1. 2020
  2. Design and characterization of variable stiffness structural joints

    Wang, Q., Senatore, G., Jansen, K., Habraken, A. & Teuffel, P., 2020, In : Materials and Design. 187, 108353.

    Research output: Contribution to journalArticleScientificpeer-review

  3. Effect of temperature and humidity on moisture diffusion in an epoxy moulding compound material

    Jansen, K. M. B., Zhang, M. F., Ernst, L. J., Vu, D. K. & Weiss, L., 2020, In : Microelectronics Reliability. 107, 6 p., 113596.

    Research output: Contribution to journalArticleScientificpeer-review

  4. 2019
  5. Creep behaviour of FM906 glass-fibre epoxy as used in heated fibre metal laminates

    Hagenbeek, M., Dias, M. M., Sinke, J. & Jansen, K., Nov 2019, In : Journal of Composite Materials. 53, 26-27, p. 3829-3840 12 p.

    Research output: Contribution to journalArticleScientificpeer-review

  6. Characterization of variable stiffness joints for adaptive structures

    Wang, Q., Habraken, A., Teuffel, P., Senatore, G. & Jansen, K., 1 Jan 2019, Advances in Engineering Materials, Structures and Systems: Innovations, Mechanics and Applications - Proceedings of the 7th International Conference on Structural Engineering, Mechanics and Computation, 2019. Zingoni, A. (ed.). CRC Press / Balkema, p. 1045-1050 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  7. 3D Printed Actuators: Reversibility, Relaxation, and Ratcheting

    Zhao, S. C., Maas, M., Jansen, K. & van Hecke, M., 2019, In : Advanced Functional Materials. 29, 51, 8 p., 1905545.

    Research output: Contribution to journalArticleScientificpeer-review

  8. Effects of surface modification on optical properties and thermal stability of K2SiF6:Mn4+ red phosphors by deposition of an ultrathin Al2O3 layer using gas-phase deposition in a fluidized bed reactor

    Ten Kate, O. M., Zhao, Y., Jansen, K. M. B., Ruud Van Ommen, J. & Hintzen, H. T., 2019, In : ECS Journal of Solid State Science and Technology. 8, 6, p. R88-R96

    Research output: Contribution to journalArticleScientificpeer-review

  9. Fabrication factors influencing mechanical, moisture- and water-related properties of mycelium-based composites

    Appels, F. V. W., Camere, S., Montalti, M., Karana, E., Jansen, K. M. B., Dijksterhuis, J., Krijgsheld, P. & Wösten, H. A. B., 2019, In : Materials and Design. 161, p. 64-71 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  10. How to shape the future of smart clothing

    Jansen, K. M. B., 2019, UbiComp/ISWC 2019- - Adjunct Proceedings of the 2019 ACM International Joint Conference on Pervasive and Ubiquitous Computing and Proceedings of the 2019 ACM International Symposium on Wearable Computers. Harle, R., Farrahi, K. & Lane, N. (eds.). New York, USA: Association for Computing Machinery (ACM), p. 1037-1039 3 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  11. Location optimisation for IMUs in the design of motion tracking soccer tights based on Soft Tissue Artefact analysis

    Ahsmann, L., Steijlen, A., Wilmes, E., Jansen, K. & Huysmans, T., 2019. 1 p.

    Research output: Contribution to conferenceAbstractScientific

  12. Smart textiles: How electronics merge into our clothing

    Jansen, K. M. B., 2019, 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019. Piscataway, NJ, USA: Institute of Electrical and Electronics Engineers (IEEE), 4 p. 8724586

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  13. What Does My Shirt Tell Me? The Integrating of Electronics in Clothing

    Jansen, K. M. B., 2019, 2019 Pan Pacific Microelectronics Symposium (Pan Pacific). Piscataway, NJ, USA: IEEE, p. 1-4 4 p. 8696601

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  14. 2018
  15. A novel 12-lead electrocardiographic system for home use: Development and usability testing

    Steijlen, A., Jansen, K., Albayrak, A., Verschure, D. O. & Van Wijk, D. F., 2018, In : JMIR mHealth and uHealth. 6, 7, p. 1-14 14 p., e10126.

