1. 2001
  2. Time dependent behavior of molding compound in packaging

    Wisse, G., Jansen, KMB., Ernst, LJ., Kiasat, MS. & et al, ., 2001, 13th European microelectronics and packaging conference, May 30-31. Reston: International Microelectronics and Packaging Society, p. 389-392 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  3. Viscosity of surfactant stabilized emulsions

    Jansen, KMB., Agterof, WGM. & Mellema, J., 2001, In : Journal of Rheology. 45, 6, p. 1359-1371 13 p.

    Research output: Contribution to journalArticleScientific

  4. 2002
  5. On the effect of cure-residual stress on flip chip failure prediction

    Ernst, LJ., Yang, D., Jansen, KMB., van t Hof, C., Zhang, GQ. & van Driel, WD., 2002, Proceedings of 4th electronics packaging technology conference (EPTC 2002). Lee, C., Chuan, TK. & Iyer, MK. (eds.). Piscataway: IEEE Society, p. 398-403 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  6. The state-of-the-art of thermo-mechanical characterisation of thin polymer films

    Pelletier, C., Bressers, HJL., Zhang, GQ., Jansen, KMB., Gonda, V. & Ernst, LJ., 2002, 3rd international conference on benefiting from thermal and mechanical simulation in (micro)electronics. Ernst, LJ., Zhang, GQ., Dudek, R. & de Saint Leger, O. (eds.). Piscataway: The Institute of Electrical and Electronics Engineers, p. 293-300 8 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  7. 2003
  8. Micromechanical modeling of stress evolution induced during cure in a particle-filled electronic packaging polymer

    Yang, D., Jansen, KMB., Wang, L., Ernst, LJ., Zhang, GQ. & Bressers, HJL., 2003, Thermal & mechanical simulation and experiments in microelectronics and microsystems. Ernst, LJ., Zhang, GQ., Dudek, R. & de Saint Leger, O. (eds.). Piscataway: IEEE Society, p. 57-62 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  9. Progressive failure modelling of notched composite laminates and its experimental verification

    Liu, CJ., Jansen, KMB., Ernst, LJ. & Marissen, R., 2003, ICCM-14. s.n. (ed.). Dearborn: Society of Manufacturing engineers, p. 1-12 12 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  10. Recent developments in thermal mechanical modeling of the curing process of filled thermoset polymers

    Ernst, LJ., Jansen, KMB., van t Hof, C., Yang, DG., Zhang, GQ. & Bressers, HJL., 2003, Proceedings of the 10th international conference on mechanics and technology of composite materials. Naidenov, V., Stoyanov, V. & Rostovsky, I. (eds.). s.l.: s.n., p. 38-44 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  11. Solders fatigue prediction using interfacial boundary volume criterion

    Ernst, LJ., Zhang, GQ., Jansen, KMB. & Bressers, HJL., 2003, In : Journal of Electronic Packaging. 125, 4, p. 582-588 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  12. Time- and tempearature-dependent thermo-mechanical modeling of a packaging molding compound and its effect on packaging process stresses

    Ernst, LJ., Zhang, GQ., Jansen, KMB. & Bressers, HJL., 2003, In : Journal of Electronic Packaging. 125, 4, p. 539-548 10 p.

    Research output: Contribution to journalArticleScientificpeer-review

  13. Warpage-based optimization of the curing profile for electronic packaging polymers

    Yang, DG., Jansen, KMB., Li, QY., Liang, JS., Ernst, LJ. & Zhang, GQ., 2003, ICEPT 2003. Bi, K., Barnwell, PG. & Wang, J. (eds.). Piscataway: IEEE Society, p. 345-350 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  14. 2004
  15. A novel tool for cure dependent viscoelastic characterization of packaging polymers

    van t Hof, C., Wisse, G., Ernst, LJ., Jansen, KMB., Yang, D., Zhang, GQ. & Bressers, HJL., 2004, EuroSimE 2004: 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems. Ernst, LJ., Zhang, GQ., Rodgers, P. & de Saint Leger, O. (eds.). Piscataway: IEEE Society, p. 385-389 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  16. Constitutive modeling of moulding compounds

    Jansen, KMB., WANG, L., Yang, D., van t Hof, C., Ernst, LJ., Bressers, HJL. & Zhang, GQ., 2004, 54th electronic components and technology conference. Vol. 2. S.n. (ed.). Piscataway: IEEE Society, p. 1-5 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  17. Cure, temperature and time dependent constitutive of moulding compounds

    Jansen, KMB., WANG, L., van t Hof, C., Ernst, LJ., Bressers, HJL. & Zhang, GQ., 2004, EuroSimE 2004: 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems. Ernst, LJ., Zhang, GQ., Rodgers, P. & de Saint Leger, O. (eds.). Piscataway: IEEE Society, p. 581-585 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  18. From chemical building blocks of polymers to microelectronics reliability

