Research output

  1. Hybrid wafer-level packaging for RF-MEMS and optoelectronic applications

    Research output: ThesisDissertation (TU Delft)Scientific

  2. Process technology of high-aspect-ratio silicon beams for stretchable silicon electronics

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  3. Simultaneous through-silicon via and large cavity formation using deep reactive ion etching and aluminum etch-stop layer

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

View all (23) »

ID: 215833