    Research output: Contribution to journalArticleScientificpeer-review

  16. Disposable, stretchable on-skin sensors for posture monitoring

    Jansen, K., Tarren, B. & Slingerland, M., 2018, WearSys 2018 : Proceedings of the 4th ACM Workshop on Wearable Systems and Applications. New York, NY: Association for Computing Machinery (ACM), p. 1-4 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  17. Hydrophobin gene deletion and environmental growth conditions impact mechanical properties of mycelium by affecting the density of the material

    Appels, F. V. W., Dijksterhuis, J., Lukasiewicz, C. E., Jansen, K., Wösten, H. A. B. & Krijgsheld, P., 2018, In : Scientific Reports. 8, 1, p. 1-7 7 p., 4703.

    Research output: Contribution to journalArticleScientificpeer-review

  18. Thermal aging modeling of molding compound under high-temperature storage and temperature cycling conditions

    Zhang, B., Johlitz, M., Lion, A., Ernst, L. J., Jansen, K., Vu, D-K. & Weiss, L., 2018, 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018. Piscataway, NJ: IEEE, p. 1-5 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  19. Towards High Performance Metal–Organic Framework–Microporous Polymer Mixed Matrix Membranes: Addressing Compatibility and Limiting Aging by Polymer Doping

    Sabetghadam, A., Liu, X., Orsi, A. F., Lozinska, M. M., Johnson, T., Jansen, K., Wright, P. A., Carta, M., McKeown, N. B., Kapteijn, F. & Gascon, J., 2018, In : Chemistry - A European Journal. 24, 49, p. 12796-12800

    Research output: Contribution to journalArticleScientificpeer-review

  20. WearSys'2018 chairs' welcome

    Jansen, K. & Ashok, A., 2018, WearSys 2018 : Proceedings of the 4th ACM Workshop on Wearable Systems and Applications. Jansen, K. & Mortier, R. (eds.). p. ii

    Research output: Chapter in Book/Conference proceedings/Edited volumeForeword/postscriptScientific

  21. 2017
  22. Characterization of epoxy based highly filled die attach materials in microelectronics

    Maus, I., Liebl, C., Fink, M., Vu, D-K., Hartung, M., Preu, H., Jansen, K., Michel, B., Wunderle, B. & Weiss, L., 2017, 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017. IEEE, p. 1-7 7 p. 7926237

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  23. Designing of a semi-transparent Electroluminescent Umbrella

    Jansen, K., Claus, S. & Barati, B., 2017, Smart Systems Integration 2017: International Conference and Exhibition on Integration Issues of Miniaturized Systems. Otto, T. (ed.). Mesago Messe Frankfurt GmbH, p. 123-129 7 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  24. Effects of automated tape laying heating strategies on degree of cure

    Skandali, M., Koussios, S., Sinke, J., Benedictus, R., de Mooij, C. & Jansen, K., 2017, SAMPE Europe Conference 16 Liege. New york: Curran Associates, Inc., p. 175-186 12 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

  25. Modelling of Thermal Aging of Moulding Compound by using an Equivalent Layer Assumption

    Zhang, B., Lion, A., Johlitz, M., Ernst, L., Jansen, K., Vu, D-K. & Weiss, L., 2017, 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017. IEEE, p. 1-6 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  26. Prediction of thermopysiological responses to local skin cooling using the Fiala thermophysiological model

    Bogerd, N. & Jansen, K., 2017, p. 167-167. 1 p.

    Research output: Contribution to conferenceAbstractScientific

  27. Smart thermoregulating garments

    Jansen, K. & Bogerd, N., 2017, Alive Active Adaptive: International Conference on Experiential Knowledge and Emerging Materials EKSIG 2017. Karana, E., Giaccardi, E., Nimkulrat, N., Niedderer, K. & Camere, S. (eds.). Delft: TU Delft Open, p. 359-363 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  28. Understanding autonomy, animism and presence as a design strategy for behavior change

    Li, X., Rozendaal, M., Jansen, K. & Jonker, C., 2017, p. 1-6. 6 p.

