1. Article › Scientific › Not peer-reviewed
  2. Viscosity of surfactant stabilized emulsions

    Jansen, KMB., Agterof, WGM. & Mellema, J., 2001, In : Journal of Rheology. 45, 6, p. 1359-1371 13 p.

    Research output: Contribution to journalArticleScientific

  3. Article › Scientific › Peer-reviewed
  4. 3D Printed Actuators: Reversibility, Relaxation, and Ratcheting

    Zhao, S. C., Maas, M., Jansen, K. & van Hecke, M., 2019, In : Advanced Functional Materials. 29, 51, 8 p., 1905545.

    Research output: Contribution to journalArticleScientificpeer-review

  5. A fast moisture sensitivity level qualification method

    Ma, X., Jansen, KMB., Zhang, GQ., van Driel, WD., van der Sluis, O., Ernst, LJ., Regards, C., Gautier, C. & Frémont, H., 2010, In : Microelectronics Reliability. 50, 2010, p. 1654-1660 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  6. A new procedure for thermo-viscoelastic modelling of composites with general orthotropy and geometry

    Abouhamzeh, M., Sinke, J., Jansen, KMB. & Benedictus, R., 2015, In : Composite Structures. 133, p. 871-877 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  7. A novel 12-lead electrocardiographic system for home use: Development and usability testing

    Steijlen, A., Jansen, K., Albayrak, A., Verschure, D. O. & Van Wijk, D. F., 2018, In : JMIR mHealth and uHealth. 6, 7, p. 1-14 14 p., e10126.

    Research output: Contribution to journalArticleScientificpeer-review

  8. An inertial measurement unit based method to estimate hip and knee joint kinematics in team sport athletes on the field

    Bastiaansen, B. J. C., Wilmes, E., Brink, M. S., de Ruiter, C. J., Savelsbergh, G. J. P., Steijlen, A., Jansen, K. M. B., van der Helm, F. C. T., Goedhart, E. A., van der Laan, D., Vegter, R. J. K. & Lemmink, K. A. P. M., 2020, In : Journal of Visualized Experiments. 159, p. 1-8 e60857.

    Research output: Contribution to journalArticleScientificpeer-review

  9. Analytical estimate for curing-induced stress and warpage in coating layers

    Jansen, KMB., de Vreugd, J. & Ernst, LJ., 2012, In : Journal of Applied Polymer Science. 126, 5, p. 1623-1630 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  10. Atmospheric plasma modification of polyimide sheet for joining to titanium with high temperature adhesive

    Akram, M., Jansen, KMB., Ernst, LJ. & Bhowmik, S., 2016, In : International Journal of Adhesion and Adhesives. 65, p. 63-69

    Research output: Contribution to journalArticleScientificpeer-review

  11. Atmospheric pressure plasma surface modification of titanium for high temperature adhesive bonding

    Akram, M., Jansen, KMB., Ernst, LJ. & Bhowmik, S., 2011, In : International Journal of Adhesion and Adhesives. 31, p. 598-604 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  12. Characterization and modeling the thermo-mechanical cure-dependent properties of epoxy molding compound

    Sadeghinia, M., Jansen, KMB. & Ernst, LJ., 2011, In : International Journal of Adhesion and Adhesives. 32, p. 82-88 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  13. Characterization of moisture properties of polymers for IC packaging

    Ma, X., Jansen, KMB., Ernst, LJ., van Driel, WD., van der Sluis, O. & Zhang, GQ., 2007, In : Microelectronics Reliability. 47, p. 1685-1689 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  14. Characterization of physical and viscoelastic properties of polymer films for coating applications under different temperature of drying and storage

    Perfetti, G., Jansen, KMB., wildeboer, W. J., Hee, P. V. & Meesters, GMH., 2009, In : International Journal of Pharmaceutics. 384, p. 109-119 11 p.

    Research output: Contribution to journalArticleScientificpeer-review

  15. Characterization of the viscoelastic properties of an epoxy molding compound during cure

    Sadeghinia, M., Jansen, KMB. & Ernst, LJ., 2012, In : Microelectronics Reliability. 52, 8, p. 1711-1718 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  16. Closed form expression for residual stresses and warpage during cure of composite laminates

    Abouhamzeh, M., Sinke, J., Jansen, KMB. & Benedictus, R., 2015, In : Composite Structures. 133, 01, p. 902-910 9 p.

    Research output: Contribution to journalArticleScientificpeer-review

  17. Color shift investigations for LED secondary optical designs: Comparison between BPA-PC and PMMA

    Lu, G., Yazdan Mehr, M., van Driel, WD., Fan, X., Fan, J., Jansen, KMB. & Zhang, GQ., 2015, In : Optical Materials. 45, p. 37-41 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  18. Colour shift and mechanism investigation on the PMMA diffuser used in LED-based luminaires

    Lu, G., van Driel, WD., Fan, X., Yazdan Mehr, M., Fan, J., Qian, C., Jansen, KMB. & Zhang, GQ., 2016, In : Optical Materials. 54, p. 282-287 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

  19. Composition dependent properties of graphene (oxide)-alginate biopolymer nanocomposites

    Vilcinskas, K., Jansen, K. M. B., Mulder, F. M., Picken, S. J. & Koper, G. J. M., 2016, In : Polymer Composites. 39 (2018), S1, p. E236-E249

    Research output: Contribution to journalArticleScientificpeer-review

  20. Correlation between chemistry of polymer building blocks and microelectronics reliability

    Bressers, HJL., van Driel, WD., Jansen, KMB., Ernst, LJ. & Zhang, GQ., 2007, In : Microelectronics Reliability. 47, p. 290-294 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  21. Creep behaviour of FM906 glass-fibre epoxy as used in heated fibre metal laminates

    Hagenbeek, M., Dias, M. M., Sinke, J. & Jansen, K., Nov 2019, In : Journal of Composite Materials. 53, 26-27, p. 3829-3840 12 p.

    Research output: Contribution to journalArticleScientificpeer-review

  22. Degradation of microcellular PET reflective materials used in LED-based products

    Lu, G., van Driel, WD., Fan, X., Yazdan Mehr, M., Fan, J., Jansen, KMB. & Zhang, GQ., 2015, In : Optical Materials. 49, November, p. 79-84 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

  23. Design and characterization of variable stiffness structural joints

    Wang, Q., Senatore, G., Jansen, K., Habraken, A. & Teuffel, P., 2020, In : Materials and Design. 187, 108353.

    Research output: Contribution to journalArticleScientificpeer-review

  24. Effecs of molding pressure on the warpage and the viscoelasticities of HVQFN packages

    Gui, DY., Ernst, LJ., Jansen, KMB., Yang, D., Goumans, L., Bressers, HJL. & Janssen, JHJ., 2008, In : Journal of Applied Polymer Science. 109, 3, p. 2016-2022 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  25. Effect of atmospheric pressure plasma modification on polyimide and adhesive joining with titanium

    Akram, M., Jansen, KMB., Ernst, LJ., Bhowmik, S., Ajeesh, G., Ahmed, S. & Chakraborty, D., 2015, In : Metallurgical and Materials Transactions A - Physical Metallurgy and Materials Science. 46, 10, p. 4680-4687 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  26. Effect of fiber-matrix adhesion on the creep behavior of CF/PPS composites: Temperature and physical aging characterization

    Motta Dias, MH., Jansen, KMB., Luinge, JW., Bersee, HEN. & Benedictus, R., 2016, In : Mechanics of Time Dependent Materials: an international journal devoted to the time-dependent behaviour of materials and structures. 10, 2, p. 245-262 18 p.

    Research output: Contribution to journalArticleScientificpeer-review

  27. Effect of filler concentration of rubbery shear and bulk modulus of molding compounds

    Yang, D., Jansen, KMB., Ernst, LJ., Zhang, GQ., Bressers, HJL. & Janssen, JHJ., 2007, In : Microelectronics Reliability. 47, p. 233-239 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  28. Effect of temperature and humidity on moisture diffusion in an epoxy moulding compound material

    Jansen, K. M. B., Zhang, M. F., Ernst, L. J., Vu, D. K. & Weiss, L., 2020, In : Microelectronics Reliability. 107, 6 p., 113596.

