1. 2014
  2. Challenges of viscoelastic characterization of low Tg epoxy based adhesives for automotive applications in DMA and relaxation experiments

    Maus, I., Preu, H., Niessner, M., Fink, M., Jansen, KMB., Pantou, R., Michel, B. & Wunderle, B., 2014, Proceedings of the 15th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems. Vandevelde, B. (ed.). Piscataway: IEEE Society, p. 1-7 7 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  3. Characterization of adhesives for microelectronic industry in DMA and relaxation experiments for interfacial fracture toughness characterization- difficulties and solution

    Maus, I., Preu, H., Niessner, M., Nabi, H., Jansen, KMB., Pantou, R., Weiss, L., Michel, B. & Wunderle, B., 2014, Proceedings of the ESTC Electronic sytem-integration technology conference 2014. s.n. (ed.). Piscataway: IEEE Society, p. 1-7 7 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  4. Experimental investigation and interpretation of the real time, in situ stress measurement during transfer molding using the piezoresistive stress chips

    Rezaie Adli, AR., Jansen, KMB., Schindler-Saefkow, F. & Rost, F., 2014, Proceedings of the 15th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems. Vandevelde, B. (ed.). Piscataway: IEEE Society, p. 1-4 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  5. Finite strain thermomechanical material characterization of adhesives used in automotive electronics for quantitative finite element simulations

    Gromala, P., Silber, C., Jansen, KMB. & Ernst, LJ., 2014, Proceedings of the16th Electronic Packaging Technology Conference - 2014. Yeo, A. & Hong Wan, NG. (eds.). Piscataway, NJ, USA: IEEE Society, p. 411-420 10 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  6. Fracture toughness of Cu-EMC interfaces in pressurized steam

    Sadeghinia, M., Jansen, KMB., Ernst, LJ., Pape, H., Maus, I., van Driel, WD. & Zhang, GQ., 2014, In : International Journal of Adhesion and Adhesives. 49, March, p. 73-79 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  7. Lifetime assessment of Bisphenol-A Polycarbonate (BPA-PC) plastic lens, used in LED-based products

    Yazdan Mehr, M., van Driel, WD., Jansen, KMB., Deeben, P. & Zhang, GQ., 2014, In : Microelectronics Reliability. 54, 1, p. 138-142 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  8. Material parameter identification by combination of stress chip measurements and FE-simulation in MERGE

    Rost, F., Schindler-Saefkow, F., Vogel, D., Rezaie Adli, AR., Jansen, KMB., Rzepka, S., Michel, B., Schaufuß, J., Tsapkolenko, A. & Nossol, P., 2014, Smart system integration conference. s.n. (ed.). s.l.: s.n., p. 1-8 8 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

  9. Measuring the mechanical relevant shrinkage during in-mold and post-mold cure with the stress chip

    Rost, F., Schindler-Saefkow, F., Rezaie Adli, AR., Jansen, KMB., Wunderle, B., Keller, J., Rzepka, S. & Michel, B., 2014, Proceedings of the 15th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems. Vandevelde, B. (ed.). Piscataway: IEEE Society, p. 1-5 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  10. The influence of fiber-matrix adhesion on the linear viscoelastic creep behavior of CF/PPS composites

    Motta Dias, MH., Jansen, KMB., Luinge, H., Nayak, K. & Bersee, HEN., 2014, AMS2014: The 1st international conference on ageing of materials and structures. s.n. (ed.). s.l.: s.n., p. 1-15 15 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  11. Thermal-electric characterization and modelling of smart composite structure for architectural applications

    Lelieveld, C. & Jansen, KMB., 2014, In : Smart Materials and Structures. 23, 6, p. 1-8 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

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