1. 2020
  2. Design and characterization of variable stiffness structural joints

    Wang, Q., Senatore, G., Jansen, K., Habraken, A. & Teuffel, P., 1 Feb 2020, In : Materials and Design. 187, 108353.

    Research output: Contribution to journalArticleScientificpeer-review

  3. 2019
  4. Creep behaviour of FM906 glass-fibre epoxy as used in heated fibre metal laminates

    Hagenbeek, M., Dias, M. M., Sinke, J. & Jansen, K., Nov 2019, In : Journal of Composite Materials. 53, 26-27, p. 3829-3840 12 p.

    Research output: Contribution to journalArticleScientificpeer-review

  5. 3D Printed Actuators: Reversibility, Relaxation, and Ratcheting

    Zhao, S. C., Maas, M., Jansen, K. & van Hecke, M., 2019, In : Advanced Functional Materials. 29, 51, 8 p., 1905545.

    Research output: Contribution to journalArticleScientificpeer-review

  6. Fabrication factors influencing mechanical, moisture- and water-related properties of mycelium-based composites

    Appels, F. V. W., Camere, S., Montalti, M., Karana, E., Jansen, K. M. B., Dijksterhuis, J., Krijgsheld, P. & Wösten, H. A. B., 2019, In : Materials and Design. 161, p. 64-71 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  7. How to shape the future of smart clothing

    Jansen, K. M. B., 2019, UbiComp/ISWC 2019- - Adjunct Proceedings of the 2019 ACM International Joint Conference on Pervasive and Ubiquitous Computing and Proceedings of the 2019 ACM International Symposium on Wearable Computers. Harle, R., Farrahi, K. & Lane, N. (eds.). New York, USA: Association for Computing Machinery (ACM), p. 1037-1039 3 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  8. Location optimisation for IMUs in the design of motion tracking soccer tights based on Soft Tissue Artefact analysis

    Ahsmann, L., Steijlen, A., Wilmes, E., Jansen, K. & Huysmans, T., 2019. 1 p.

    Research output: Contribution to conferenceAbstractScientific

  9. Smart textiles: How electronics merge into our clothing

    Jansen, K. M. B., 2019, 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019. Piscataway, NJ, USA: Institute of Electrical and Electronics Engineers Inc., 4 p. 8724586

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  10. What Does My Shirt Tell Me? The Integrating of Electronics in Clothing

    Jansen, K. M. B., 2019, 2019 Pan Pacific Microelectronics Symposium (Pan Pacific). Piscataway, NJ, USA: IEEE, p. 1-4 4 p. 8696601

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  11. 2018
  12. A novel 12-lead electrocardiographic system for home use: Development and usability testing

    Steijlen, A., Jansen, K., Albayrak, A., Verschure, D. O. & Van Wijk, D. F., 2018, In : JMIR mHealth and uHealth. 6, 7, p. 1-14 14 p., e10126.

    Research output: Contribution to journalArticleScientificpeer-review

  13. Disposable, stretchable on-skin sensors for posture monitoring

    Jansen, K., Tarren, B. & Slingerland, M., 2018, WearSys 2018 : Proceedings of the 4th ACM Workshop on Wearable Systems and Applications. New York, NY: Association for Computing Machinery (ACM), p. 1-4 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  14. Hydrophobin gene deletion and environmental growth conditions impact mechanical properties of mycelium by affecting the density of the material

    Appels, F. V. W., Dijksterhuis, J., Lukasiewicz, C. E., Jansen, K., Wösten, H. A. B. & Krijgsheld, P., 2018, In : Scientific Reports. 8, 1, p. 1-7 7 p., 4703.