    Research output: Contribution to journalArticleScientificpeer-review

  29. Effect of the epoxy resin chemistry on the viscoelasticity of its cured product

    Nakka, JS., Jansen, KMB., Ernst, LJ. & Jager, WF., 2008, In : Journal of Applied Polymer Science. 108, p. 1414-1420 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  30. Effects of surface modification on optical properties and thermal stability of K2SiF6:Mn4+ red phosphors by deposition of an ultrathin Al2O3 layer using gas-phase deposition in a fluidized bed reactor

    Ten Kate, O. M., Zhao, Y., Jansen, K. M. B., Ruud Van Ommen, J. & Hintzen, H. T., 2019, In : ECS Journal of Solid State Science and Technology. 8, 6, p. R88-R96

    Research output: Contribution to journalArticleScientificpeer-review

  31. Establishment of the coarse grained parameters for epoxy-copper interfacial separation

    Wong, KY., Leung, YY., Poelma, RH., Jansen, KMB., Yuan, CA., van Driel, WD. & Zhang, GQ., 2012, In : Journal of Applied Physics. 111, May, p. 1-7 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  32. Fabrication factors influencing mechanical, moisture- and water-related properties of mycelium-based composites

    Appels, F. V. W., Camere, S., Montalti, M., Karana, E., Jansen, K. M. B., Dijksterhuis, J., Krijgsheld, P. & Wösten, H. A. B., 2019, In : Materials and Design. 161, p. 64-71 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  33. Fast reliability qualification of SiP products

    Regard, C., Gautier, C., Frémont, H., Poirier, P., Ma, X. & Jansen, KMB., 2009, In : Microelectronics Reliability. 49, 2009, p. 958-962 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  34. Fracture toughness of Cu-EMC interfaces in pressurized steam

    Sadeghinia, M., Jansen, KMB., Ernst, LJ., Pape, H., Maus, I., van Driel, WD. & Zhang, GQ., 2014, In : International Journal of Adhesion and Adhesives. 49, March, p. 73-79 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  35. Hydrophobin gene deletion and environmental growth conditions impact mechanical properties of mycelium by affecting the density of the material

    Appels, F. V. W., Dijksterhuis, J., Lukasiewicz, C. E., Jansen, K., Wösten, H. A. B. & Krijgsheld, P., 2018, In : Scientific Reports. 8, 1, p. 1-7 7 p., 4703.

    Research output: Contribution to journalArticleScientificpeer-review

  36. Influence of matrix viscoelastic properties on thermal conductivity of TCA - Numerical approach

    Falat, TC., Wymyslowski, A., Kolbe, J., Jansen, KMB. & Ernst, LJ., 2007, In : Microelectronics Reliability. 47, p. 1989-1996 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  37. Inhibition of glycosaminoglycan incorporation influences collagen network formation during cartilage matrix production

    Bastiaansen-Jenniskens, YM., Koevoet, W., Jansen, KMB., Verhaar, JAN., DeGroot, J. & VanOsch, GJVM., 2009, In : Biochemical and Biophysical Research Communications. 379, 2009, p. 222-226 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  38. Inhibition of proteoglycan productioninfluences cartilage collagen network information

    Bastiaansen-Jenniskens, YM., Koevoet, W. & Jansen, KMB., 2008, In : Tissue Engineering. Part A. 14, 5, p. 748-752 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  39. Kinetic and thermo-viscoelastic characterisation of the epoxy adhesive in GLARE

    Abouhamzeh, M., Sinke, J., Jansen, KMB. & Benedictus, R., 2015, In : Composite Structures. 124, p. 19-28 10 p.

    Research output: Contribution to journalArticleScientificpeer-review

  40. Lifetime assessment of Bisphenol-A Polycarbonate (BPA-PC) plastic lens, used in LED-based products

    Yazdan Mehr, M., van Driel, WD., Jansen, KMB., Deeben, P. & Zhang, GQ., 2014, In : Microelectronics Reliability. 54, 1, p. 138-142 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  41. Measuring the through-plane elastic modulus of thin polymer films in situ

    van Soestbergen, M., Ernst, LJ., Jansen, KMB. & van Driel, WD., 2007, In : Microelectronics Reliability. 47, p. 1983-1988 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

  42. Mechanical characterization of a shape morphing smart composite with embedded shape memory alloys in a shape memory polymer matrix

    Lelieveld, C., Jansen, K. & Teuffel, P., 2016, In : Journal of Intelligent Material Systems and Structures. 27, 15, p. 2038-2048 11 p.

    Research output: Contribution to journalArticleScientificpeer-review

  43. Mechanical characterization of epoxy moulding compound in pressurized steam

    Sadeghinia, M., Jansen, KMB., Ernst, LJ. & Pape, H., 2013, In : International Journal of Adhesion and Adhesives. 40, January, p. 103-107 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  44. Mechanical reliability of a segmented silicon layer on ultra-thin polyimide substrates

    WANG, L., Xiao, A., Jansen, KMB., Bartek, M., Zoumpoulidis, T., Ernst, LJ. & Zhang, GQ., 2007, In : Key Engineering Materials. 353-358, p. 2529-2532 4 p.

    Research output: Contribution to journalArticleScientificpeer-review

  45. Micro-mechanical testing of SiLK by nanoindentation and substrate curvature techniques

    Gonda, V., Jansen, KMB., Ernst, LJ., den Toonder, J. & Zhang, GQ., 2007, In : Microelectronics Reliability. 47, p. 248-251 4 p.

    Research output: Contribution to journalArticleScientificpeer-review

  46. Micromechanical modeling of stress evolution induced during cure in a particle-filled electronic packaging polymer

    Yang, D., Jansen, KMB., WANG, L., Ernst, LJ., Zhang, GQ., Bressers, HJL. & Fan, X., 2004, In : IEEE Transactions on Components and Packaging Technology. 27, 4, p. 676-683 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  47. Modeling and characterization of molding compound properties during cure

    Jansen, KMB., Qian, C., Ernst, LJ., Bohm, C., Kessler, A., Preu, H. & Stecher, M., 2009, In : Microelectronics Reliability. 49, 2009, p. 872-876 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  48. Novel shear tools for viscoelastic characterization of packaging polymers

    van t Hof, C., Jansen, KMB., Wisse, G., Ernst, LJ., Yang, DG., Zhang, GQ. & Bressers, HJL., 2007, In : Microelectronics Reliability. 47, p. 240-247 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  49. Numerical investigation and experimental validation of residual stresses building up in microelectronics packaging

    Rezaie Adli, A. & Jansen, K., 2016, In : Microelectronics Reliability. 60, p. 26-38 13 p.

    Research output: Contribution to journalArticleScientificpeer-review

  50. Numerical modeling of warpage induced in QFN array molding process

    Yang, D., Jansen, KMB., Ernst, LJ., Zhang, GQ., van Driel, WD., Bressers, HJL. & Janssen, JHJ., 2007, In : Microelectronics Reliability. 47, p. 310-318 9 p.

    Research output: Contribution to journalArticleScientificpeer-review

  51. Photodegradation of bisphenol A polycarbonate under blue light radiation and its effect on optical properties

    Yazdan Mehr, M., van Driel, WD., Jansen, KMB., Deeben, J., Boutelje, M. & Zhang, GQ., 2013, In : Optical Materials. 35, 3, p. 504-508 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  52. Prediction of cure induced warpage of micro-electronic products

    de Vreugd, J., Jansen, KMB., Ernst, LJ. & Bohm, C., 2010, In : Microelectronics Reliability. 50, p. 910-916 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  53. Simulation of the development of local panel distortions due to hot-curing adhesives

    Priesnitz, KW., Jansen, KMB., Sinke, J. & Benedictus, R., 2015, In : Journal of Materials Processing Technology. 225, p. 405-412 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  54. Solders fatigue prediction using interfacial boundary volume criterion

    Ernst, LJ., Zhang, GQ., Jansen, KMB. & Bressers, HJL., 2003, In : Journal of Electronic Packaging. 125, 4, p. 582-588 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  55. State-of-the-Art of Thermo-Mechanical Characterization of Thin Polymer Films

    Jansen, KMB., Gonda, V., Ernst, LJ., Bressers, HJL. & Zhang, GQ., 2005, In : Journal of Electronic Packaging. 127, p. 530-536 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  56. Tailoring the viscoelasticity of epoxy thermosets

    Nakka, JS., Jansen, KMB. & Ernst, LJ., 2013, In : Journal of Applied Polymer Science. 128, 6, p. 3794-3806 13 p.

    Research output: Contribution to journalArticleScientificpeer-review

  57. Theory of aluminum metallization corrosion in microelectronics

    van Soestbergen, M., Mavinkurve, A., Rongen, RTH., Jansen, KMB., Ernst, LJ. & Zhang, GQ., 2010, In : Electrochimica Acta. 55, p. 5459-5469 11 p.