    Research output: Contribution to conferenceAbstractScientific

  29. 2016
  30. Aging of epoxy moulding compound: Thermomechanical properties during high temperature storage

    Zhang, B., Johlitz, M., Lion, A., Ernst, L., Jansen, K., Vu, D-K. & Weiss, L., 2016, 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). Piscataway, NJ, USA: IEEE Society, 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  31. Atmospheric plasma modification of polyimide sheet for joining to titanium with high temperature adhesive

    Akram, M., Jansen, KMB., Ernst, LJ. & Bhowmik, S., 2016, In : International Journal of Adhesion and Adhesives. 65, p. 63-69

    Research output: Contribution to journalArticleScientificpeer-review

  32. Colour shift and mechanism investigation on the PMMA diffuser used in LED-based luminaires

    Lu, G., van Driel, WD., Fan, X., Yazdan Mehr, M., Fan, J., Qian, C., Jansen, KMB. & Zhang, GQ., 2016, In : Optical Materials. 54, p. 282-287 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

  33. Composition dependent properties of graphene (oxide)-alginate biopolymer nanocomposites

    Vilcinskas, K., Jansen, K. M. B., Mulder, F. M., Picken, S. J. & Koper, G. J. M., 2016, In : Polymer Composites. 39 (2018), S1, p. E236-E249

    Research output: Contribution to journalArticleScientificpeer-review

  34. Effect of fiber-matrix adhesion on the creep behavior of CF/PPS composites: Temperature and physical aging characterization

    Motta Dias, MH., Jansen, KMB., Luinge, JW., Bersee, HEN. & Benedictus, R., 2016, In : Mechanics of Time Dependent Materials: an international journal devoted to the time-dependent behaviour of materials and structures. 10, 2, p. 245-262 18 p.

    Research output: Contribution to journalArticleScientificpeer-review

  35. Functional Demonstrators to Support Understanding of Smart Materials

    Barati, B., Karana, E., Jansen, K. & Hekkert, P., 2016, TEI'16 Proceedings of the TEI'16: Tenth International Conference on Tangible, Embedded and Embodied Internaction. Broekhuijsen, M. (ed.). New York: Association for Computing Machinery (ACM), p. 386-391 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  36. Mechanical characterization of a shape morphing smart composite with embedded shape memory alloys in a shape memory polymer matrix

    Lelieveld, C., Jansen, K. & Teuffel, P., 2016, In : Journal of Intelligent Material Systems and Structures. 27, 15, p. 2038-2048 11 p.

    Research output: Contribution to journalArticleScientificpeer-review

  37. Numerical investigation and experimental validation of residual stresses building up in microelectronics packaging

    Rezaie Adli, A. & Jansen, K., 2016, In : Microelectronics Reliability. 60, p. 26-38 13 p.

    Research output: Contribution to journalArticleScientificpeer-review

  38. Thermo-viscoelastic analysis of GLARE

    Abouhamzeh, M., Sinke, J., Jansen, K. M. B. & Benedictus, R., 2016, In : Composites Part B: Engineering. 99, p. 1-8 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  39. Water Sorption and Diffusion in (Reduced) Graphene Oxide-Alginate Biopolymer Nanocomposites

    Vilcinskas, K., Zlopasa, J., Jansen, K. M. B., Mulder, F. M., Picken, S. J. & Koper, G. J. M., 2016, In : Macromolecular Materials and Engineering. 301, 9, p. 1049-1063 15 p.

    Research output: Contribution to journalArticleScientificpeer-review

  40. 2015
  41. A new procedure for thermo-viscoelastic modelling of composites with general orthotropy and geometry

    Abouhamzeh, M., Sinke, J., Jansen, KMB. & Benedictus, R., 2015, In : Composite Structures. 133, p. 871-877 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  42. Characterization and simulation of LTCC/adhesive and alloy 42/adhesive interface strength for automotive applications

    Ozturk, B., Lou, P., Gromala, P., Silber, C., Jansen, KMB. & Ernst, LJ., 2015, Proceedings of the 2015 16th INternational Conference on Thermal, Mechanical and Multi-physics Simulation and Experiments in Microelectronics and Microsystems. s.n. (ed.). Piscataway, NJ, USA: IEEE Society, p. 1-10 10 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  43. Closed form expression for residual stresses and warpage during cure of composite laminates

    Abouhamzeh, M., Sinke, J., Jansen, KMB. & Benedictus, R., 2015, In : Composite Structures. 133, 01, p. 902-910 9 p.

