1. 2019
  2. A Wafer-Scale Process for the Monolithic Integration of CVD Graphene and CMOS Logic for Smart MEMS/NEMS Sensors

    Romijn, J., Vollebregt, S., van Zeijl, H. W. & Sarro, P. M., 2019, 2019 IEEE 32nd International Conference on Micro Electro Mechanical Systems (MEMS). Piscataway: IEEE, p. 260-263 4 p. 8870741

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  3. MEMS Enabled Fast Time-Resolved X-Ray Diffraction Characterization Platform for Copper Nanoparticle Sintering in Heterogeneous Integration Applications

    Zhang, B., Wei, J., Bottger, A. J., van Zeijl, H. W., Sarro, P. M. & Zhang, G., 2019, 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII): Proceedings. Danvers: IEEE, p. 1772-1775 4 p. 8808192

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  4. 2018
  5. Corrigendum to “Vaporizing liquid microthrusters with integrated heaters and temperature measurement” [Sens. Actuators A 265 (2017) 261–274](S0924424717306490)(10.1016/j.sna.2017.07.032)

    Silva, M. A. C., Guerrieri, D. C., van Zeijl, H., Cervone, A. & Gill, E., 1 Jul 2018, In : Sensors and Actuators, A: Physical. 277, 1 p.

    Research output: Contribution to journalComment/Letter to the editorScientificpeer-review

  6. Designing a 100 [aF/nm] capacitive transducer

    Middelburg, L. M., Mansouri, B. E., Poelma, R. H., Van Zeijl, H. W., Wei, J., Zhang, G. Q. & Van Driel, W. D., 2018, 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018. Piscataway, NJ: IEEE, p. 1-3 3 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  7. Non-linear bulk micromachined accelerometer for high sensitivity applications

    Middelburg, L. M., Mansouri, B. E., Poelma, R., Zhang, G. Q., van Zeijl, H. & Wei, J., 2018, 2018 IEEE SENSORS Proceedings. Roy, A. & Gianchandani, Y. (eds.). Piscataway, NJ: IEEE, Vol. 2018-October. p. 1-4 4 p. 8589630

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  8. Three dimensional thermoacoustic device composed of nanoporous material and the method to fabricate such a device

    Poelma, R., Zhang, G. Q., Yi, H. & van Zeijl, H., 2018, IPC No. H04R, Priority date 1 Aug 2016, Priority No. NL 2017268

    Research output: PatentOther research output

  9. 2017
  10. Fabrication and characterization of low pressure micro-resistojets with integrated heater and temperature measurement

    Guerrieri, D. C., Silva, M. A. C., Van Zeijl, H., Cervone, A. & Gill, E., 30 Oct 2017, In : Journal of Micromechanics and Microengineering. 27, 12, 11 p., 125005.

    Research output: Contribution to journalArticleScientificpeer-review

  11. Vaporizing Liquid Microthrusters with integrated heaters and temperature measurement

    Silva, M. A. C., Cordeiro Guerrieri, D., van Zeijl, H., Cervone, A. & Gill, E., 1 Oct 2017, In : Sensors and Actuators A: Physical: an international journal devoted to research and development of physical and chemical transducers. 265, p. 261-274 14 p.

    Research output: Contribution to journalArticleScientificpeer-review

  12. Effect of droplet shrinking on surface acoustic wave response in microfluidic applications

    Bui, T. H., Nguyen, V., Vollebregt, S., Morana, B., van Zeijl, H., Chu Duc, T. & Sarro, P. M., 2017, In : Applied Surface Science. 426, p. 253-261 9 p.

    Research output: Contribution to journalArticleScientificpeer-review

  13. High aspect ratio spiral resonators for process variation investigation and MEMS applications

    Middelburg, L. M., Mansouri, B. E., Van Zeijl, H. W., Zhang, G. Q. & Poelma, R. H., 2017, Proceedings of IEEE Sensors Conference 2017. Piscataway, NJ: IEEE, p. 1-3 3 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  14. Insitu 3D Wafer Level Monitor/Control Unit for LED Color-shifting

    Zhang, G. Q., Kolahdouz Esfahani, Z. & van Zeijl, H., 2017, IPC No. H05B; H01L, Priority date 9 Oct 2015, Priority No. NL 2015596

    Research output: PatentOther research output

  15. MEMS Based Micro-Propulsion System for CubeSats and PocketQubes

    Pallichadath, V., Silvestrini, S., Silva, M. A. C., Maxence (Student TU Delft), D., Guerrieri, D. C., Mestry, S., Pérez Soriano, T., Bacaro, M., van Zeijl, H., Zandbergen, B. & Cervone, A., 2017, Proceedings of the 68th International Astronautical Congress (IAC), Adelaide, Australia, 25-29 September 2017. IAF, 13 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  16. Monolithically Integrated Light Feedback Control Circuit for Blue/UV LED Smart Package

    Koladouz Esfahani, Z., Tohidian, M., Van Zeijl, H., Kolahdouz, M. & Zhang, G., 2017, In : IEEE Photonics Journal. 9, 2, 7870601.

