Research output

  1. The performance of sintered nanocopper interconnections for high temperature device

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  2. Reliability Optimization of Gold-Tin Eutectic Die Attach Layer in HEMT Package

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  3. Solution-Processed Poly-Si TFTs at Paper Compatible Temperatures

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

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Activities

  1. Sige dots as stressor material for strained si devices

    Activity: Talk or presentationTalk or presentation at a workshop, seminar, course or other meeting

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ID: 117132