    Research output: Contribution to journalArticleScientificpeer-review

  58. Thermal-electric characterization and modelling of smart composite structure for architectural applications

    Lelieveld, C. & Jansen, KMB., 2014, In : Smart Materials and Structures. 23, 6, p. 1-8 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  59. Thermo-viscoelastic analysis of GLARE

    Abouhamzeh, M., Sinke, J., Jansen, K. M. B. & Benedictus, R., 2016, In : Composites Part B: Engineering. 99, p. 1-8 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  60. Things that help out: Designing smart wearables as partners in stress management

    Li, X., Rozendaal, M. C., Jansen, K., Jonker, C. & Vermetten, E., 2020, In : AI and Society. p. 1-11 11 p.

    Research output: Contribution to journalArticleScientificpeer-review

  61. Time- and tempearature-dependent thermo-mechanical modeling of a packaging molding compound and its effect on packaging process stresses

    Ernst, LJ., Zhang, GQ., Jansen, KMB. & Bressers, HJL., 2003, In : Journal of Electronic Packaging. 125, 4, p. 539-548 10 p.

    Research output: Contribution to journalArticleScientificpeer-review

  62. Towards High Performance Metal–Organic Framework–Microporous Polymer Mixed Matrix Membranes: Addressing Compatibility and Limiting Aging by Polymer Doping

    Sabetghadam, A., Liu, X., Orsi, A. F., Lozinska, M. M., Johnson, T., Jansen, K., Wright, P. A., Carta, M., McKeown, N. B., Kapteijn, F. & Gascon, J., 2018, In : Chemistry - A European Journal. 24, 49, p. 12796-12800

    Research output: Contribution to journalArticleScientificpeer-review

  63. Warpage estimation of a multilayer package including cure shrinkage effects

    Jansen, KMB. & Ozturk, B., 2013, In : IEEE Transactions on Components, Packaging and Manufacturing Technology. 3, 3, p. 459-466 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  64. Water Sorption and Diffusion in (Reduced) Graphene Oxide-Alginate Biopolymer Nanocomposites

    Vilcinskas, K., Zlopasa, J., Jansen, K. M. B., Mulder, F. M., Picken, S. J. & Koper, G. J. M., 2016, In : Macromolecular Materials and Engineering. 301, 9, p. 1049-1063 15 p.

    Research output: Contribution to journalArticleScientificpeer-review

  65. Article › Professional
  66. Material complexity: 3D printing perspectives

    Doubrovski, EL., Jansen, KMB. & Geraedts, JMP., 2013, In : Inside materials (Nieuwsbrief Delft Centre for Materials). 2013, November, p. 1-2 2 p.

    Research output: Contribution to journalArticleProfessional

  67. Chapter › Scientific › Not peer-reviewed
  68. Establishment of the mesoscale parameters for separation: A nonequilibrium molecular dynamics model

    Wong, CKY., Leung, SYY., Poelma, RH., Jansen, KMB., Yuan, CCA., van Driel, WD. & Zhang, GQ., 2015, Molecular modeling and multiscaling issues for electronic material applications - Volume 2. Wymyslowski, A., Iwamoto, N., Yuen, M. & Fan, H. (eds.). Cham, Switzerland: Springer, p. 133-148 194 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeChapterScientific

  69. Chapter › Scientific › Peer-reviewed
  70. Polymer Materials Characterization, Modeling and Application

    Ernst, LJ., Jansen, KMB., Yang, D., van t Hof, C., Bressers, HJL., Janssen, JHJ. & Zhang, GQ., 2007, Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging. Suhir, E., Lee, YC. & Wong, CP. (eds.). New York, NY, USA: Springer, p. 1-63 701 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeChapterScientificpeer-review

  71. Conference contribution › Scientific › Not peer-reviewed
  72. A Characterization Method for Viscoelastic Bulk Modulus of Molding Compounds

    Saraswat, MK., Jansen, KMB., Patel, MD., Ernst, LJ., Bohm, C., Kessler, A., Preu, H. & Stecher, M., 2008, Proceedings of the 9th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P. & Saint Leger, O. de (eds.). Freiburg-im-Breisgau: EuroSimE, p. 463-466 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

  73. A New Method to Measure the Moisture Expansion in Plastic Packaging Materials

    Ma, X., Jansen, KMB., Ernst, LJ., van Driel, WD., van der Sluis, O. & Zhang, GQ., 2009, Proceedings of the 2009 Electronic Components and Technology Conference, ECTC2009, May 26-29, 2009, San Diego, CA, USA. Banda, R., Trewhella, J. & Bezuk, S. (eds.). IEEE Society, p. 1271-1276 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

  74. Advanced Viscoelastic Material Model for Predicting Warpage of a QFN Panel

    de Vreugd, J., Jansen, KMB., Xiao, A., Ernst, LJ., Bohm, C., Kessler, A., Preu, H. & Stecher, M., 2008, 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, USA. Wipiejewski, T. & Trewhella, J. (eds.). Orlando, FL, USA: IEEE Society, p. 1635-1640 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

  75. Characterization and modeling of molding compound properties during cure

    Jansen, KMB., Qian, C., Ernst, LJ., Bohm, C., Kessler, A., Preu, H. & Stecher, M., 2008, Proceedings of the 9th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P. & Saint Leger, O. de (eds.). Freiburg-im-Breisgau: EuroSimE, p. 610-613 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

  76. Comprehensive Material Characterization of Organic Packaging Materials

    Boehme, B., Jansen, KMB., Rzepka, S. & Wolter, K-J., 2009, Proceedings of the 10th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2009, April 27-29, 2009, Delft, The Netherlands. Ernst, LJ, Zhang, GQ, Driel, WD van, Rodgers, P, Bailey, C & Saint Leger, O de (eds.). Delft, The Netherlands: EuroSimE, p. 289-296 8 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

  77. Constitutive modeling of moulding compounds

    Jansen, KMB., WANG, L., Yang, D., van t Hof, C., Ernst, LJ., Bressers, HJL. & Zhang, GQ., 2004, 54th electronic components and technology conference. Vol. 2. S.n. (ed.). Piscataway: IEEE Society, p. 1-5 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

  78. Cure induced Warpage of micro-electronics: comparison with experiments

    de Vreugd, J., Jansen, KMB., Ernst, LJ., Bohm, C. & Falat, TC., 2009, Proceedings of the 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2009, 27-29 April 2009, Delft, The Netherlands. Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P., Bailey, C. & Saint Leger, O. de (eds.). IEEE Society, p. 374-377 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

  79. Effect of Postcure and Thermal Aging on Molding Compound Properties

    de Vreugd, J., Sanchez Monforte, A., Jansen, KMB., Ernst, LJ., Bohm, C., Kessler, A. & Preu, H., 2009, Proceedings of the 11th Electronics Packaging Technology Conference, EPTC 2009, 9-11 December 2009, Singapore. s.n. (ed.). Singapore: IEEE Society, p. 342-347 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

  80. Effect of aging of packaging materials on die surface cracking of a SiP carrier

    Ma, X., Jansen, KMB., Ernst, LJ., van Driel, WD., van der Sluis, O., Zhang, GQ., Regard, C., Gautier, C. & Frémont, H., 2008, Proceedings of the 9th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P. & Saint Leger, O. de (eds.). Freiburg-im-Breisgau: EuroSimE, p. 361-364 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

  81. Effects of automated tape laying heating strategies on degree of cure

    Skandali, M., Koussios, S., Sinke, J., Benedictus, R., de Mooij, C. & Jansen, K., 2017, SAMPE Europe Conference 16 Liege. New york: Curran Associates, Inc., p. 175-186 12 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

  82. Establishing Fracture Properties of EMC-Copper Interfaces in the Visco-Elastic Temperature Region

    Xiao, A., de Vreugd, J., Pape, H., Wunderle, B., Jansen, KMB. & Ernst, LJ., 2009, Proceedings of the 2009 IEEE 59th Electronic Components and Technology Conference, 26-29 May 2009, San Diego, CA, USA. Bonda, R. & Dias, R. (eds.). San Diego, CA, USA: IEEE Society, p. 239-245 7 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

  83. Fast Qualification Using Thermal Shock Combined with Moisture Absorption

    Ma, X., Zhang, GQ., Jansen, KMB., van Driel, WD., van der Sluis, O., Ernst, LJ., Regard, C., Gautier, C. & Frémont, H., 2009, Proceedings of the International Conference on Electronic Packaging Technology & High Density Packaging, ICEPT-HDP 2009, August 10-13, 2009, Beijing, China. Keyun Bi & Jian CaI (eds.). IEEE Society, p. 1-6 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

  84. Filler Contents Effects on the Moisture Absorption and Viscoelasticity of Thermosetting IC Packaging Polymers

    Ma, X., Jansen, KMB., Zhang, GQ. & Ernst, LJ., 2006, Proceedings of 2006 7th International Conference on Electronics Packaging Technology. Sheng Liu (ed.). Shanghai. China: Institute of Electrical and Electronics Engineers (IEEE), p. 161-165 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