    Research output: Contribution to journalArticleScientificpeer-review

  17. Smart Systems Integration in the era of Solid State Lighting

    van Driel, W., Zhang, G. Q., van Zeijl, H., Poelma, R., Koladouz Esfahani, Z., Ramachandrappa Venkatesh, M., Middelburg, L. & El Mansouri, B., 2017, Smart Systems Integration 2017: International Conference and Exhibition on Integration Issues of Miniaturized Systems. Otto, T. (ed.). Frankfurt: Mesago Messe Frankfurt GmbH, p. 160-165 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  18. 2016
  19. A transfer-free wafer-scale CVD graphene fabrication process for MEMS/NEMS sensors

    Vollebregt, S., Alfano, B., Ricciardella, F., Giesbers, A. J. M., Grachova, Y., van Zeijl, H., Polichetti, T. & Sarro, L., Jan 2016, 2016 IEEE 29th International Conference on Micro Electro Mechanical Systems (MEMS). Piscataway, NJ: IEEE, p. 17-20 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  20. 3D interconnect technology based on low temperature copper nanoparticle sintering

    Zhang, B., Carisey, Y., Damian, A., Poelma, R., Zhang, G. Q. & van Zeijl, H., 2016, Proceedings of the 17th International Conference on Electronic Packaging Technology (ICEPT). Bi, K., Liu, S. & Zhou, S. (eds.). IEEE, p. 1163-1167

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  21. Design, Fabrication, Testing and Modeling of a Vaporizing Liquid Micro-Propulsion System

    van Wees, T., Hanselaar, C., Jansen, E., Cervone, A., Zandbergen, B. & van Zeijl, H., 2016, Space propulsion 2016. 12 p. SPC2016_3124914

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  22. Effects of Nanostructure and Coating on the Mechanics of Carbon Nanotube Arrays

    Poelma, RH., Fan, X., Hu, Z-Y., Van Tendeloo, G., van Zeijl, H. & Zhang, GQ., 2016, In : Advanced Functional Materials. 26, 8, p. 1233-1242 10 p.

    Research output: Contribution to journalArticleScientificpeer-review

  23. Green micro-resistojet research at Delft University of Technology: the new frontiers of Cubesat propulsion

    Cervone, A., Zandbergen, BTC., Cordeiro Guerrieri, D., de Athayde Costa e Silva, M. & van Zeijl, H., 2016, In : CEAS Space Journal. 9, 1, p. 111-125 15 p.

    Research output: Contribution to journalArticleScientificpeer-review

  24. Metallic Nanoparticle Based Interconnect for Heterogeneous 3D Integration

    van Zeijl, H., Carisey, Y., Damian, A., Poelma, R., A, Z. & Zhang, G. Q., 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC). O'Conner, L. (ed.). Piscataway: IEEE, p. 217-224 8 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  25. Output blue light evaluation for phosphor based smart white LED wafer level packages

    Kolahdouz Esfahani, Z., Rostamian, A., Kolahdouz, M., Ma, T., van Zeijl, H. & Zhang, K., 2016, In : Optics Express. 24, 4, p. 3216-3229 14 p.

    Research output: Contribution to journalArticleScientificpeer-review

  26. Tailoring material properties for 3D microfabrication: In-situ experimentation and multi-scale modelling

    Poelma, R., Fan, X. J., Schlangen, E., van Zeijl, H. & Zhang, G. Q., 2016, 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE, p. 1-6 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  27. 2015
  28. Design and fabrication of a foldable 3D silicon based package for solid state lighting applications

    Sokolovskij, R., Liu, P., van Zeijl, HW., Mimoun, BAZ. & Zhang, GQ., 2015, In : Journal of Micromechanics and Microengineering. 25, 5, p. 055017-1-055017-10

    Research output: Contribution to journalArticleScientificpeer-review

  29. Effects of silicon via profile on passivation and metallization in TSV interposers for 2.5D integration

    Lin, P., Zhang, GQ., van Zeijl, HW., Lian, BH., Wang, Y. & Yao, QB., 2015, In : Microelectronic Engineering. 134, p. 22-26 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  30. Review on retrofit G4 LED lamps: Technology, challenges, and future trends

