1. Article › Scientific › Peer-reviewed
  2. Warpage estimation of a multilayer package including cure shrinkage effects

    Jansen, KMB. & Ozturk, B., 2013, In : IEEE Transactions on Components, Packaging and Manufacturing Technology. 3, 3, p. 459-466 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  3. Water Sorption and Diffusion in (Reduced) Graphene Oxide-Alginate Biopolymer Nanocomposites

    Vilcinskas, K., Zlopasa, J., Jansen, K. M. B., Mulder, F. M., Picken, S. J. & Koper, G. J. M., 2016, In : Macromolecular Materials and Engineering. 301, 9, p. 1049-1063 15 p.

    Research output: Contribution to journalArticleScientificpeer-review

  4. Article › Professional
  5. Material complexity: 3D printing perspectives

    Doubrovski, EL., Jansen, KMB. & Geraedts, JMP., 2013, In : Inside materials (Nieuwsbrief Delft Centre for Materials). 2013, November, p. 1-2 2 p.

    Research output: Contribution to journalArticleProfessional

  6. Chapter › Scientific › Not peer-reviewed
  7. Establishment of the mesoscale parameters for separation: A nonequilibrium molecular dynamics model

    Wong, CKY., Leung, SYY., Poelma, RH., Jansen, KMB., Yuan, CCA., van Driel, WD. & Zhang, GQ., 2015, Molecular modeling and multiscaling issues for electronic material applications - Volume 2. Wymyslowski, A., Iwamoto, N., Yuen, M. & Fan, H. (eds.). Cham, Switzerland: Springer, p. 133-148 194 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeChapterScientific

  8. Chapter › Scientific › Peer-reviewed
  9. Polymer Materials Characterization, Modeling and Application

    Ernst, LJ., Jansen, KMB., Yang, D., van t Hof, C., Bressers, HJL., Janssen, JHJ. & Zhang, GQ., 2007, Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging. Suhir, E., Lee, YC. & Wong, CP. (eds.). New York, NY, USA: Springer, p. 1-63 701 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeChapterScientificpeer-review

  10. Conference contribution › Scientific › Not peer-reviewed
  11. A Characterization Method for Viscoelastic Bulk Modulus of Molding Compounds

    Saraswat, MK., Jansen, KMB., Patel, MD., Ernst, LJ., Bohm, C., Kessler, A., Preu, H. & Stecher, M., 2008, Proceedings of the 9th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P. & Saint Leger, O. de (eds.). Freiburg-im-Breisgau: EuroSimE, p. 463-466 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

  12. A New Method to Measure the Moisture Expansion in Plastic Packaging Materials

    Ma, X., Jansen, KMB., Ernst, LJ., van Driel, WD., van der Sluis, O. & Zhang, GQ., 2009, Proceedings of the 2009 Electronic Components and Technology Conference, ECTC2009, May 26-29, 2009, San Diego, CA, USA. Banda, R., Trewhella, J. & Bezuk, S. (eds.). IEEE Society, p. 1271-1276 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

  13. Advanced Viscoelastic Material Model for Predicting Warpage of a QFN Panel

    de Vreugd, J., Jansen, KMB., Xiao, A., Ernst, LJ., Bohm, C., Kessler, A., Preu, H. & Stecher, M., 2008, 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, USA. Wipiejewski, T. & Trewhella, J. (eds.). Orlando, FL, USA: IEEE Society, p. 1635-1640 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

  14. Characterization and modeling of molding compound properties during cure

    Jansen, KMB., Qian, C., Ernst, LJ., Bohm, C., Kessler, A., Preu, H. & Stecher, M., 2008, Proceedings of the 9th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P. & Saint Leger, O. de (eds.). Freiburg-im-Breisgau: EuroSimE, p. 610-613 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

  15. Comprehensive Material Characterization of Organic Packaging Materials

    Boehme, B., Jansen, KMB., Rzepka, S. & Wolter, K-J., 2009, Proceedings of the 10th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2009, April 27-29, 2009, Delft, The Netherlands. Ernst, LJ, Zhang, GQ, Driel, WD van, Rodgers, P, Bailey, C & Saint Leger, O de (eds.). Delft, The Netherlands: EuroSimE, p. 289-296 8 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

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