  85. Free-standing, parylene-sealed copper interconnect for stretchable silicon electronics

    Sosin, S., Zoumpoulidis, T., Bartek, M., Wang, L., Dekker, R., Jansen, KMB. & Ernst, LJ., 2008, 2008 proceedings 58th electronic components & technology conference, Lake Buena Vista, FL, USA. Wipiejewski, T. & Trewhella, J. (eds.). Orlando, FL, USA: IEEE Society, p. 1339-1345 7 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

  86. Fully Cure-Dependent Modeling and Characterization of EMC's with Application to Package Warpage Simulation

    Ernst, LJ., Jansen, KMB., Saraswat, MK., van t Hof, C., Zhang, GQ., Yang, DG. & Bressers, HJL., 2006, Proceedings of 2006 7th International Conference on Electronics Packaging Technology. Sheng Liu (ed.). Shanghai, China: Institute of Electrical and Electronics Engineers (IEEE), p. 123-129 7 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

  87. Hygroscopic Effects on Swelling and Viscoelasticity of Electronic Packaging Epoxy

    Ma, X., Jansen, KMB., Zhang, GQ. & Ernst, LJ., 2006, Proceedings of 2006 7th International Conference on Electronics Packaging Technology. Sheng Liu (ed.). Shanghai, China: Institute of Electrical and Electronics Engineers (IEEE), p. 262-266 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

  88. Influence of Cure Dependency of molding Compound Properties on Warpage and Stress Distribution During and After the Encapsulation of Electronics Components

    Falat, TC., Jansen, KMB., de Vreugd, J. & Rzepka, S., 2009, Proceedings of the 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2009, 27-29 April 2009, Delft, The Netherlands. Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P., Bailey, C. & Saint Leger, O. de (eds.). IEEE Society, p. 330-335 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

  89. Interfacial Fracture Properties and Failure Modeling for Microelectronics

    Xiao, A., Pape, H., Wunderle, B., Jansen, KMB., de Vreugd, J. & Ernst, LJ., 2008, 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, USA. Wipiejewski, T. & Trewhella, J. (eds.). Orlando, FL, USA: IEEE Society, p. 1724-1730 7 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

  90. Investigation on Thermal Properties of Crosslinked Epoxy Resin by MD Simulation

    Liao, N., Zhang, GQ., Pavel, D., van der Sluis, O., Jansen, KMB. & Ernst, LJ., 2009, Proceedings of the 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2009, 27-29 April 2009, Delft, The Netherlands. Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P., Bailey, C. & Saint Leger, O. de (eds.). IEEE Society, p. 546-549 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

  91. Material parameter identification by combination of stress chip measurements and FE-simulation in MERGE

    Rost, F., Schindler-Saefkow, F., Vogel, D., Rezaie Adli, AR., Jansen, KMB., Rzepka, S., Michel, B., Schaufuß, J., Tsapkolenko, A. & Nossol, P., 2014, Smart system integration conference. s.n. (ed.). s.l.: s.n., p. 1-8 8 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

  92. Mechanical Properties of Polymer Dielectric Films at Elevated Temperatures

    van Soestbergen, M., Ernst, LJ., Jansen, KMB. & van Driel, WD., 2006, Proceedings of 2006 7th International Conference on Electronics Packaging Technology. Sheng Liu (ed.). Shanghai, China: Institute of Electrical and Electronic Engineers, Inc., p. 664-667 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

  93. Mechanical characterization of microelectronics embedded in flexible substrate

    Zoumpoulidis, T., WANG, L., Bartek, M., Polyakov, A., Jansen, KMB. & Ernst, LJ., 2006, Proceedings of 2006 7th International Conference on Electronics Packaging Technology. Sheng Liu (ed.). Shanghai, China: Institute of Electrical and Electronics Engineers (IEEE), p. 672-678 7 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

  94. Moisture Diffusion Model Verification of Packaging Materials

    Ma, X., Jansen, KMB., Ernst, LJ., van Driel, WD., van der Sluis, O., Zhang, GQ., Regard, C., Gautier, C. & Frémont, H., 2008, Proceedings of the 2008 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2008), July 28-31, 2008, Shanghai, China. Keyun Bi & Fei Xiao (eds.). IEEE Society, p. 636-640 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

  95. Moisture Effects on a System in Package Carrier

    Ma, X., Jansen, KMB., Ernst, LJ., van Driel, WD., van der Sluis, O. & Zhang, GQ., 2009, Proceedings of the 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2009, 27-29 April 2009, Delft, The Netherlands. Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P., Bailey, C. & Saint Leger, O. de (eds.). IEEE Society, p. 379-383 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

  96. Network density as scaling parameter for thermoset viscoelasticity

    Jansen, KMB., van Buchem, B., Bressers, HJL. & Ernst, LJ., 2004, 40th international symposium on macromolecules. S.n. (ed.). s.n., p. 1-2 2 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

  97. Prediction of process-induced warpage of IC packages encapsulated with thermosetting polymers

    Yang, D., Jansen, KMB., Ernst, LJ., Zhang, GQ., van Driel, WD., Bressers, HJL. & Fan, XJ., 2004, 54th electronic components and technology conference. Vol. 2. S.n. (ed.). Piscataway: IEEE, p. 98-105 8 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

  98. Residual stresses in injection molded products

    Jansen, KMB., 2015, GT conference proceedings polymer processing with resulting morphology and properties. s.n. (ed.). s.l.: s.n., p. 1-8 8 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

  99. The influence of fiber-matrix adhesion on the linear viscoelastic creep behavior of CF/PPS composites

    Motta Dias, MH., Jansen, KMB., Luinge, H., Nayak, K. & Bersee, HEN., 2013, ICSAAM 2013 The 5th international conference on structural analysis of advanced materials. s.n. (ed.). Islans of Kos, Greece: University of Patras, p. 1-15 15 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

  100. Time dependent behavior of molding compound in packaging

    Wisse, G., Jansen, KMB., Ernst, LJ., Kiasat, MS. & et al, ., 2001, 13th European microelectronics and packaging conference, May 30-31. Reston: International Microelectronics and Packaging Society, p. 389-392 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

  101. Conference contribution › Scientific › Peer-reviewed
  102. A novel tool for cure dependent viscoelastic characterization of packaging polymers

    van t Hof, C., Wisse, G., Ernst, LJ., Jansen, KMB., Yang, D., Zhang, GQ. & Bressers, HJL., 2004, EuroSimE 2004: 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems. Ernst, LJ., Zhang, GQ., Rodgers, P. & de Saint Leger, O. (eds.). Piscataway: IEEE Society, p. 385-389 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  103. A product based lap shear fatigue testing of electrically conductive adhesives

    Ozturk, B., Youssef, A., Gromala, P., Silber, C., Jansen, KMB. & Ernst, LJ., 2014, Proceedings 15th International Conference on Thermal, Mechanical and Multi-physics Simulation and Experiments in Microelectronics and Microsystems. Vandevelde, B. (ed.). Piscataway, NJ, USA: IEEE Society, p. 1-5 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  104. Aging of epoxy moulding compound: Thermomechanical properties during high temperature storage

    Zhang, B., Johlitz, M., Lion, A., Ernst, L., Jansen, K., Vu, D-K. & Weiss, L., 2016, 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). Piscataway, NJ, USA: IEEE Society, 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  105. Analytical estimate for cure-induced stresses and warpage in flat packages

    Jansen, KMB., de Vreugd, J. & Ernst, LJ., 2011, Proceedings of the 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011, 18-20 April 2011, Linz, Austria. Ernst, LJ., Zhang, GQ., Driel, WD. V., Rodgers, P., Bailey, C. & Saint Leger, O. D. (eds.). Linz, Austria: IEEE Society, p. 1-4 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  106. Bending and stretching studies on ultra-thin silicon substrates

    Wang, L., Jansen, KMB., Bartek, M., Poliakov, A. & Ernst, LJ., 2005, Proceedings of the 6th international conference on electronics packaging technology. Keyun, B. & Chunqing, W. (eds.). Piscataway: IEEE Society, p. 682-686 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  107. Challenges of viscoelastic characterization of low Tg epoxy based adhesives for automotive applications in DMA and relaxation experiments

    Maus, I., Preu, H., Niessner, M., Fink, M., Jansen, KMB., Pantou, R., Michel, B. & Wunderle, B., 2014, Proceedings of the 15th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems. Vandevelde, B. (ed.). Piscataway: IEEE Society, p. 1-7 7 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  108. Characterization and simulation of LTCC/adhesive and alloy 42/adhesive interface strength for automotive applications