    Liu, P., van Zeijl, HW., Venkatesh, MR., Sokolovskij, R., Kurt, R. & Zhang, GQ., 2015, Proceedings - 65th Electronic Components and Technology Conference. Keser, B. & Braunisch, H. (eds.). Piscataway, NJ, USA: IEEE Society, p. 2277-2282 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  31. 2014
  32. A polymer based miniature loop heat pipe with silicon substrate and temperature sensors for high brightness light-emitting diodes

    Ye, H., Sokolovskij, R., van Zeijl, HW., Gielen, AWJ. & Zhang, GQ., 2014, In : Microelectronics Reliability. 54, 6-7, p. 1355-1362 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  33. Blue selective photodiodes for optical feedback in LED wafer level packages

    Kolahdouz Esfahani, Z., Ma, T., van Zeijl, HW., Zhang, GQ., Rostamian, A. & Kolahdouz, M., 2014, Proceedings of the 44th European Solid-State Device Research Conference. Bez, R., Pavan, P. & Meneghesso, G. (eds.). Piscataway, NJ, USA: IEEE Society, p. 174-177 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  34. Electrical-thermal-luminous-chromatic model of phosphor-converted white light-emitting diodes

    Ye, H., Koh, SW., Yuan, CA., van Zeijl, HW., Gielen, AWJ., Lee, SWR. & Zhang, GQ., 2014, In : Applied Thermal Engineering. 63, 2, p. 588-597 10 p.

    Research output: Contribution to journalArticleScientificpeer-review

  35. Fabrication and application of temperature triggered MEMS switch for active cooling control in solid state lighting system

    Ye, H., Wei, J., van Zeijl, HW., Sarro, PM. & Zhang, GQ., 2014, In : Microelectronics Reliability. 54, 6-7, p. 1338-1343 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

  36. High aspect ratio lithography for litho-defined wire bonding

    Esfahani, ZK., van Zeijl, HW. & Zhang, GQ., 2014, Proceedings - 64th Electronic Components and Technology Conference. Sauter, W. & Huffman, A. (eds.). Piscataway, NJ, USA: IEEE Society, p. 1556-1561 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  37. Modeling and simulation of monolithic integration of rectifiers for solid state lighting applications

    Ramachandrappa Venkatesh, M., Liu, P., van Zeijl, HW. & Zhang, GQ., 2014, Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. Piscataway, NJ, USA: IEEE Society, p. 1-6 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  38. Self-healing thermally conductive adhesives

    Lafont, UL., Moreno Belle, C., van Zeijl, HW. & van der Zwaag, S., 2014, In : Journal of Intelligent Material Systems and Structures. 25, 1, p. 67-74 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  39. Tailoring the Mechanical Properties of High-Aspect-Ratio Carbon Nanotube Arrays using Amorphous Silicon Carbide Coatings

    Poelma, R. H., Morana, B., Vollebregt, S., Schlangen, E., van Zeijl, HW., Fan, X. & Zhang, GQ., 2014, In : Advanced Functional Materials. 24, 36, p. 5737-5744 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  40. Through-Polymer-Via for 3D heterogeneous integration and packaging, and method of manufacture thereof

    Poelma, RH., Zhang, GQ. & van Zeijl, HW., 2014, Patent No. 2010077, Priority date 3 Jul 2014

    Research output: PatentOther research output

  41. 2013
  42. Advanced LED package with temperature sensors and microfluidic cooling

    Ye, H., van Zeijl, HW., Sokolovskij, R., Gielen, AWJ. & Zhang, GQ., 2013, Proceedings 63rd Electronic Components and Technology Conference (ECTC 2013). Sauter, W. (ed.). Piscataway, NJ, USA: IEEE Society, p. 1920-1925 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  43. Fully back-end TSV process by Cu electro-less plating for 3D smart sensor systems

    Santagata, F., Farriciello, C., Fiorentino, G., van Zeijl, HW., Silvestri, C., Zhang, GQ. & Sarro, PM., 2013, In : Journal of Micromechanics and Microengineering. 23, 5, p. 1-10 10 p.

