1. 2001
  2. Time dependent behavior of molding compound in packaging

    Wisse, G., Jansen, KMB., Ernst, LJ., Kiasat, MS. & et al, ., 2001, 13th European microelectronics and packaging conference, May 30-31. Reston: International Microelectronics and Packaging Society, p. 389-392 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  3. Viscosity of surfactant stabilized emulsions

    Jansen, KMB., Agterof, WGM. & Mellema, J., 2001, In : Journal of Rheology. 45, 6, p. 1359-1371 13 p.

    Research output: Contribution to journalArticleScientific

  4. 2002
  5. On the effect of cure-residual stress on flip chip failure prediction

    Ernst, LJ., Yang, D., Jansen, KMB., van t Hof, C., Zhang, GQ. & van Driel, WD., 2002, Proceedings of 4th electronics packaging technology conference (EPTC 2002). Lee, C., Chuan, TK. & Iyer, MK. (eds.). Piscataway: IEEE Society, p. 398-403 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  6. The state-of-the-art of thermo-mechanical characterisation of thin polymer films

    Pelletier, C., Bressers, HJL., Zhang, GQ., Jansen, KMB., Gonda, V. & Ernst, LJ., 2002, 3rd international conference on benefiting from thermal and mechanical simulation in (micro)electronics. Ernst, LJ., Zhang, GQ., Dudek, R. & de Saint Leger, O. (eds.). Piscataway: The Institute of Electrical and Electronics Engineers, p. 293-300 8 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  7. 2003
  8. Micromechanical modeling of stress evolution induced during cure in a particle-filled electronic packaging polymer

    Yang, D., Jansen, KMB., Wang, L., Ernst, LJ., Zhang, GQ. & Bressers, HJL., 2003, Thermal & mechanical simulation and experiments in microelectronics and microsystems. Ernst, LJ., Zhang, GQ., Dudek, R. & de Saint Leger, O. (eds.). Piscataway: IEEE Society, p. 57-62 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  9. Progressive failure modelling of notched composite laminates and its experimental verification

    Liu, CJ., Jansen, KMB., Ernst, LJ. & Marissen, R., 2003, ICCM-14. s.n. (ed.). Dearborn: Society of Manufacturing engineers, p. 1-12 12 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  10. Recent developments in thermal mechanical modeling of the curing process of filled thermoset polymers

    Ernst, LJ., Jansen, KMB., van t Hof, C., Yang, DG., Zhang, GQ. & Bressers, HJL., 2003, Proceedings of the 10th international conference on mechanics and technology of composite materials. Naidenov, V., Stoyanov, V. & Rostovsky, I. (eds.). s.l.: s.n., p. 38-44 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  11. Solders fatigue prediction using interfacial boundary volume criterion

    Ernst, LJ., Zhang, GQ., Jansen, KMB. & Bressers, HJL., 2003, In : Journal of Electronic Packaging. 125, 4, p. 582-588 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  12. Time- and tempearature-dependent thermo-mechanical modeling of a packaging molding compound and its effect on packaging process stresses

    Ernst, LJ., Zhang, GQ., Jansen, KMB. & Bressers, HJL., 2003, In : Journal of Electronic Packaging. 125, 4, p. 539-548 10 p.

    Research output: Contribution to journalArticleScientificpeer-review

  13. Warpage-based optimization of the curing profile for electronic packaging polymers

    Yang, DG., Jansen, KMB., Li, QY., Liang, JS., Ernst, LJ. & Zhang, GQ., 2003, ICEPT 2003. Bi, K., Barnwell, PG. & Wang, J. (eds.). Piscataway: IEEE Society, p. 345-350 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

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