    Research output: Contribution to journalArticleScientificpeer-review

  15. Thermal aging modeling of molding compound under high-temperature storage and temperature cycling conditions

    Zhang, B., Johlitz, M., Lion, A., Ernst, L. J., Jansen, K., Vu, D-K. & Weiss, L., 2018, 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018. Piscataway, NJ: IEEE, p. 1-5 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  16. Towards High Performance Metal–Organic Framework–Microporous Polymer Mixed Matrix Membranes: Addressing Compatibility and Limiting Aging by Polymer Doping

    Sabetghadam, A., Liu, X., Orsi, A. F., Lozinska, M. M., Johnson, T., Jansen, K., Wright, P. A., Carta, M., McKeown, N. B., Kapteijn, F. & Gascon, J., 2018, In : Chemistry - A European Journal. 24, 49, p. 12796-12800

    Research output: Contribution to journalArticleScientificpeer-review

  17. WearSys'2018 chairs' welcome

    Jansen, K. & Ashok, A., 2018, WearSys 2018 : Proceedings of the 4th ACM Workshop on Wearable Systems and Applications. Jansen, K. & Mortier, R. (eds.). p. ii

    Research output: Chapter in Book/Report/Conference proceedingForeword/postscriptScientific

  18. 2017
  19. Characterization of epoxy based highly filled die attach materials in microelectronics

    Maus, I., Liebl, C., Fink, M., Vu, D-K., Hartung, M., Preu, H., Jansen, K., Michel, B., Wunderle, B. & Weiss, L., 2017, 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017. IEEE, p. 1-7 7 p. 7926237

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  20. Designing of a semi-transparent Electroluminescent Umbrella

    Jansen, K., Claus, S. & Barati, B., 2017, Smart Systems Integration 2017: International Conference and Exhibition on Integration Issues of Miniaturized Systems. Otto, T. (ed.). Mesago Messe Frankfurt GmbH, p. 123-129 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  21. Effects of automated tape laying heating strategies on degree of cure

    Skandali, M., Koussios, S., Sinke, J., Benedictus, R., de Mooij, C. & Jansen, K., 2017, SAMPE Europe Conference 16 Liege. New york: Curran Associates, Inc., p. 175-186 12 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  22. Modelling of Thermal Aging of Moulding Compound by using an Equivalent Layer Assumption

    Zhang, B., Lion, A., Johlitz, M., Ernst, L., Jansen, K., Vu, D-K. & Weiss, L., 2017, 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017. IEEE, p. 1-6 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  23. Prediction of thermopysiological responses to local skin cooling using the Fiala thermophysiological model

    Bogerd, N. & Jansen, K., 2017, p. 167-167. 1 p.

    Research output: Contribution to conferenceAbstractScientific

  24. Smart thermoregulating garments

    Jansen, K. & Bogerd, N., 2017, Alive Active Adaptive: International Conference on Experiential Knowledge and Emerging Materials EKSIG 2017. Karana, E., Giaccardi, E., Nimkulrat, N., Niedderer, K. & Camere, S. (eds.). Delft: TU Delft Open, p. 359-363 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  25. Understanding autonomy, animism and presence as a design strategy for behavior change

    Li, X., Rozendaal, M., Jansen, K. & Jonker, C., 2017, p. 1-6. 6 p.

    Research output: Contribution to conferenceAbstractScientific

  26. 2016
  27. Aging of epoxy moulding compound: Thermomechanical properties during high temperature storage

    Zhang, B., Johlitz, M., Lion, A., Ernst, L., Jansen, K., Vu, D-K. & Weiss, L., 2016, Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE): 2016 17th International Conference. Piscataway: IEEE Society, p. 1-6 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  28. Atmospheric plasma modification of polyimide sheet for joining to titanium with high temperature adhesive

    Akram, M., Jansen, KMB., Ernst, LJ. & Bhowmik, S., 2016, In : International Journal of Adhesion and Adhesives. 65, p. 63-69

    Research output: Contribution to journalArticleScientificpeer-review

  29. Colour shift and mechanism investigation on the PMMA diffuser used in LED-based luminaires

    Lu, G., van Driel, WD., Fan, X., Yazdan Mehr, M., Fan, J., Qian, C., Jansen, KMB. & Zhang, GQ., 2016, In : Optical Materials. 54, p. 282-287 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

  30. Composition dependent properties of graphene (oxide)-alginate biopolymer nanocomposites

    Vilcinskas, K., Jansen, K. M. B., Mulder, F. M., Picken, S. J. & Koper, G. J. M., 2016, In : Polymer Composites. 39 (2018), S1, p. E236-E249

    Research output: Contribution to journalArticleScientificpeer-review

  31. Effect of fiber-matrix adhesion on the creep behavior of CF/PPS composites: Temperature and physical aging characterization

    Motta Dias, MH., Jansen, KMB., Luinge, JW., Bersee, HEN. & Benedictus, R., 2016, In : Mechanics of Time Dependent Materials: an international journal devoted to the time-dependent behaviour of materials and structures. 10, 2, p. 245-262 18 p.

