity applications

    Middelburg, L. M., Mansouri, B. E., Poelma, R., Zhang, G. Q., van Zeijl, H. & Wei, J., 2018, 2018 IEEE SENSORS Proceedings. Roy, A. & Gianchandani, Y. (eds.). Piscataway, NJ: IEEE, Vol. 2018-October. p. 1-4 4 p. 8589630

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  8. Three dimensional thermoacoustic device composed of nanoporous material and the method to fabricate such a device

    Poelma, R., Zhang, G. Q., Yi, H. & van Zeijl, H., 2018, IPC No. H04R, Priority date 1 Aug 2016, Priority No. NL 2017268

    Research output: PatentOther research output

  9. 2017
  10. Fabrication and characterization of low pressure micro-resistojets with integrated heater and temperature measurement

    Guerrieri, D. C., Silva, M. A. C., Van Zeijl, H., Cervone, A. & Gill, E., 30 Oct 2017, In : Journal of Micromechanics and Microengineering. 27, 12, 11 p., 125005.

    Research output: Contribution to journalArticleScientificpeer-review

  11. Vaporizing Liquid Microthrusters with integrated heaters and temperature measurement

    Silva, M. A. C., Cordeiro Guerrieri, D., van Zeijl, H., Cervone, A. & Gill, E., 1 Oct 2017, In : Sensors and Actuators A: Physical: an international journal devoted to research and development of physical and chemical transducers. 265, p. 261-274 14 p.

    Research output: Contribution to journalArticleScientificpeer-review

  12. Effect of droplet shrinking on surface acoustic wave response in microfluidic applications

    Bui, T. H., Nguyen, V., Vollebregt, S., Morana, B., van Zeijl, H., Chu Duc, T. & Sarro, P. M., 2017, In : Applied Surface Science. 426, p. 253-261 9 p.

    Research output: Contribution to journalArticleScientificpeer-review

  13. High aspect ratio spiral resonators for process variation investigation and MEMS applications

    Middelburg, L. M., Mansouri, B. E., Van Zeijl, H. W., Zhang, G. Q. & Poelma, R. H., 2017, Proceedings of IEEE Sensors Conference 2017. Piscataway, NJ: IEEE, p. 1-3 3 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  14. Insitu 3D Wafer Level Monitor/Control Unit for LED Color-shifting

    Zhang, G. Q., Kolahdouz Esfahani, Z. & van Zeijl, H., 2017, IPC No. H05B; H01L, Priority date 9 Oct 2015, Priority No. NL 2015596

    Research output: PatentOther research output

  15. MEMS Based Micro-Propulsion System for CubeSats and PocketQubes

    Pallichadath, V., Silvestrini, S., Silva, M. A. C., Maxence (Student TU Delft), D., Guerrieri, D. C., Mestry, S., Pérez Soriano, T., Bacaro, M., van Zeijl, H., Zandbergen, B. & Cervone, A., 2017, Proceedings of the 68th International Astronautical Congress (IAC), Adelaide, Australia, 25-29 September 2017. IAF, 13 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  16. Monolithically Integrated Light Feedback Control Circuit for Blue/UV LED Smart Package

    Koladouz Esfahani, Z., Tohidian, M., Van Zeijl, H., Kolahdouz, M. & Zhang, G., 2017, In : IEEE Photonics Journal. 9, 2, 7870601.

    Research output: Contribution to journalArticleScientificpeer-review

  17. Smart Systems Integration in the era of Solid State Lighting

    van Driel, W., Zhang, G. Q., van Zeijl, H., Poelma, R., Koladouz Esfahani, Z., Ramachandrappa Venkatesh, M., Middelburg, L. & El Mansouri, B., 2017, Smart Systems Integration 2017: International Conference and Exhibition on Integration Issues of Miniaturized Systems. Otto, T. (ed.). Frankfurt: Mesago Messe Frankfurt GmbH, p. 160-165 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  18. 2016
  19. A transfer-free wafer-scale CVD graphene fabrication process for MEMS/NEMS sensors

    Vollebregt, S., Alfano, B., Ricciardella, F., Giesbers, A. J. M., Grachova, Y., van Zeijl, H., Polichetti, T. & Sarro, L., Jan 2016, 2016 IEEE 29th International Conference on Micro Electro Mechanical Systems (MEMS). Piscataway, NJ: IEEE, p. 17-20 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  20. 3D interconnect technology based on low temperature copper nanoparticle sintering

    Zhang, B., Carisey, Y., Damian, A., Poelma, R., Zhang, G. Q. & van Zeijl, H., 2016, Proceedings of the 17th International Conference on Electronic Packaging Technology (ICEPT). Bi, K., Liu, S. & Zhou, S. (eds.). IEEE, p. 1163-1167

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  21. Design, Fabrication, Testing and Modeling of a Vaporizing Liquid Micro-Propulsion System

    van Wees, T., Hanselaar, C., Jansen, E., Cervone, A., Zandbergen, B. & van Zeijl, H., 2016, Space propulsion 2016. 12 p. SPC2016_3124914

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  22. Effects of Nanostructure and Coating on the Mechanics of Carbon Nanotube Arrays

    Poelma, RH., Fan, X., Hu, Z-Y., Van Tendeloo, G., van Zeijl, H. & Zhang, GQ., 2016, In : Advanced Functional Materials. 26, 8, p. 1233-1242 10 p.

    Research output: Contribution to journalArticleScientificpeer-review

  23. Green micro-resistojet research at Delft University of Technology: the new frontiers of Cubesat propulsion

    Cervone, A., Zandbergen, BTC., Cordeiro Guerrieri, D., de Athayde Costa e Silva, M. & van Zeijl, H., 2016, In : CEAS Space Journal. 9, 1, p. 111-125 15 p.

    Research output: Contribution to journalArticleScientificpeer-review

  24. Metallic Nanoparticle Based Interconnect for Heterogeneous 3D Integration

    van Zeijl, H., Carisey, Y., Damian, A., Poelma, R., A, Z. & Zhang, G. Q., 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC). O'Conner, L. (ed.). Piscataway: IEEE, p. 217-224 8 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

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