Research output

  1. Superconducting High-Aspect Ratio Through-Silicon Vias with DC-Sputtered Al for Quantum 3D integration

    Research output: Contribution to journalArticleScientificpeer-review

  2. Fabrication of Al-based superconducting high-aspect ratio TSVs for quantum 3D integration

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

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ID: 104241