    Research output: Contribution to journalArticleScientificpeer-review

  32. Functional Demonstrators to Support Understanding of Smart Materials

    Barati, B., Karana, E., Jansen, K. & Hekkert, P., 2016, TEI'16 Proceedings of the TEI'16: Tenth International Conference on Tangible, Embedded and Embodied Internaction. Broekhuijsen, M. (ed.). New York: Association for Computing Machinery (ACM), p. 386-391 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  33. Mechanical characterization of a shape morphing smart composite with embedded shape memory alloys in a shape memory polymer matrix

    Lelieveld, C., Jansen, K. & Teuffel, P., 2016, In : Journal of Intelligent Material Systems and Structures. 27, 15, p. 2038-2048 11 p.

    Research output: Contribution to journalArticleScientificpeer-review

  34. Numerical investigation and experimental validation of residual stresses building up in microelectronics packaging

    Rezaie Adli, A. & Jansen, K., 2016, In : Microelectronics Reliability. 60, p. 26-38 13 p.

    Research output: Contribution to journalArticleScientificpeer-review

  35. Thermo-viscoelastic analysis of GLARE

    Abouhamzeh, M., Sinke, J., Jansen, K. M. B. & Benedictus, R., 2016, In : Composites Part B: Engineering. 99, p. 1-8 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  36. Water Sorption and Diffusion in (Reduced) Graphene Oxide-Alginate Biopolymer Nanocomposites

    Vilcinskas, K., Zlopasa, J., Jansen, K. M. B., Mulder, F. M., Picken, S. J. & Koper, G. J. M., 2016, In : Macromolecular Materials and Engineering. 301, 9, p. 1049-1063 15 p.

    Research output: Contribution to journalArticleScientificpeer-review

  37. 2015
  38. A new procedure for thermo-viscoelastic modelling of composites with general orthotropy and geometry

    Abouhamzeh, M., Sinke, J., Jansen, KMB. & Benedictus, R., 2015, In : Composite Structures. 133, p. 871-877 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  39. Characterization and simulation of LTCC/adhesive and alloy 42/adhesive interface strength for automotive applications

    Ozturk, B., Lou, P., Gromala, P., Silber, C., Jansen, KMB. & Ernst, LJ., 2015, Proceedings of the 2015 16th INternational Conference on Thermal, Mechanical and Multi-physics Simulation and Experiments in Microelectronics and Microsystems. s.n. (ed.). Piscataway, NJ, USA: IEEE Society, p. 1-10 10 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  40. Closed form expression for residual stresses and warpage during cure of composite laminates

    Abouhamzeh, M., Sinke, J., Jansen, KMB. & Benedictus, R., 2015, In : Composite Structures. 133, 01, p. 902-910 9 p.

    Research output: Contribution to journalArticleScientificpeer-review

  41. Color shift investigations for LED secondary optical designs: Comparison between BPA-PC and PMMA

    Lu, G., Yazdan Mehr, M., van Driel, WD., Fan, X., Fan, J., Jansen, KMB. & Zhang, GQ., 2015, In : Optical Materials. 45, p. 37-41 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  42. Degradation of microcellular PET reflective materials used in LED-based products

    Lu, G., van Driel, WD., Fan, X., Yazdan Mehr, M., Fan, J., Jansen, KMB. & Zhang, GQ., 2015, In : Optical Materials. 49, November, p. 79-84 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

  43. Effect of atmospheric pressure plasma modification on polyimide and adhesive joining with titanium

    Akram, M., Jansen, KMB., Ernst, LJ., Bhowmik, S., Ajeesh, G., Ahmed, S. & Chakraborty, D., 2015, In : Metallurgical and Materials Transactions A - Physical Metallurgy and Materials Science. 46, 10, p. 4680-4687 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  44. Establishment of the mesoscale parameters for separation: A nonequilibrium molecular dynamics model

    Wong, CKY., Leung, SYY., Poelma, RH., Jansen, KMB., Yuan, CCA., van Driel, WD. & Zhang, GQ., 2015, Molecular modeling and multiscaling issues for electronic material applications - Volume 2. Wymyslowski, A., Iwamoto, N., Yuen, M. & Fan, H. (eds.). Cham, Switzerland: Springer, p. 133-148 194 p.