    Bressers, HJL., van Driel, WD., Jansen, KMB., Ernst, LJ. & Zhang, GQ., 2004, EuroSimE 2004: 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems. Ernst, LJ., Zhang, GQ., Rodgers, P. & de Saint Leger, O. (eds.). Piscataway: IEEE Society, p. 621-625 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  19. Fully cure-dependent polymer modeling and application to QFN-packages warpage

    Yang, D., Ernst, LJ., Jansen, KMB., van t Hof, C., Zhang, GQ., van Driel, WD. & Bressers, HJL., 2004, EPTC 2004: 6th electronic packaging technology Conference. Toh, KC., Mui, YC., How, J. & Pang, JHL. (eds.). S.l.: IEEE CPMT Society, p. 87-91 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  20. Mechanical characterization of SiLK by Nanoindentation and substrate curvature techniques

    Gonda, V., Jansen, KMB., Ernst, LJ., den Toonder, J. & Zhang, GQ., 2004, EuroSimE 2004: 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems. Ernst, LJ., Zhang, GQ., Rodgers, P. & de Saint Leger, O. (eds.). Piscataway: IEEE Society, p. 373-376 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  21. Micromechanical modeling of stress evolution induced during cure in a particle-filled electronic packaging polymer

    Yang, D., Jansen, KMB., WANG, L., Ernst, LJ., Zhang, GQ., Bressers, HJL. & Fan, X., 2004, In : IEEE Transactions on Components and Packaging Technology. 27, 4, p. 676-683 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  22. Modeling of cure-induced warpage of plastic IC packages

    Yang, D., Jansen, KMB., Ernst, LJ., Zhang, GQ., van Driel, WD. & Bressers, HJL., 2004, EuroSimE 2004: 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems. Ernst, LJ., Zhang, GQ., Rodgers, P. & de Saint Leger, O. (eds.). Piscataway: IEEE Society, p. 33-40 8 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  23. Network density as scaling parameter for thermoset viscoelasticity

    Jansen, KMB., van Buchem, B., Bressers, HJL. & Ernst, LJ., 2004, 40th international symposium on macromolecules. S.n. (ed.). s.n., p. 1-2 2 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  24. Prediction of process-induced warpage of IC packages encapsulated with thermosetting polymers

    Yang, D., Jansen, KMB., Ernst, LJ., Zhang, GQ., van Driel, WD., Bressers, HJL. & Fan, XJ., 2004, 54th electronic components and technology conference. Vol. 2. S.n. (ed.). Piscataway: IEEE, p. 98-105 8 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  25. State dependent constitutive modeling of curing molding compounds

    Ernst, LJ., Jansen, KMB., Yang, D., van t Hof, C., Bressers, HJL. & Zhang, GQ., 2004, EMAP 2004: 6th international conference on electronic materials and packaging. Ripin, ZM., Seetharamu, KN., Abdullah, MZ., Samad, Z. & Shuib, S. (eds.). S.l.: IEEE CPMT, p. 23-29 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  26. 2005
  27. Bending and stretching studies on ultra-thin silicon substrates

    Wang, L., Jansen, KMB., Bartek, M., Poliakov, A. & Ernst, LJ., 2005, Proceedings of the 6th international conference on electronics packaging technology. Keyun, B. & Chunqing, W. (eds.). Piscataway: IEEE Society, p. 682-686 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  28. Electronics on deformable ultra-thin substrates

    Bartek, M., Poliakov, A., Wang, L., Jansen, KMB. & Ernst, LJ., 2005, Proceedings of the 2nd International wafer-level packaging congress (IWLPC). s.n. (ed.). SMTA, p. 16-21 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  29. Experimental and numerical investigation on warpage of QFN packages induced during the array molding process

    Yang, D., Jansen, KMB., Ernst, LJ., Zhang, GQ., Beijer, JGJ. & Janssen, JHJ., 2005, Polytronic 2005 - Proceedings of the 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics. Dziedzic, A. & Felba, J. (eds.). Piscataway: IEEE Society, p. 1-5 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  30. Experimental and numerical investigation on warpage of QFN packages induced during the array molding process

    Yang, D., Jansen, KMB., Ernst, LJ., Zhang, GQ., Beijer, JGJ. & Janssen, JHJ., 2005, Proceedings of 2005 6th International Conference on Electronic Packaging Technology. Keyun, Bi, Chunqing & Wang (eds.). Piscataway, New Jersey: IEEE Society, p. 94-98 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  31. Flexibility studies on ultra-thin silicon substrates

    Wang, L., Bartek, M., Poliakov, A., Jansen, KMB. & Ernst, LJ., 2005, Proceedings of the STW annual workshop on semiconductor advances for future electronics and sensors (SAFE 2005). Krautschneider, W. (ed.). Utrecht: Technology Stichting STW, p. 175-180 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  32. Measuring and modeling the cure-dependent rubbery moduli of epoxy molding compound