    Ozturk, B., Lou, P., Gromala, P., Silber, C., Jansen, KMB. & Ernst, LJ., 2015, Proceedings of the 2015 16th INternational Conference on Thermal, Mechanical and Multi-physics Simulation and Experiments in Microelectronics and Microsystems. s.n. (ed.). Piscataway, NJ, USA: IEEE Society, p. 1-10 10 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  109. Characterization of adhesives and interface strength for automotive applications

    Ozturk, B., Gromala, P., Otto, C., Fischer, A., Jansen, KMB. & Ernst, LJ., 2012, Proceedings of the 13th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and Microsystems, EuroSimE 2012. s.l.: IEEE Society, p. 1-4 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  110. Characterization of adhesives for microelectronic industry in DMA and relaxation experiments for interfacial fracture toughness characterization- difficulties and solution

    Maus, I., Preu, H., Niessner, M., Nabi, H., Jansen, KMB., Pantou, R., Weiss, L., Michel, B. & Wunderle, B., 2014, Proceedings of the ESTC Electronic sytem-integration technology conference 2014. s.n. (ed.). Piscataway: IEEE Society, p. 1-7 7 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  111. Characterization of epoxy based highly filled die attach materials in microelectronics

    Maus, I., Liebl, C., Fink, M., Vu, D-K., Hartung, M., Preu, H., Jansen, K., Michel, B., Wunderle, B. & Weiss, L., 2017, 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017. IEEE, p. 1-7 7 p. 7926237

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  112. Characterization of polymer films and coating process evaluation as tool for determination of coating strength: "Quality by Design" approach

    Perfetti, G., Jansen, KMB., Meesters, GMH. & wildeboer, W. J., 2008, Proceedings International Symposium Reliable Flow of Particulate Solids IV (RELPOWFLO IV). s.n. (ed.). Tomso: s.n., p. 1-5 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  113. Characterization of variable stiffness joints for adaptive structures

    Wang, Q., Habraken, A., Teuffel, P., Senatore, G. & Jansen, K., 2019, Advances in Engineering Materials, Structures and Systems: Innovations, Mechanics and Applications - Proceedings of the 7th International Conference on Structural Engineering, Mechanics and Computation, 2019. Zingoni, A. (ed.). CRC Press / Balkema, p. 1045-1050 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  114. Comprehensive material characterization and method of its validation by means of FEM simulation

    Gromala, P., Duerr, J., Dressler, M., Jansen, KMB., Hawryluk, ML. & de Vreugd, J., 2011, Proceedings of the 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011, 18-20 April 2011, Linz, Austria. Ernst, LJ., Zhang, GQ., Driel, WD. V., Rodgers, P., Bailey, C. & Saint Leger, O. D. (eds.). Linz, Austria: IEEE Society, p. 1-8 8 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  115. Cure dependent characterisation of moulding compounds

    Jansen, KMB., Hawryluk, ML. & Gromala, P., 2011, Proceedings of the 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011, 18-20 April 2011, Linz, Austria. Ernst, LJ., Zhang, GQ., Driel, WD. V., Rodgers, P., Bailey, C. & Saint Leger, O. D. (eds.). Linz, Austria: IEEE Society, p. 1-6 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  116. Cure, temperature and time dependent constitutive of moulding compounds

    Jansen, KMB., WANG, L., van t Hof, C., Ernst, LJ., Bressers, HJL. & Zhang, GQ., 2004, EuroSimE 2004: 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems. Ernst, LJ., Zhang, GQ., Rodgers, P. & de Saint Leger, O. (eds.). Piscataway: IEEE Society, p. 581-585 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  117. Deformable silicon electronics using segmentation and flexible interconnect

    Zoumpoulidis, T., WANG, L., Bartek, M., Jansen, KMB. & Ernst, LJ., 2007, Proc. 57th Electronic Components & Technology Conference (ECTC 2007). Bonda R (ed.). Piscataway: IEEE Society, p. 1544-1599 56 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  118. Deformable silicon electronics using segmentation and ultra-thin substrates

    Bartek, M., Zoumpoulidis, T., WANG, L., Jansen, KMB. & Ernst, LJ., 2007, Proceedings of the 4th International Wafer-Level Packaging Conference (IWLPC 2007). s.n. (ed.). Edina: Surface Mount Technology Association (smta.org), p. 1-6 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  119. Delamination Toughness of Cu-EMC Interfaces at Harsh Environment

    Sadeghinia, M., Jansen, KMB., Ernst, LJ., Schlottig, G. & Pape, H., 2011, Proceedings of IEEE 61st Electronic Components and Technology Conference, 31 May -3 June, 2011, Lake Buena Vista, FL, USA. n.a. (ed.). Lake Buena Vista, FL, USA: IEEE Society, p. 1976-1980 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  120. Delamination and combined compound cracking of EMC-copper interfaces

    Xiao, A., Schlottig, G., Pape, H., Wunderle, B., Jansen, KMB. & Ernst, LJ., 2010, Proceedings of the 60th Electronic Components and Technology Conference (ECTC), 1-4 June 2010, Las Vegas, NV, USA. n.a. (ed.). Las Vegas, NV, USA: IEEE Society, p. 114-120 7 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  121. Design and fabrication of micro-system embedding in flexible substrates

    WANG, L., Zoumpoulidis, T., Jansen, KMB., Bartek, M., Ernst, LJ. & Zhang, GQ., 2007, Proc. 57th Electronic Components & Technology Conference (ECTC 2007). Bonda R (ed.). Piscataway: IEEE Society, p. 311-315 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  122. Design and thermal testing of smart composite structure for architecture applications

    Lelieveld, C. & Jansen, KMB., 2013, Proceedings of the 6th ECCOMAS conference on smart structures and materials SMART 2013. Carrera, E., Miglioretti, F. & Petrolo, M. (eds.). s.l.: s.n., p. 1-11 11 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  123. Designing of a semi-transparent Electroluminescent Umbrella

    Jansen, K., Claus, S. & Barati, B., 2017, Smart Systems Integration 2017: International Conference and Exhibition on Integration Issues of Miniaturized Systems. Otto, T. (ed.). Mesago Messe Frankfurt GmbH, p. 123-129 7 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  124. Determination of cure dependent properties for curing simulation of thick-walled composites

    Balvers, JM., Bersee, HEN., Jansen, KMB. & Beukers, A., 2008, proceedings of the 49th AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics and Materials conference. Hajela, P. & Pepin, JE. (eds.). Schaumburg, Il. USA: American Institute of Aeronautics and Astronautics Inc. (AIAA), p. 1-15 15 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  125. Die attach interface property characterization as function of temperature using cohesive zone modeling method

    Ma, X., Zhang, GQ., van der Sluis, O., Jansen, KMB., van Driel, WD. & Ernst, LJ., 2010, Proceedings of the 11th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2010, 26-28 April 2010, Bordeaux, France. Ernst, LJ, Zhang, GQ, Driel, WD van, Rodgers, P, Bailey, C & Saint Leger, O de (eds.). Bordeaux, France: IEEE Society, p. 1-8 8 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  126. Disposable, stretchable on-skin sensors for posture monitoring

    Jansen, K., Tarren, B. & Slingerland, M., 2018, WearSys 2018 : Proceedings of the 4th ACM Workshop on Wearable Systems and Applications. New York, NY: Association for Computing Machinery (ACM), p. 1-4 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  127. Effects of Molding Compound Cure on Warpage of Electronic Packages

    de Vreugd, J., Jansen, KMB., Ernst, LJ., Bohm, C., Kessler, A. & Preu, H., 2008, Proceedings EPTC 2008. Lee, R. (ed.). Singapore: IEEE Society, p. 675-682 8 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  128. Electronics on deformable ultra-thin substrates

    Bartek, M., Poliakov, A., Wang, L., Jansen, KMB. & Ernst, LJ., 2005, Proceedings of the 2nd International wafer-level packaging congress (IWLPC). s.n. (ed.). SMTA, p. 16-21 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  129. Establishing fracture properties of EMC-copper (-oxide) interfaces

    Ernst, LJ., Xiao, A., de Vreugd, J., Jansen, KMB., Pape, H., Schlottig, G. & Wunderle, B., 2009, Proceedings of the 2009 IEEE 70th Vehicular Technology Conference Fall, 20-23 September 2009, Anchorage, Alaska. n.a. (ed.). Anchorage, Alaska: IEEE Society, p. 1-6 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  130. Establishing the interfacial fracture properties of cu-emc interfaces at harsh condition

    Sadeghinia, M., Jansen, KMB., Ernst, LJ. & Pape, H., 2012, Proceedings of the 13th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and Microsystems, EuroSimE 2012. s.l.: IEEE Society, p. 1-4 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  131. Establishment of the coarse grained parameters for epoxy-copper interfacial separation

