1. 2004
  2. Network density as scaling parameter for thermoset viscoelasticity

    Jansen, KMB., van Buchem, B., Bressers, HJL. & Ernst, LJ., 2004, 40th international symposium on macromolecules. S.n. (ed.). s.n., p. 1-2 2 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

  3. Prediction of process-induced warpage of IC packages encapsulated with thermosetting polymers

    Yang, D., Jansen, KMB., Ernst, LJ., Zhang, GQ., van Driel, WD., Bressers, HJL. & Fan, XJ., 2004, 54th electronic components and technology conference. Vol. 2. S.n. (ed.). Piscataway: IEEE, p. 98-105 8 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

  4. State dependent constitutive modeling of curing molding compounds

    Ernst, LJ., Jansen, KMB., Yang, D., van t Hof, C., Bressers, HJL. & Zhang, GQ., 2004, EMAP 2004: 6th international conference on electronic materials and packaging. Ripin, ZM., Seetharamu, KN., Abdullah, MZ., Samad, Z. & Shuib, S. (eds.). S.l.: IEEE CPMT, p. 23-29 7 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  5. 2003
  6. Micromechanical modeling of stress evolution induced during cure in a particle-filled electronic packaging polymer

    Yang, D., Jansen, KMB., Wang, L., Ernst, LJ., Zhang, GQ. & Bressers, HJL., 2003, Thermal & mechanical simulation and experiments in microelectronics and microsystems. Ernst, LJ., Zhang, GQ., Dudek, R. & de Saint Leger, O. (eds.). Piscataway: IEEE Society, p. 57-62 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  7. Progressive failure modelling of notched composite laminates and its experimental verification

    Liu, CJ., Jansen, KMB., Ernst, LJ. & Marissen, R., 2003, ICCM-14. s.n. (ed.). Dearborn: Society of Manufacturing engineers, p. 1-12 12 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  8. Recent developments in thermal mechanical modeling of the curing process of filled thermoset polymers

    Ernst, LJ., Jansen, KMB., van t Hof, C., Yang, DG., Zhang, GQ. & Bressers, HJL., 2003, Proceedings of the 10th international conference on mechanics and technology of composite materials. Naidenov, V., Stoyanov, V. & Rostovsky, I. (eds.). s.l.: s.n., p. 38-44 7 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  9. Solders fatigue prediction using interfacial boundary volume criterion

    Ernst, LJ., Zhang, GQ., Jansen, KMB. & Bressers, HJL., 2003, In : Journal of Electronic Packaging. 125, 4, p. 582-588 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  10. Time- and tempearature-dependent thermo-mechanical modeling of a packaging molding compound and its effect on packaging process stresses

    Ernst, LJ., Zhang, GQ., Jansen, KMB. & Bressers, HJL., 2003, In : Journal of Electronic Packaging. 125, 4, p. 539-548 10 p.

    Research output: Contribution to journalArticleScientificpeer-review

  11. Warpage-based optimization of the curing profile for electronic packaging polymers

    Yang, DG., Jansen, KMB., Li, QY., Liang, JS., Ernst, LJ. & Zhang, GQ., 2003, ICEPT 2003. Bi, K., Barnwell, PG. & Wang, J. (eds.). Piscataway: IEEE Society, p. 345-350 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  12. 2002
  13. On the effect of cure-residual stress on flip chip failure prediction

    Ernst, LJ., Yang, D., Jansen, KMB., van t Hof, C., Zhang, GQ. & van Driel, WD., 2002, Proceedings of 4th electronics packaging technology conference (EPTC 2002). Lee, C., Chuan, TK. & Iyer, MK. (eds.). Piscataway: IEEE Society, p. 398-403 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

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