    Research output: Contribution to journalArticleScientificpeer-review

  44. Color shift investigations for LED secondary optical designs: Comparison between BPA-PC and PMMA

    Lu, G., Yazdan Mehr, M., van Driel, WD., Fan, X., Fan, J., Jansen, KMB. & Zhang, GQ., 2015, In : Optical Materials. 45, p. 37-41 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  45. Degradation of microcellular PET reflective materials used in LED-based products

    Lu, G., van Driel, WD., Fan, X., Yazdan Mehr, M., Fan, J., Jansen, KMB. & Zhang, GQ., 2015, In : Optical Materials. 49, November, p. 79-84 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

  46. Effect of atmospheric pressure plasma modification on polyimide and adhesive joining with titanium

    Akram, M., Jansen, KMB., Ernst, LJ., Bhowmik, S., Ajeesh, G., Ahmed, S. & Chakraborty, D., 2015, In : Metallurgical and Materials Transactions A - Physical Metallurgy and Materials Science. 46, 10, p. 4680-4687 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  47. Establishment of the mesoscale parameters for separation: A nonequilibrium molecular dynamics model

    Wong, CKY., Leung, SYY., Poelma, RH., Jansen, KMB., Yuan, CCA., van Driel, WD. & Zhang, GQ., 2015, Molecular modeling and multiscaling issues for electronic material applications - Volume 2. Wymyslowski, A., Iwamoto, N., Yuen, M. & Fan, H. (eds.). Cham, Switzerland: Springer, p. 133-148 194 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeChapterScientific

  48. Kinetic and thermo-viscoelastic characterisation of the epoxy adhesive in GLARE

    Abouhamzeh, M., Sinke, J., Jansen, KMB. & Benedictus, R., 2015, In : Composite Structures. 124, p. 19-28 10 p.

    Research output: Contribution to journalArticleScientificpeer-review

  49. Material characterization and nonlinear viscoelastic modelling of epoxy based thermosets for automotive application

    Gromala, P., Muthuraman, B., Ozturk, B., Jansen, KMB. & Ernst, LJ., 2015, Thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (EurosimE 2015), proceedings of the 16 international conference. s.n. (ed.). s.l.: IEEE Society, p. 1-7 7 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  50. Numerical prediction of residual stresses evolving during packaging of ICs

    Rezaie Adli, AR., Jansen, KMB. & Ernst, LJ., 2015, Thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (EurosimE 2015), proceedings of the 16 international conference. s.n. (ed.). Piscataway, NJ: IEEE Society, p. 1-6 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  51. Residual stresses in injection molded products

    Jansen, KMB., 2015, GT conference proceedings polymer processing with resulting morphology and properties. s.n. (ed.). s.l.: s.n., p. 1-8 8 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

  52. Simulation of the development of local panel distortions due to hot-curing adhesives

    Priesnitz, KW., Jansen, KMB., Sinke, J. & Benedictus, R., 2015, In : Journal of Materials Processing Technology. 225, p. 405-412 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  53. Two-dimensional and transient thermal model of the continuous tape laying process

    Skandali, M., Jansen, KMB., Koussios, S., Sinke, J. & Benedictus, R., 2015, Proceedings of the 20th international conference on composite materials, ICCM 20. Thomsen, OT. (ed.). s.l.: ICCM, p. 1-12 12 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  54. 2014
  55. A product based lap shear fatigue testing of electrically conductive adhesives

    Ozturk, B., Youssef, A., Gromala, P., Silber, C., Jansen, KMB. & Ernst, LJ., 2014, Proceedings 15th International Conference on Thermal, Mechanical and Multi-physics Simulation and Experiments in Microelectronics and Microsystems. Vandevelde, B. (ed.). Piscataway, NJ, USA: IEEE Society, p. 1-5 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  56. Challenges of viscoelastic characterization of low Tg epoxy based adhesives for automotive applications in DMA and relaxation experiments

    Maus, I., Preu, H., Niessner, M., Fink, M., Jansen, KMB., Pantou, R., Michel, B. & Wunderle, B., 2014, Proceedings of the 15th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems. Vandevelde, B. (ed.). Piscataway: IEEE Society, p. 1-7 7 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  57. Characterization of adhesives for microelectronic industry in DMA and relaxation experiments for interfacial fracture toughness characterization- difficulties and solution

    Maus, I., Preu, H., Niessner, M., Nabi, H., Jansen, KMB., Pantou, R., Weiss, L., Michel, B. & Wunderle, B., 2014, Proceedings of the ESTC Electronic sytem-integration technology conference 2014. s.n. (ed.). Piscataway: IEEE Society, p. 1-7 7 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  58. Experimental investigation and interpretation of the real time, in situ stress measurement during transfer molding using the piezoresistive stress chips

    Rezaie Adli, AR., Jansen, KMB., Schindler-Saefkow, F. & Rost, F., 2014, Proceedings of the 15th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems. Vandevelde, B. (ed.). Piscataway: IEEE Society, p. 1-4 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  59. Finite strain thermomechanical material characterization of adhesives used in automotive electronics for quantitative finite element simulations