    Research output: Contribution to journalArticleScientificpeer-review

  44. Geometric optimization of high performance interconnect of rigid/flexible/rigid substrate for wafer level packaging in solid state lighting applications by numerical simulations

    Liu, P., Zhang, J., Sokolovskij, R., van Zeijl, HW., Mimoun, BAZ. & Zhang, GQ., 2013, Proceedings of the 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2013). Zhang, GQ. (ed.). Piscataway: IEEE Society, p. 1-6 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  45. Low temperature hybrid wafer bonding for 3D integration

    Damian, AA., Poelma, RH., van Zeijl, HW. & Zhang, GQ., 2013, Proceedings of the 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2013). Zhang, GQ. (ed.). Piscataway, NJ: IEEE Society, p. 1-5 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  46. Monitoring the restoration of interfacial contact for self healing thermal interface materials for led and microelectronic applications

    Lafont, UL., van Zeijl, HW. & van der Zwaag, S., 2013, Proceedings 4th International Conference on Self-Healing Materials. de Belie, N., van der Zwaag, S., Gruyaert, E., van Tittelboom, K. & Debbaut, B. (eds.). Ghent, Belgium: Magnel Laboratory for Concrete Research, p. 164-167 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  47. Multi-LED package design, fabrication and thermal analysis

    Poelma, RH., Tarashioon, S., van Zeijl, HW., Goldbach, S., Zijl, JLJ. & Zhang, GQ., 2013, In : Journal of Semiconductors. 34, 5, p. 1-5 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  48. Multiple healing in multi-functional polymer composites

    Lafont, UL., van Zeijl, HW. & van der Zwaag, S., 2013, Proceedings 4th International Conference on Self-Healing Materials. de Belie, N., van der Zwaag, S., Gruyaert, E., van Tittelboom, K. & Debbaut, B. (eds.). Ghent, Belgium: Magnel Laborator for Concrete Research, p. 467-470 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  49. On the use of high precision electrical resistance measurement for analyzing the damage development during accelerated test of Pb-free solder interconnects

    Zhang, J., van der Zwaag, S., van Zeijl, HW. & Zhang, GQ., 2013, Proceedings 63rd Electronic Components and Technology Conference (ECTC 2013). Sauter, W. (ed.). Piscataway: IEEE Society, p. 192-199 8 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  50. Thermal transient effect and improved junction temperature measurement method in high-voltage light-emitting diodes

    Ye, H., Chen, X., van Zeijl, HW., Gielen, AWJ. & Zhang, GQ., 2013, In : IEEE Electron Device Letters. 34, 9, p. 1172-1174 3 p.

    Research output: Contribution to journalArticleScientificpeer-review

  51. Titanium nitride (TiN) as a gate material in BiCMOS devices for biomedical implants

    Lawand, NS., van Zeijl, HW., French, PJ., Briaire, JJ. & Frijns, JHM., 2013, Proceedings IEEE Sensors 2013. Brown, E., Gianchandani, Y. & Trew, R. (eds.). Piscataway, NJ, USA: IEEE Society, p. 1-4 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  52. Two-phase cooling of light emitting diode for higher light output and increased efficiency

    Ye, H., Mihailovic, M., Wong, KY., van Zeijl, HW., Gielen, AWJ., Zhang, GQ. & Sarro, PM., 2013, In : Applied Thermal Engineering. 52, 2, p. 353-359 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  53. 2012
  54. Dynamic thermal simulation of high brightness LEDs with unsteady driver power output

    Ye, H., Koh, SW., Wei, J., van Zeijl, HW. & Zhang, GQ., 2012, Proceedings 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. De Saint Leger et al, O. (ed.). Piscataway, NJ, USA: IEEE Society, p. 451-455 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  55. High accuracy dual side overlay with wet anisotropic etching for HAR MEMS

    van Zeijl, HW., Best, K. & Sarro, PM., 2012, Technical Proceedings of the 2012 NSTI Nanotechnology Conference and Expo, Volume 2. Gaura et al, EI. (ed.). Austin, TX, USA: NSTI, p. 180-183 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  56. Increasing the reliability of solid state lighting systems via self healing approaches: a review

    Lafont, UL., van Zeijl, HW. & van der Zwaag, S., 2012, In : Microelectronics Reliability. 52, 1, p. 71-89 19 p.

    Research output: Contribution to journalArticleScientificpeer-review

  57. Influence of cross-linkers on the cohesive and adhesive self-healing ability of polysulfide-based thermosets

    Lafont, UL., van Zeijl, HW. & van der Zwaag, S., 2012, In : ACS Applied Materials and Interfaces. 4, 11, p. 6280-6288 9 p.

    Research output: Contribution to journalArticleScientificpeer-review

  58. Materials with self-healing cohesive and adhesive properties

    Lafont, UL., Vega Vega, JM., van Zeijl, HW., Garcia Espallargas, SJ. & van der Zwaag, S., 2012, Proceedings of the 15th DYFP Conference. McKenna, GB. (ed.). Eindhoven: Eindhoven University of Technology, p. 373-376 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

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