1. 2019
  2. A Chip Integrity Monitor for Evaluating Long-term Encapsulation Performance Within Active Flexible Implants

    Akgün, Ö. C., Nanbakhsh, K., Giagka, V. & Serdijn, W., 18 Oct 2019. 5 p.

    Research output: Contribution to conferenceOtherOther research output

  3. Effect of Signals on the Encapsulation Performance of Parylene Coated Platinum Tracks for Active Medical Implants

    Nanbakhsh, K., Kluba, M., Pahl, B., Bourgeois, F., Dekker, R., Serdijn, W. & Giagka, V., 26 Jul 2019, 2019 41st Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC). Danvers: IEEE, p. 3840-3844 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  4. Polymer-Encapsulated Single-Chip Implants for Bioelectronic Medicine

    Nanbakhsh, K., Serdijn, W. A. & Giagka, V., 2019, p. 1-1. 1 p.

    Research output: Contribution to conferenceAbstractScientific

  5. 2017
  6. A Wireless Sensor for Monitoring Encapsulation Performance in Non-hermetic Implants

    Nanbakhsh, K., Giagka, V. & Serdijn, W., 2017, p. 1-1. 1 p.

    Research output: Contribution to conferenceAbstractScientific

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