    Gromala, P., Silber, C., Jansen, KMB. & Ernst, LJ., 2014, Proceedings of the16th Electronic Packaging Technology Conference - 2014. Yeo, A. & Hong Wan, NG. (eds.). Piscataway, NJ, USA: IEEE Society, p. 411-420 10 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  60. Fracture toughness of Cu-EMC interfaces in pressurized steam

    Sadeghinia, M., Jansen, KMB., Ernst, LJ., Pape, H., Maus, I., van Driel, WD. & Zhang, GQ., 2014, In : International Journal of Adhesion and Adhesives. 49, March, p. 73-79 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  61. Lifetime assessment of Bisphenol-A Polycarbonate (BPA-PC) plastic lens, used in LED-based products

    Yazdan Mehr, M., van Driel, WD., Jansen, KMB., Deeben, P. & Zhang, GQ., 2014, In : Microelectronics Reliability. 54, 1, p. 138-142 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  62. Material parameter identification by combination of stress chip measurements and FE-simulation in MERGE

    Rost, F., Schindler-Saefkow, F., Vogel, D., Rezaie Adli, AR., Jansen, KMB., Rzepka, S., Michel, B., Schaufuß, J., Tsapkolenko, A. & Nossol, P., 2014, Smart system integration conference. s.n. (ed.). s.l.: s.n., p. 1-8 8 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

  63. Measuring the mechanical relevant shrinkage during in-mold and post-mold cure with the stress chip

    Rost, F., Schindler-Saefkow, F., Rezaie Adli, AR., Jansen, KMB., Wunderle, B., Keller, J., Rzepka, S. & Michel, B., 2014, Proceedings of the 15th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems. Vandevelde, B. (ed.). Piscataway: IEEE Society, p. 1-5 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  64. The influence of fiber-matrix adhesion on the linear viscoelastic creep behavior of CF/PPS composites

    Motta Dias, MH., Jansen, KMB., Luinge, H., Nayak, K. & Bersee, HEN., 2014, AMS2014: The 1st international conference on ageing of materials and structures. s.n. (ed.). s.l.: s.n., p. 1-15 15 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  65. Thermal-electric characterization and modelling of smart composite structure for architectural applications

    Lelieveld, C. & Jansen, KMB., 2014, In : Smart Materials and Structures. 23, 6, p. 1-8 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  66. 2013
  67. Design and thermal testing of smart composite structure for architecture applications

    Lelieveld, C. & Jansen, KMB., 2013, Proceedings of the 6th ECCOMAS conference on smart structures and materials SMART 2013. Carrera, E., Miglioretti, F. & Petrolo, M. (eds.). s.l.: s.n., p. 1-11 11 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  68. Finite element based design of a new dogbone specimen for low cycle fatigue testing of highly filled epoxy-based adhesives for automotive applications

    Ozturk, B., Gromala, P., Silber, C., Jansen, KMB. & Ernst, LJ., 2013, Proceedings of the 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. van Driel, W. & et al (eds.). Piscataway, NJ, USA: IEEE Society, p. 1-4 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  69. Indentation rolling resistance of pipe belt conveyors using threedimensional generalized Maxwell viscoelastic model

    Zamiralova, M., Jansen, KMB. & Lodewijks, G., 2013, Proceedings of the 11th International Congress on Bulk Materials Storage, Handling and Transportation. Jones, M. (ed.). Calaghan, NSW, Australia: University of Newcastle, p. 1-11 11 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  70. Material complexity: 3D printing perspectives

    Doubrovski, EL., Jansen, KMB. & Geraedts, JMP., 2013, In : Inside materials (Nieuwsbrief Delft Centre for Materials). 2013, November, p. 1-2 2 p.

    Research output: Contribution to journalArticleProfessional

  71. Mechanical characterization of epoxy moulding compound in pressurized steam

    Sadeghinia, M., Jansen, KMB., Ernst, LJ. & Pape, H., 2013, In : International Journal of Adhesion and Adhesives. 40, January, p. 103-107 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  72. Photodegradation of bisphenol A polycarbonate under blue light radiation and its effect on optical properties

    Yazdan Mehr, M., van Driel, WD., Jansen, KMB., Deeben, J., Boutelje, M. & Zhang, GQ., 2013, In : Optical Materials. 35, 3, p. 504-508 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  73. Tailoring the viscoelasticity of epoxy thermosets

    Nakka, JS., Jansen, KMB. & Ernst, LJ., 2013, In : Journal of Applied Polymer Science. 128, 6, p. 3794-3806 13 p.