    Research output: Chapter in Book/Report/Conference proceedingChapterScientific

  45. Kinetic and thermo-viscoelastic characterisation of the epoxy adhesive in GLARE

    Abouhamzeh, M., Sinke, J., Jansen, KMB. & Benedictus, R., 2015, In : Composite Structures. 124, p. 19-28 10 p.

    Research output: Contribution to journalArticleScientificpeer-review

  46. Material characterization and nonlinear viscoelastic modelling of epoxy based thermosets for automotive application

    Gromala, P., Muthuraman, B., Ozturk, B., Jansen, KMB. & Ernst, LJ., 2015, Thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (EurosimE 2015), proceedings of the 16 international conference. s.n. (ed.). s.l.: IEEE Society, p. 1-7 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  47. Numerical prediction of residual stresses evolving during packaging of ICs

    Rezaie Adli, AR., Jansen, KMB. & Ernst, LJ., 2015, Thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (EurosimE 2015), proceedings of the 16 international conference. s.n. (ed.). Piscataway, NJ: IEEE Society, p. 1-6 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  48. Residual stresses in injection molded products

    Jansen, KMB., 2015, GT conference proceedings polymer processing with resulting morphology and properties. s.n. (ed.). s.l.: s.n., p. 1-8 8 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  49. Simulation of the development of local panel distortions due to hot-curing adhesives

    Priesnitz, KW., Jansen, KMB., Sinke, J. & Benedictus, R., 2015, In : Journal of Materials Processing Technology. 225, p. 405-412 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  50. Two-dimensional and transient thermal model of the continuous tape laying process

    Skandali, M., Jansen, KMB., Koussios, S., Sinke, J. & Benedictus, R., 2015, Proceedings of the 20th international conference on composite materials, ICCM 20. Thomsen, OT. (ed.). s.l.: ICCM, p. 1-12 12 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  51. 2014
  52. A product based lap shear fatigue testing of electrically conductive adhesives

    Ozturk, B., Youssef, A., Gromala, P., Silber, C., Jansen, KMB. & Ernst, LJ., 2014, Proceedings 15th International Conference on Thermal, Mechanical and Multi-physics Simulation and Experiments in Microelectronics and Microsystems. Vandevelde, B. (ed.). Piscataway, NJ, USA: IEEE Society, p. 1-5 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  53. Challenges of viscoelastic characterization of low Tg epoxy based adhesives for automotive applications in DMA and relaxation experiments

    Maus, I., Preu, H., Niessner, M., Fink, M., Jansen, KMB., Pantou, R., Michel, B. & Wunderle, B., 2014, Proceedings of the 15th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems. Vandevelde, B. (ed.). Piscataway: IEEE Society, p. 1-7 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  54. Characterization of adhesives for microelectronic industry in DMA and relaxation experiments for interfacial fracture toughness characterization- difficulties and solution

    Maus, I., Preu, H., Niessner, M., Nabi, H., Jansen, KMB., Pantou, R., Weiss, L., Michel, B. & Wunderle, B., 2014, Proceedings of the ESTC Electronic sytem-integration technology conference 2014. s.n. (ed.). Piscataway: IEEE Society, p. 1-7 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  55. Experimental investigation and interpretation of the real time, in situ stress measurement during transfer molding using the piezoresistive stress chips

    Rezaie Adli, AR., Jansen, KMB., Schindler-Saefkow, F. & Rost, F., 2014, Proceedings of the 15th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems. Vandevelde, B. (ed.). Piscataway: IEEE Society, p. 1-4 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  56. Finite strain thermomechanical material characterization of adhesives used in automotive electronics for quantitative finite element simulations

    Gromala, P., Silber, C., Jansen, KMB. & Ernst, LJ., 2014, Proceedings of the16th Electronic Packaging Technology Conference - 2014. Yeo, A. & Hong Wan, NG. (eds.). Piscataway, NJ, USA: IEEE Society, p. 411-420 10 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

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