    Wong, KY., Leung, YY., Poelma, RH., Jansen, KMB., Yuan, CA., van Driel, WD. & Zhang, GQ., 2012, Electronic packaging technology and high density packaging (ICEPT-HDP), 2012 Proceedings of the 13th international conference. s.n. (ed.). Piscataway: IEEE Society, p. 1467-1473 7 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  132. Establishment of the mesoscale parameters for epoxy-copper interfacial separation

    Wong, CKY., Leung, SYY., Poelma, RH., Jansen, KMB., Yuan, CCA., van Driel, WD. & Zhang, GQ., 2012, 13th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (EuroSimE 2012). s.l.: IEEE Society, p. 1-6 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  133. Experimental and numerical investigation on warpage of QFN packages induced during the array molding process

    Yang, D., Jansen, KMB., Ernst, LJ., Zhang, GQ., Beijer, JGJ. & Janssen, JHJ., 2005, Polytronic 2005 - Proceedings of the 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics. Dziedzic, A. & Felba, J. (eds.). Piscataway: IEEE Society, p. 1-5 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  134. Experimental and numerical investigation on warpage of QFN packages induced during the array molding process

    Yang, D., Jansen, KMB., Ernst, LJ., Zhang, GQ., Beijer, JGJ. & Janssen, JHJ., 2005, Proceedings of 2005 6th International Conference on Electronic Packaging Technology. Keyun, Bi, Chunqing & Wang (eds.). Piscataway, New Jersey: IEEE Society, p. 94-98 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  135. Experimental investigation and interpretation of the real time, in situ stress measurement during transfer molding using the piezoresistive stress chips

    Rezaie Adli, AR., Jansen, KMB., Schindler-Saefkow, F. & Rost, F., 2014, Proceedings of the 15th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems. Vandevelde, B. (ed.). Piscataway: IEEE Society, p. 1-4 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  136. Finite element based design of a new dogbone specimen for low cycle fatigue testing of highly filled epoxy-based adhesives for automotive applications

    Ozturk, B., Gromala, P., Silber, C., Jansen, KMB. & Ernst, LJ., 2013, Proceedings of the 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. van Driel, W. & et al (eds.). Piscataway, NJ, USA: IEEE Society, p. 1-4 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  137. Finite strain thermomechanical material characterization of adhesives used in automotive electronics for quantitative finite element simulations

    Gromala, P., Silber, C., Jansen, KMB. & Ernst, LJ., 2014, Proceedings of the16th Electronic Packaging Technology Conference - 2014. Yeo, A. & Hong Wan, NG. (eds.). Piscataway, NJ, USA: IEEE Society, p. 411-420 10 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  138. Flexibility studies on ultra-thin silicon substrates

    Wang, L., Bartek, M., Poliakov, A., Jansen, KMB. & Ernst, LJ., 2005, Proceedings of the STW annual workshop on semiconductor advances for future electronics and sensors (SAFE 2005). Krautschneider, W. (ed.). Utrecht: Technology Stichting STW, p. 175-180 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  139. Flexible interconnects for deformable ultra-thin substrates

    Zoumpoulidis, T., WANG, L., Bartek, M., Jansen, KMB., Polyakov, A., Sosin, S., Ernst, LJ., Dekker, R. & Burghartz, JN., 2006, Proc. 39th International Symposium on Microelectronics. s.n. (ed.). Washington: IMAPS, p. 204-210 7 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  140. Fracture toughness of Cu-EMC interfaces under pressure cooker conditions

    Sadeghinia, M., Jansen, KMB., Ernst, LJ., Schlottig, G. & Pape, H., 2011, Proceedings of the 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011, 18-20 April 2011, Linz, Austria. Ernst, LJ., Zhang, GQ., Driel, WD. V., Rodgers, P., Bailey, C. & Saint Leger, O. D. (eds.). Linz, Austria: IEEE Society, p. 1-5 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  141. From chemical building blocks of polymers to microelectronics reliability

    Bressers, HJL., van Driel, WD., Jansen, KMB., Ernst, LJ. & Zhang, GQ., 2004, EuroSimE 2004: 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems. Ernst, LJ., Zhang, GQ., Rodgers, P. & de Saint Leger, O. (eds.). Piscataway: IEEE Society, p. 621-625 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  142. Fully Cure-Dependent Modelling and Characterization of EMC's with Application to Package Warpage Simulation

    Ernst, LJ., Jansen, KMB., Saraswat, MK., Zhang, GQ., Yang, D., van t Hof, C. & Bressers, HJL., 2006, Proceedings 2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties, and Interfaces. sn (ed.). Atlanta, GA, USA: IEEE Society, p. 23-27 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  143. Fully cure-dependent polymer modeling and application to QFN-packages warpage

    Yang, D., Ernst, LJ., Jansen, KMB., van t Hof, C., Zhang, GQ., van Driel, WD. & Bressers, HJL., 2004, EPTC 2004: 6th electronic packaging technology Conference. Toh, KC., Mui, YC., How, J. & Pang, JHL. (eds.). S.l.: IEEE CPMT Society, p. 87-91 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  144. Functional Demonstrators to Support Understanding of Smart Materials

    Barati, B., Karana, E., Jansen, K. & Hekkert, P., 2016, TEI'16 Proceedings of the TEI'16: Tenth International Conference on Tangible, Embedded and Embodied Internaction. Broekhuijsen, M. (ed.). New York: Association for Computing Machinery (ACM), p. 386-391 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  145. High temperature storage influence on molding compound properties

    de Vreugd, J., Jansen, KMB., Ernst, LJ., Bohm, C. & Pufall, R., 2010, Proceedings of the 11th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2010, 26-28 April 2010, Bordeaux, France. Ernst, LJ, Zhang, GQ, Driel, WD van, Rodgers, P, Bailey, C & Saint Leger, O. de (eds.). IEEE Society, p. 1-6 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  146. How to shape the future of smart clothing

    Jansen, K. M. B., 2019, UbiComp/ISWC 2019- - Adjunct Proceedings of the 2019 ACM International Joint Conference on Pervasive and Ubiquitous Computing and Proceedings of the 2019 ACM International Symposium on Wearable Computers. Harle, R., Farrahi, K. & Lane, N. (eds.). New York, USA: Association for Computing Machinery (ACM), p. 1037-1039 3 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  147. Indentation rolling resistance of pipe belt conveyors using threedimensional generalized Maxwell viscoelastic model

    Zamiralova, M., Jansen, KMB. & Lodewijks, G., 2013, Proceedings of the 11th International Congress on Bulk Materials Storage, Handling and Transportation. Jones, M. (ed.). Calaghan, NSW, Australia: University of Newcastle, p. 1-11 11 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  148. Interface Characterization and Failure Modeling for Semiconductor Packages

    Ernst, LJ., Xiao, A., Wunderle, B., Jansen, KMB. & Pape, H., 2008, Proceedings EPTC 2008. Lee, R. (ed.). Singapore: IEEE Society, p. 808-815 8 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  149. Interfacial fracture parameters of silicon-to-molding compound

    Schlottig, G., Maus, I., Walter, H., Jansen, KMB., Pape, H., Wunderle, B. & Ernst, LJ., 2010, Proceedings 60th Electronic Components and Technology Conference (ECTC), 1-4- June 2010, Las Vegas, NV, USA. n.a. (ed.). IEEE Society, p. 1939-1945 7 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  150. Interfacial fracture properties of Cu-EMC interfaces at pressure cooker test conditions

    Sadeghinia, M., Jansen, KMB., Ernst, LJ. & Pape, H., 2012, Proceedings Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd. IEEE Society, p. 752-755 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  151. Material characterization and nonlinear viscoelastic modelling of epoxy based thermosets for automotive application

    Gromala, P., Muthuraman, B., Ozturk, B., Jansen, KMB. & Ernst, LJ., 2015, Thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (EurosimE 2015), proceedings of the 16 international conference. s.n. (ed.). s.l.: IEEE Society, p. 1-7 7 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  152. Measuring and modeling the cure-dependent rubbery moduli of epoxy molding compound

    Yang, DG., Jansen, KMB., Ernst, LJ., Zhang, GQ., Bressers, HJL. & Jansen, JHJ., 2005, Proceedings of the 6th international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems. Ernst, LJ., Zhang, GQ., Rodgers, P., Marco, S. & de Saint Leger, O. (eds.). Piscataway: IEEE Society, p. 120-125 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  153. Measuring in-thickness mechanical properties of sub micron polymer dielectric films

    van Soestbergen, M., Ernst, LJ., Jansen, KMB., van Driel, WD., Bartek, M. & Polyakov, A., 2006, Proceedings of the 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006. Ernst, L.J., Zhang, G.Q., Rodgers, P., Marco, S., Meuwissen, M. & Saint Leger, O. de (eds.). Como, Italy: EuroSimE, p. 1-5 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  154. Measuring the mechanical relevant shrinkage during in-mold and post-mold cure with the stress chip