    Research output: Contribution to journalArticleScientificpeer-review

  74. The influence of fiber-matrix adhesion on the linear viscoelastic creep behavior of CF/PPS composites

    Motta Dias, MH., Jansen, KMB., Luinge, H., Nayak, K. & Bersee, HEN., 2013, ICSAAM 2013 The 5th international conference on structural analysis of advanced materials. s.n. (ed.). Islans of Kos, Greece: University of Patras, p. 1-15 15 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

  75. Warpage estimation of a multilayer package including cure shrinkage effects

    Jansen, KMB. & Ozturk, B., 2013, In : IEEE Transactions on Components, Packaging and Manufacturing Technology. 3, 3, p. 459-466 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  76. 2012
  77. Analytical estimate for curing-induced stress and warpage in coating layers

    Jansen, KMB., de Vreugd, J. & Ernst, LJ., 2012, In : Journal of Applied Polymer Science. 126, 5, p. 1623-1630 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  78. Characterization of adhesives and interface strength for automotive applications

    Ozturk, B., Gromala, P., Otto, C., Fischer, A., Jansen, KMB. & Ernst, LJ., 2012, Proceedings of the 13th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and Microsystems, EuroSimE 2012. s.l.: IEEE Society, p. 1-4 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  79. Characterization of the viscoelastic properties of an epoxy molding compound during cure

    Sadeghinia, M., Jansen, KMB. & Ernst, LJ., 2012, In : Microelectronics Reliability. 52, 8, p. 1711-1718 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  80. Damping model for carbon nanotube composites in sports applications

    Dwaikat, MMS., Jansen, KMB. & Spitas, C., 2012, p. 1-1. 1 p.

    Research output: Contribution to conferenceAbstractScientific

  81. Establishing the interfacial fracture properties of cu-emc interfaces at harsh condition

    Sadeghinia, M., Jansen, KMB., Ernst, LJ. & Pape, H., 2012, Proceedings of the 13th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and Microsystems, EuroSimE 2012. s.l.: IEEE Society, p. 1-4 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  82. Establishment of the coarse grained parameters for epoxy-copper interfacial separation

    Wong, KY., Leung, YY., Poelma, RH., Jansen, KMB., Yuan, CA., van Driel, WD. & Zhang, GQ., 2012, In : Journal of Applied Physics. 111, May, p. 1-7 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  83. Establishment of the coarse grained parameters for epoxy-copper interfacial separation

    Wong, KY., Leung, YY., Poelma, RH., Jansen, KMB., Yuan, CA., van Driel, WD. & Zhang, GQ., 2012, Electronic packaging technology and high density packaging (ICEPT-HDP), 2012 Proceedings of the 13th international conference. s.n. (ed.). Piscataway: IEEE Society, p. 1467-1473 7 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  84. Establishment of the mesoscale parameters for epoxy-copper interfacial separation

    Wong, CKY., Leung, SYY., Poelma, RH., Jansen, KMB., Yuan, CCA., van Driel, WD. & Zhang, GQ., 2012, 13th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (EuroSimE 2012). s.l.: IEEE Society, p. 1-6 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  85. Interfacial fracture properties of Cu-EMC interfaces at pressure cooker test conditions

    Sadeghinia, M., Jansen, KMB., Ernst, LJ. & Pape, H., 2012, Proceedings Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd. IEEE Society, p. 752-755 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  86. Residual and bending stress measurements by X-ray diffraction and synchrotron diffraction analysis in silicon solar cells

    Popovich, V., van der Pers, NM., Janssen, M., Bennett, IJ., Jansen, KMB., Wright, J. & Richardson, IM., 2012, Photovoltaic Specialists Conference (PVSC), 2012 38th IEEE. IEEE, p. 442-447 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  87. 2011
  88. Analytical estimate for cure-induced stresses and warpage in flat packages

    Jansen, KMB., de Vreugd, J. & Ernst, LJ., 2011, Proceedings of the 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011, 18-20 April 2011, Linz, Austria. Ernst, LJ., Zhang, GQ., Driel, WD. V., Rodgers, P., Bailey, C. & Saint Leger, O. D. (eds.). Linz, Austria: IEEE Society, p. 1-4 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  89. Atmospheric pressure plasma surface modification of titanium for high temperature adhesive bonding