    Yang, DG., Jansen, KMB., Ernst, LJ., Zhang, GQ., Bressers, HJL. & Jansen, JHJ., 2005, Proceedings of the 6th international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems. Ernst, LJ., Zhang, GQ., Rodgers, P., Marco, S. & de Saint Leger, O. (eds.). Piscataway: IEEE Society, p. 120-125 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  33. Process-induced warpage in HVQFN package: effect of design parameters and processing conditions

    Yang, D., Ernst, LJ., Jansen, KMB., Zhang, GQ., Janssen, JHJ. & Bressers, HJL., 2005, Polytronic 2005 - Proceedings of the 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics. Dziedzic, A. & Felba, J. (eds.). Piscataway: IEEE Society, p. 25-29 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  34. State-of-the-Art of Thermo-Mechanical Characterization of Thin Polymer Films

    Jansen, KMB., Gonda, V., Ernst, LJ., Bressers, HJL. & Zhang, GQ., 2005, In : Journal of Electronic Packaging. 127, p. 530-536 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  35. Study of the Effects of Molding Pressure on the Warpage of HVQFN Packages

    Gui, DY., Ernst, LJ., Jansen, KMB., Yang, D., Goumans, L., Bressers, HJL. & Janssen, JHJ., 2005, Proceedings of 2005 6th International Conference on Electronic Packaging Technology. Keyun, Bi, Chunqing & Wang (eds.). Piscataway, New Jersey: IEEE Society, p. 338-343 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  36. Viscoelastic characterization of fast curing moulding compounds

    Milosheva, BV., Jansen, KMB., Jansen, JHJ., Bressers, HJL. & Ernst, LJ., 2005, Proceedings of the 6th international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems. Ernst, LJ., Zhang, GQ., Rodgers, P., Marco, S. & de Saint Leger, O. (eds.). Piscataway: IEEE Society, p. 462-467 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  37. Warpage minimization of the HVQFN map mould

    Beijer, JGJ., Jansen, JHJ., Bressers, HJL., van Driel, WD., Jansen, KMB., Yang, DG. & Zhang, GQ., 2005, Proceedings of the 6th international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems. Ernst, LJ., Zhang, GQ., Rodgers, P., Marco, S. & de Saint Leger, O. (eds.). Piscataway: IEEE Society, p. 168-174 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  38. 2006
  39. Filler Contents Effects on the Moisture Absorption and Viscoelasticity of Thermosetting IC Packaging Polymers

    Ma, X., Jansen, KMB., Zhang, GQ. & Ernst, LJ., 2006, Proceedings of 2006 7th International Conference on Electronics Packaging Technology. Sheng Liu (ed.). Shanghai. China: Institute of Electrical and Electronics Engineers (IEEE), p. 161-165 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  40. Flexible interconnects for deformable ultra-thin substrates

    Zoumpoulidis, T., WANG, L., Bartek, M., Jansen, KMB., Polyakov, A., Sosin, S., Ernst, LJ., Dekker, R. & Burghartz, JN., 2006, Proc. 39th International Symposium on Microelectronics. s.n. (ed.). Washington: IMAPS, p. 204-210 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  41. Fully Cure-Dependent Modeling and Characterization of EMC's with Application to Package Warpage Simulation

    Ernst, LJ., Jansen, KMB., Saraswat, MK., van t Hof, C., Zhang, GQ., Yang, DG. & Bressers, HJL., 2006, Proceedings of 2006 7th International Conference on Electronics Packaging Technology. Sheng Liu (ed.). Shanghai, China: Institute of Electrical and Electronics Engineers (IEEE), p. 123-129 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  42. Fully Cure-Dependent Modelling and Characterization of EMC's with Application to Package Warpage Simulation

    Ernst, LJ., Jansen, KMB., Saraswat, MK., Zhang, GQ., Yang, D., van t Hof, C. & Bressers, HJL., 2006, Proceedings 2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties, and Interfaces. sn (ed.). Atlanta, GA, USA: IEEE Society, p. 23-27 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  43. Hygroscopic Effects on Swelling and Viscoelasticity of Electronic Packaging Epoxy

    Ma, X., Jansen, KMB., Zhang, GQ. & Ernst, LJ., 2006, Proceedings of 2006 7th International Conference on Electronics Packaging Technology. Sheng Liu (ed.). Shanghai, China: Institute of Electrical and Electronics Engineers (IEEE), p. 262-266 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  44. Measuring in-thickness mechanical properties of sub micron polymer dielectric films

    van Soestbergen, M., Ernst, LJ., Jansen, KMB., van Driel, WD., Bartek, M. & Polyakov, A., 2006, Proceedings of the 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006. Ernst, L.J., Zhang, G.Q., Rodgers, P., Marco, S., Meuwissen, M. & Saint Leger, O. de (eds.). Como, Italy: EuroSimE, p. 1-5 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  45. Mechanical Characterization Analysis of a Segmented Silicon Layer on Ultra-thin Polyimide Substrates by Experiment and FE Simulation