    Rost, F., Schindler-Saefkow, F., Rezaie Adli, AR., Jansen, KMB., Wunderle, B., Keller, J., Rzepka, S. & Michel, B., 2014, Proceedings of the 15th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems. Vandevelde, B. (ed.). Piscataway: IEEE Society, p. 1-5 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  155. Mechanical Characterization Analysis of a Segmented Silicon Layer on Ultra-thin Polyimide Substrates by Experiment and FE Simulation

    Wang, L., Jansen, KMB., Bartek, M., Polyakov, A. & Ernst, LJ., 2006, Proceedings of the 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006. Ernst, L.J., Zhang, G.Q., Rodgers, P., Marco, S., Meuwissen, M. & Saint Leger, O. de (eds.). Como, Italy: EuroSimE, p. 1-6 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  156. Mechanical characterization of SiLK by Nanoindentation and substrate curvature techniques

    Gonda, V., Jansen, KMB., Ernst, LJ., den Toonder, J. & Zhang, GQ., 2004, EuroSimE 2004: 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems. Ernst, LJ., Zhang, GQ., Rodgers, P. & de Saint Leger, O. (eds.). Piscataway: IEEE Society, p. 373-376 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  157. Mechanical characterization of deformable ultra-thin substrates by experiment and FE simulation

    WANG, L., Zoumpoulidis, T., Jansen, KMB., Bartek, M., Zhang, GQ. & Ernst, LJ., 2007, Proc. 57th Electronic Components & Technology Conference (ECTC 2007). Bonda R (ed.). Piscataway: IEEE Society, p. 1056-1061 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  158. Mechanical characterization of microelectronics embedded in flexible and stretchable substrate

    WANG, L., Zoumpoulidis, T., Bartek, M., Poliakov, A., Jansen, KMB. & Ernst, LJ., 2006, Proc. 8th Electronics Packaging Technology Conference (EPTC 2006). Pang, JHL. (ed.). Piscataway: IEEE Society, p. 766-772 7 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  159. Mesh interconnects for silicone embedded stretchable silicon electronics

    Sosin, S., Zoumpoulidis, T., Bartek, M., Wang, L., Jansen, KMB. & Ernst, LJ., 2008, Proc. 10th electronics packaging technology conference (EPTC 2008). Yang, T. & Kheng, T. (eds.). Piscataway, Singapore: IEEE Society, p. 230-235 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  160. Micromechanical modeling of stress evolution induced during cure in a particle-filled electronic packaging polymer

    Yang, D., Jansen, KMB., Wang, L., Ernst, LJ., Zhang, GQ. & Bressers, HJL., 2003, Thermal & mechanical simulation and experiments in microelectronics and microsystems. Ernst, LJ., Zhang, GQ., Dudek, R. & de Saint Leger, O. (eds.). Piscataway: IEEE Society, p. 57-62 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  161. Mixed mode interface characerization considering thermal redisidual stress

    Xiao, A., Schlottig, G., Wunderle, B., Jansen, KMB. & Ernst, LJ., 2008, Proceedings 2008 International conference on electronic packaging technology & high density packaging. Bi, K. & Xiao, F. (eds.). IEEE Society, p. 1-8 8 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  162. Modeling of cure-induced warpage of plastic IC packages

    Yang, D., Jansen, KMB., Ernst, LJ., Zhang, GQ., van Driel, WD. & Bressers, HJL., 2004, EuroSimE 2004: 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems. Ernst, LJ., Zhang, GQ., Rodgers, P. & de Saint Leger, O. (eds.). Piscataway: IEEE Society, p. 33-40 8 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  163. Modelling of Thermal Aging of Moulding Compound by using an Equivalent Layer Assumption

    Zhang, B., Lion, A., Johlitz, M., Ernst, L., Jansen, K., Vu, D-K. & Weiss, L., 2017, 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017. IEEE, p. 1-6 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  164. Moisture Effects on the Creep of Thermosetting IC Packaging Polymers

    Ma, X., Jansen, KMB. & Ernst, LJ., 2006, Proceedings of the 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006. Ernst, L.J., Zhang, G.Q., Rodgers, P., Marco, S., Meuwissen, M. & Saint Leger, O. de (eds.). Como, Italy: EuroSimE, p. 1-5 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  165. Moisture absorption analysis of high performance polyimide adhesive

    Akram, M., Jansen, KMB., Bhowmik, S. & Ernst, LJ., 2011, Proceedings of SAMPE Fall Technical Conference 2011, October 17-20, 2011, Fort Worth, Texas, USA. n.a. (ed.). Fort Worth, Texas, USA: SAMPE, p. 1-9 9 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  166. Moisture absorption and hygroscopic swelling characterization of molding compound

    de Vreugd, J., Jansen, KMB., Ernst, LJ. & Bohm, C., 2009, Proceedings of the 11th International Conference on Electronic Material and Packaging, 1-3 December 2009, Penang, Malaysia. n.a. (ed.). Penang, Malaysia: n.a., p. 1-6 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  167. Molecular dynamics study of the traction-displacement relations of epoxy-copper interfaces

    Wong, CKY., Leung, SYY., Poelma, RH., Jansen, KMB., Yuan, CA., van Driel, WD. & Zhang, GQ., 2011, 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2011). Ernst, LJ., Zhang, GQ., Driel, WD. V., Rodgers, P., Bailey, C. & Saint Leger, O. D. (eds.). Piscataway: IEEE Society, p. 1-5 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  168. Numerical Approach to Characterization of Thermally Conductive Adhesives

    Falat, T., Wymyslowski, A., Kolbe, J., Jansen, KMB. & Ernst, LJ., 2006, Proceedings of the 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006. Ernst, L.J., Zhang, G.Q., Rodgers, P., Marco, S., Meuwissen, M. & Saint Leger, O. de (eds.). Como, Italy: EuroSimE, p. 1-7 7 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  169. Numerical prediction of residual stresses evolving during packaging of ICs

    Rezaie Adli, AR., Jansen, KMB. & Ernst, LJ., 2015, Thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (EurosimE 2015), proceedings of the 16 international conference. s.n. (ed.). Piscataway, NJ: IEEE Society, p. 1-6 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  170. On the effect of cure-residual stress on flip chip failure prediction

    Ernst, LJ., Yang, D., Jansen, KMB., van t Hof, C., Zhang, GQ. & van Driel, WD., 2002, Proceedings of 4th electronics packaging technology conference (EPTC 2002). Lee, C., Chuan, TK. & Iyer, MK. (eds.). Piscataway: IEEE Society, p. 398-403 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  171. Procedure to determine interfacial toughness of EMC-copper (oxide) interfaces

    Xiao, A., Pape, H., Schlottig, G., Wunderle, W., Leung, YY., Jansen, KMB. & Ernst, LJ., 2010, Proceedings of the 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 16-19 August 2010, Xi'an, China. n.a. (ed.). Xi'an, China: IEEE Society, p. 356-362 7 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  172. Process technology for electronics on flexible and stretchable substrates

    Zoumpoulidis, T., Wang, L., Bartek, M., Polyakov, A., Jansen, KMB. & Ernst, LJ., 2006, Proceedings of the 9th STW Annual Workshop on Semiconductor Advances for Future Electronics and Sensors (SAFE 2006). s.n. (ed.). Utrecht: STW, p. 502-507 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  173. Process technology of high-aspect-ratio silicon beams for stretchable silicon electronics

    Zoumpoulidis, T., Tian, J., Sosin, S., Bartek, M., Wang, L., Jansen, KMB., Ernst, LJ., Dekker, R. & de Graaf, P., 2008, Proc. 10th electronics packaging technology conference (EPTC 2008). Yang, T. & Kheng, T. (eds.). Piscataway, ingapore: IEEE Society, p. 361-366 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  174. Process-induced warpage in HVQFN package: effect of design parameters and processing conditions

    Yang, D., Ernst, LJ., Jansen, KMB., Zhang, GQ., Janssen, JHJ. & Bressers, HJL., 2005, Polytronic 2005 - Proceedings of the 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics. Dziedzic, A. & Felba, J. (eds.). Piscataway: IEEE Society, p. 25-29 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  175. Progressive failure modelling of notched composite laminates and its experimental verification

    Liu, CJ., Jansen, KMB., Ernst, LJ. & Marissen, R., 2003, ICCM-14. s.n. (ed.). Dearborn: Society of Manufacturing engineers, p. 1-12 12 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  176. Recent developments in thermal mechanical modeling of the curing process of filled thermoset polymers