    Akram, M., Jansen, KMB., Ernst, LJ. & Bhowmik, S., 2011, In : International Journal of Adhesion and Adhesives. 31, p. 598-604 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  90. Characterization and modeling the thermo-mechanical cure-dependent properties of epoxy molding compound

    Sadeghinia, M., Jansen, KMB. & Ernst, LJ., 2011, In : International Journal of Adhesion and Adhesives. 32, p. 82-88 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  91. Comprehensive material characterization and method of its validation by means of FEM simulation

    Gromala, P., Duerr, J., Dressler, M., Jansen, KMB., Hawryluk, ML. & de Vreugd, J., 2011, Proceedings of the 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011, 18-20 April 2011, Linz, Austria. Ernst, LJ., Zhang, GQ., Driel, WD. V., Rodgers, P., Bailey, C. & Saint Leger, O. D. (eds.). Linz, Austria: IEEE Society, p. 1-8 8 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  92. Cure dependent characterisation of moulding compounds

    Jansen, KMB., Hawryluk, ML. & Gromala, P., 2011, Proceedings of the 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011, 18-20 April 2011, Linz, Austria. Ernst, LJ., Zhang, GQ., Driel, WD. V., Rodgers, P., Bailey, C. & Saint Leger, O. D. (eds.). Linz, Austria: IEEE Society, p. 1-6 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  93. Delamination Toughness of Cu-EMC Interfaces at Harsh Environment

    Sadeghinia, M., Jansen, KMB., Ernst, LJ., Schlottig, G. & Pape, H., 2011, Proceedings of IEEE 61st Electronic Components and Technology Conference, 31 May -3 June, 2011, Lake Buena Vista, FL, USA. n.a. (ed.). Lake Buena Vista, FL, USA: IEEE Society, p. 1976-1980 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  94. Fracture toughness of Cu-EMC interfaces under pressure cooker conditions

    Sadeghinia, M., Jansen, KMB., Ernst, LJ., Schlottig, G. & Pape, H., 2011, Proceedings of the 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011, 18-20 April 2011, Linz, Austria. Ernst, LJ., Zhang, GQ., Driel, WD. V., Rodgers, P., Bailey, C. & Saint Leger, O. D. (eds.). Linz, Austria: IEEE Society, p. 1-5 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  95. Moisture absorption analysis of high performance polyimide adhesive

    Akram, M., Jansen, KMB., Bhowmik, S. & Ernst, LJ., 2011, Proceedings of SAMPE Fall Technical Conference 2011, October 17-20, 2011, Fort Worth, Texas, USA. n.a. (ed.). Fort Worth, Texas, USA: SAMPE, p. 1-9 9 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  96. Molecular dynamics study of the traction-displacement relations of epoxy-copper interfaces

    Wong, CKY., Leung, SYY., Poelma, RH., Jansen, KMB., Yuan, CA., van Driel, WD. & Zhang, GQ., 2011, 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2011). Ernst, LJ., Zhang, GQ., Driel, WD. V., Rodgers, P., Bailey, C. & Saint Leger, O. D. (eds.). Piscataway: IEEE Society, p. 1-5 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  97. 2010
  98. A fast moisture sensitivity level qualification method

    Ma, X., Jansen, KMB., Zhang, GQ., van Driel, WD., van der Sluis, O., Ernst, LJ., Regards, C., Gautier, C. & Frémont, H., 2010, In : Microelectronics Reliability. 50, 2010, p. 1654-1660 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  99. Delamination and combined compound cracking of EMC-copper interfaces

    Xiao, A., Schlottig, G., Pape, H., Wunderle, B., Jansen, KMB. & Ernst, LJ., 2010, Proceedings of the 60th Electronic Components and Technology Conference (ECTC), 1-4 June 2010, Las Vegas, NV, USA. n.a. (ed.). Las Vegas, NV, USA: IEEE Society, p. 114-120 7 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  100. Die attach interface property characterization as function of temperature using cohesive zone modeling method