    Wang, L., Jansen, KMB., Bartek, M., Polyakov, A. & Ernst, LJ., 2006, Proceedings of the 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006. Ernst, L.J., Zhang, G.Q., Rodgers, P., Marco, S., Meuwissen, M. & Saint Leger, O. de (eds.). Como, Italy: EuroSimE, p. 1-6 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  46. Mechanical Properties of Polymer Dielectric Films at Elevated Temperatures

    van Soestbergen, M., Ernst, LJ., Jansen, KMB. & van Driel, WD., 2006, Proceedings of 2006 7th International Conference on Electronics Packaging Technology. Sheng Liu (ed.). Shanghai, China: Institute of Electrical and Electronic Engineers, Inc., p. 664-667 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  47. Mechanical characterization of microelectronics embedded in flexible and stretchable substrate

    WANG, L., Zoumpoulidis, T., Bartek, M., Poliakov, A., Jansen, KMB. & Ernst, LJ., 2006, Proc. 8th Electronics Packaging Technology Conference (EPTC 2006). Pang, JHL. (ed.). Piscataway: IEEE Society, p. 766-772 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  48. Mechanical characterization of microelectronics embedded in flexible substrate

    Zoumpoulidis, T., WANG, L., Bartek, M., Polyakov, A., Jansen, KMB. & Ernst, LJ., 2006, Proceedings of 2006 7th International Conference on Electronics Packaging Technology. Sheng Liu (ed.). Shanghai, China: Institute of Electrical and Electronics Engineers (IEEE), p. 672-678 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  49. Moisture Effects on the Creep of Thermosetting IC Packaging Polymers

    Ma, X., Jansen, KMB. & Ernst, LJ., 2006, Proceedings of the 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006. Ernst, L.J., Zhang, G.Q., Rodgers, P., Marco, S., Meuwissen, M. & Saint Leger, O. de (eds.). Como, Italy: EuroSimE, p. 1-5 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  50. Numerical Approach to Characterization of Thermally Conductive Adhesives

    Falat, T., Wymyslowski, A., Kolbe, J., Jansen, KMB. & Ernst, LJ., 2006, Proceedings of the 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006. Ernst, L.J., Zhang, G.Q., Rodgers, P., Marco, S., Meuwissen, M. & Saint Leger, O. de (eds.). Como, Italy: EuroSimE, p. 1-7 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  51. Process technology for electronics on flexible and stretchable substrates

    Zoumpoulidis, T., Wang, L., Bartek, M., Polyakov, A., Jansen, KMB. & Ernst, LJ., 2006, Proceedings of the 9th STW Annual Workshop on Semiconductor Advances for Future Electronics and Sensors (SAFE 2006). s.n. (ed.). Utrecht: STW, p. 502-507 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  52. 2007
  53. Characterization of moisture properties of polymers for IC packaging

    Ma, X., Jansen, KMB., Ernst, LJ., van Driel, WD., van der Sluis, O. & Zhang, GQ., 2007, In : Microelectronics Reliability. 47, p. 1685-1689 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  54. Correlation between chemistry of polymer building blocks and microelectronics reliability

    Bressers, HJL., van Driel, WD., Jansen, KMB., Ernst, LJ. & Zhang, GQ., 2007, In : Microelectronics Reliability. 47, p. 290-294 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  55. Deformable silicon electronics using segmentation and flexible interconnect

    Zoumpoulidis, T., WANG, L., Bartek, M., Jansen, KMB. & Ernst, LJ., 2007, Proc. 57th Electronic Components & Technology Conference (ECTC 2007). Bonda R (ed.). Piscataway: IEEE Society, p. 1544-1599 56 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  56. Deformable silicon electronics using segmentation and ultra-thin substrates

    Bartek, M., Zoumpoulidis, T., WANG, L., Jansen, KMB. & Ernst, LJ., 2007, Proceedings of the 4th International Wafer-Level Packaging Conference (IWLPC 2007). s.n. (ed.). Edina: Surface Mount Technology Association (smta.org), p. 1-6 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  57. Design and fabrication of micro-system embedding in flexible substrates

    WANG, L., Zoumpoulidis, T., Jansen, KMB., Bartek, M., Ernst, LJ. & Zhang, GQ., 2007, Proc. 57th Electronic Components & Technology Conference (ECTC 2007). Bonda R (ed.). Piscataway: IEEE Society, p. 311-315 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

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