    Ernst, LJ., Jansen, KMB., van t Hof, C., Yang, DG., Zhang, GQ. & Bressers, HJL., 2003, Proceedings of the 10th international conference on mechanics and technology of composite materials. Naidenov, V., Stoyanov, V. & Rostovsky, I. (eds.). s.l.: s.n., p. 38-44 7 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  177. Residual and bending stress measurements by X-ray diffraction and synchrotron diffraction analysis in silicon solar cells

    Popovich, V., van der Pers, NM., Janssen, M., Bennett, IJ., Jansen, KMB., Wright, J. & Richardson, IM., 2012, Photovoltaic Specialists Conference (PVSC), 2012 38th IEEE. IEEE, p. 442-447 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  178. Smart textiles: How electronics merge into our clothing

    Jansen, K. M. B., 2019, 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019. Piscataway, NJ, USA: Institute of Electrical and Electronics Engineers (IEEE), 4 p. 8724586

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  179. Smart thermoregulating garments

    Jansen, K. & Bogerd, N., 2017, Alive Active Adaptive: International Conference on Experiential Knowledge and Emerging Materials EKSIG 2017. Karana, E., Giaccardi, E., Nimkulrat, N., Niedderer, K. & Camere, S. (eds.). Delft: TU Delft Open, p. 359-363 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  180. State dependent constitutive modeling of curing molding compounds

    Ernst, LJ., Jansen, KMB., Yang, D., van t Hof, C., Bressers, HJL. & Zhang, GQ., 2004, EMAP 2004: 6th international conference on electronic materials and packaging. Ripin, ZM., Seetharamu, KN., Abdullah, MZ., Samad, Z. & Shuib, S. (eds.). S.l.: IEEE CPMT, p. 23-29 7 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  181. Stretchable mesh copper interconnect for batc fabrication of array-type microsystems

    Sosin, S., Zoumpoulidis, T., Bartek, M., Wang, L., Dekker, R., Jansen, KMB. & Ernst, LJ., 2008, 22nd international conference EUROSENSORS. Gerlach, G. (ed.). Dusseldorf, Germany: VDI e.V, p. 1528-1531 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  182. Study of the Effects of Molding Pressure on the Warpage of HVQFN Packages

    Gui, DY., Ernst, LJ., Jansen, KMB., Yang, D., Goumans, L., Bressers, HJL. & Janssen, JHJ., 2005, Proceedings of 2005 6th International Conference on Electronic Packaging Technology. Keyun, Bi, Chunqing & Wang (eds.). Piscataway, New Jersey: IEEE Society, p. 338-343 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  183. Surface modification of polyimide by atmospheric pressure plasma for adhesive bonding with titanium and its application to aviation and space

    Akram, M., Bhowmik, S., Jansen, KMB. & Ernst, LJ., 2010, Proceedings of the SAMPE USA 2010 Conference and Exhibition, 17-20 May 2010, Seattle, WA, USA. s.n. (ed.). Seattle, WA, USA: SAMPE USA, p. 1-10 10 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  184. Surface modification of titanium by atmospheric pressure plasma treatment for adhesive bonding and its application to aviation and space

    Akram, M., Bhowmik, S., Jansen, KMB. & Ernst, LJ., 2010, Proceedings of SEICO 10, SAMPE Europe 31st International Technical Conference and Forum, 12-14 April 2010, Paris, France. n.a. (ed.). Paris, France: SEICO, p. 188-194 7 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  185. The influence of fiber-matrix adhesion on the linear viscoelastic creep behavior of CF/PPS composites

    Motta Dias, MH., Jansen, KMB., Luinge, H., Nayak, K. & Bersee, HEN., 2014, AMS2014: The 1st international conference on ageing of materials and structures. s.n. (ed.). s.l.: s.n., p. 1-15 15 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  186. The state-of-the-art of thermo-mechanical characterisation of thin polymer films

    Pelletier, C., Bressers, HJL., Zhang, GQ., Jansen, KMB., Gonda, V. & Ernst, LJ., 2002, 3rd international conference on benefiting from thermal and mechanical simulation in (micro)electronics. Ernst, LJ., Zhang, GQ., Dudek, R. & de Saint Leger, O. (eds.). Piscataway: The Institute of Electrical and Electronics Engineers, p. 293-300 8 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  187. Thermal aging modeling of molding compound under high-temperature storage and temperature cycling conditions

    Zhang, B., Johlitz, M., Lion, A., Ernst, L. J., Jansen, K., Vu, D-K. & Weiss, L., 2018, 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018. Piscataway, NJ: IEEE, p. 1-5 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  188. Thermal aging of molding compounds

    Jansen, KMB., de Vreugd, J., Ernst, LJ. & Bohm, C., 2010, Proceedings of the 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 16-19 August 2010, Xi'an, China. n.a. (ed.). Xi'an, China: IEEE Society, p. 778-780 3 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  189. Two-dimensional and transient thermal model of the continuous tape laying process

    Skandali, M., Jansen, KMB., Koussios, S., Sinke, J. & Benedictus, R., 2015, Proceedings of the 20th international conference on composite materials, ICCM 20. Thomsen, OT. (ed.). s.l.: ICCM, p. 1-12 12 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  190. Viscoelastic characterization of fast curing moulding compounds

    Milosheva, BV., Jansen, KMB., Jansen, JHJ., Bressers, HJL. & Ernst, LJ., 2005, Proceedings of the 6th international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems. Ernst, LJ., Zhang, GQ., Rodgers, P., Marco, S. & de Saint Leger, O. (eds.). Piscataway: IEEE Society, p. 462-467 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  191. Warpage minimization of the HVQFN map mould

    Beijer, JGJ., Jansen, JHJ., Bressers, HJL., van Driel, WD., Jansen, KMB., Yang, DG. & Zhang, GQ., 2005, Proceedings of the 6th international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems. Ernst, LJ., Zhang, GQ., Rodgers, P., Marco, S. & de Saint Leger, O. (eds.). Piscataway: IEEE Society, p. 168-174 7 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  192. Warpage-based optimization of the curing profile for electronic packaging polymers

    Yang, DG., Jansen, KMB., Li, QY., Liang, JS., Ernst, LJ. & Zhang, GQ., 2003, ICEPT 2003. Bi, K., Barnwell, PG. & Wang, J. (eds.). Piscataway: IEEE Society, p. 345-350 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  193. What Does My Shirt Tell Me? The Integrating of Electronics in Clothing

    Jansen, K. M. B., 2019, 2019 Pan Pacific Microelectronics Symposium (Pan Pacific). Piscataway, NJ, USA: IEEE, p. 1-4 4 p. 8696601

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  194. Foreword/postscript › Scientific
  195. WearSys'2018 chairs' welcome

    Jansen, K. & Ashok, A., 2018, WearSys 2018 : Proceedings of the 4th ACM Workshop on Wearable Systems and Applications. Jansen, K. & Mortier, R. (eds.). p. ii

    Research output: Chapter in Book/Conference proceedings/Edited volumeForeword/postscriptScientific

  196. Poster › Professional
  197. Characterization of polymer films and coating process evaluation as tool for determination of coating strength: "Quality by Design" approach

    Perfetti, G., Jansen, KMB., Meesters, GMH. & wildeboer, W. J., 2008.

    Research output: Contribution to conferencePosterProfessional

  198. Abstract › Scientific
  199. Damping model for carbon nanotube composites in sports applications

    Dwaikat, MMS., Jansen, KMB. & Spitas, C., 2012, p. 1-1. 1 p.

    Research output: Contribution to conferenceAbstractScientific

  200. Location optimisation for IMUs in the design of motion tracking soccer tights based on Soft Tissue Artefact analysis

    Ahsmann, L., Steijlen, A., Wilmes, E., Jansen, K. & Huysmans, T., 2019. 1 p.

    Research output: Contribution to conferenceAbstractScientific

  201. Prediction of thermopysiological responses to local skin cooling using the Fiala thermophysiological model

    Bogerd, N. & Jansen, K., 2017, p. 167-167. 1 p.

    Research output: Contribution to conferenceAbstractScientific

  202. Understanding autonomy, animism and presence as a design strategy for behavior change

    Li, X., Rozendaal, M., Jansen, K. & Jonker, C., 2017, p. 1-6. 6 p.

    Research output: Contribution to conferenceAbstractScientific

  203. Conference article › Scientific › Peer-reviewed
  204. Ultra-thin deformable silicon substrates with lateral segmentation and flexible metal interconnect

    Zoumpoulidis, T., WANG, L., Bartek, M., Jansen, KMB. & Ernst, LJ., 2007, In : ECS Transactions. 9, 1, p. 103-112 10 p.

    Research output: Contribution to journalConference articleScientificpeer-review

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