    Ma, X., Zhang, GQ., van der Sluis, O., Jansen, KMB., van Driel, WD. & Ernst, LJ., 2010, Proceedings of the 11th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2010, 26-28 April 2010, Bordeaux, France. Ernst, LJ, Zhang, GQ, Driel, WD van, Rodgers, P, Bailey, C & Saint Leger, O de (eds.). Bordeaux, France: IEEE Society, p. 1-8 8 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  101. High temperature storage influence on molding compound properties

    de Vreugd, J., Jansen, KMB., Ernst, LJ., Bohm, C. & Pufall, R., 2010, Proceedings of the 11th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2010, 26-28 April 2010, Bordeaux, France. Ernst, LJ, Zhang, GQ, Driel, WD van, Rodgers, P, Bailey, C & Saint Leger, O. de (eds.). IEEE Society, p. 1-6 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  102. Interfacial fracture parameters of silicon-to-molding compound

    Schlottig, G., Maus, I., Walter, H., Jansen, KMB., Pape, H., Wunderle, B. & Ernst, LJ., 2010, Proceedings 60th Electronic Components and Technology Conference (ECTC), 1-4- June 2010, Las Vegas, NV, USA. n.a. (ed.). IEEE Society, p. 1939-1945 7 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  103. Prediction of cure induced warpage of micro-electronic products

    de Vreugd, J., Jansen, KMB., Ernst, LJ. & Bohm, C., 2010, In : Microelectronics Reliability. 50, p. 910-916 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  104. Procedure to determine interfacial toughness of EMC-copper (oxide) interfaces

    Xiao, A., Pape, H., Schlottig, G., Wunderle, W., Leung, YY., Jansen, KMB. & Ernst, LJ., 2010, Proceedings of the 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 16-19 August 2010, Xi'an, China. n.a. (ed.). Xi'an, China: IEEE Society, p. 356-362 7 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  105. Surface modification of polyimide by atmospheric pressure plasma for adhesive bonding with titanium and its application to aviation and space

    Akram, M., Bhowmik, S., Jansen, KMB. & Ernst, LJ., 2010, Proceedings of the SAMPE USA 2010 Conference and Exhibition, 17-20 May 2010, Seattle, WA, USA. s.n. (ed.). Seattle, WA, USA: SAMPE USA, p. 1-10 10 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  106. Surface modification of titanium by atmospheric pressure plasma treatment for adhesive bonding and its application to aviation and space

    Akram, M., Bhowmik, S., Jansen, KMB. & Ernst, LJ., 2010, Proceedings of SEICO 10, SAMPE Europe 31st International Technical Conference and Forum, 12-14 April 2010, Paris, France. n.a. (ed.). Paris, France: SEICO, p. 188-194 7 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  107. Theory of aluminum metallization corrosion in microelectronics

    van Soestbergen, M., Mavinkurve, A., Rongen, RTH., Jansen, KMB., Ernst, LJ. & Zhang, GQ., 2010, In : Electrochimica Acta. 55, p. 5459-5469 11 p.

    Research output: Contribution to journalArticleScientificpeer-review

  108. Thermal aging of molding compounds

    Jansen, KMB., de Vreugd, J., Ernst, LJ. & Bohm, C., 2010, Proceedings of the 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 16-19 August 2010, Xi'an, China. n.a. (ed.). Xi'an, China: IEEE Society, p. 778-780 3 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  109. 2009
  110. A New Method to Measure the Moisture Expansion in Plastic Packaging Materials

    Ma, X., Jansen, KMB., Ernst, LJ., van Driel, WD., van der Sluis, O. & Zhang, GQ., 2009, Proceedings of the 2009 Electronic Components and Technology Conference, ECTC2009, May 26-29, 2009, San Diego, CA, USA. Banda, R., Trewhella, J. & Bezuk, S. (eds.). IEEE Society, p. 1271-1276 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

  111. Characterization of physical and viscoelastic properties of polymer films for coating applications under different temperature of drying and storage

    Perfetti, G., Jansen, KMB., wildeboer, W. J., Hee, P. V. & Meesters, GMH., 2009, In : International Journal of Pharmaceutics. 384, p. 109-119 11 p.

    Research output: Contribution to journalArticleScientificpeer-review

  112. Comprehensive Material Characterization of Organic Packaging Materials

    Boehme, B., Jansen, KMB., Rzepka, S. & Wolter, K-J., 2009, Proceedings of the 10th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2009, April 27-29, 2009, Delft, The Netherlands. Ernst, LJ, Zhang, GQ, Driel, WD van, Rodgers, P, Bailey, C & Saint Leger, O de (eds.). Delft, The Netherlands: EuroSimE, p. 289-296 8 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

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