1. 3D Printed Actuators: Reversibility, Relaxation, and Ratcheting

    Zhao, S. C., Maas, M., Jansen, K. & van Hecke, M., 2019, In : Advanced Functional Materials. 29, 51, 8 p., 1905545.

    Research output: Contribution to journalArticleScientificpeer-review

  2. A Characterization Method for Viscoelastic Bulk Modulus of Molding Compounds

    Saraswat, MK., Jansen, KMB., Patel, MD., Ernst, LJ., Bohm, C., Kessler, A., Preu, H. & Stecher, M., 2008, Proceedings of the 9th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P. & Saint Leger, O. de (eds.). Freiburg-im-Breisgau: EuroSimE, p. 463-466 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  3. A New Method to Measure the Moisture Expansion in Plastic Packaging Materials

    Ma, X., Jansen, KMB., Ernst, LJ., van Driel, WD., van der Sluis, O. & Zhang, GQ., 2009, Proceedings of the 2009 Electronic Components and Technology Conference, ECTC2009, May 26-29, 2009, San Diego, CA, USA. Banda, R., Trewhella, J. & Bezuk, S. (eds.). IEEE Society, p. 1271-1276 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  4. A fast moisture sensitivity level qualification method

    Ma, X., Jansen, KMB., Zhang, GQ., van Driel, WD., van der Sluis, O., Ernst, LJ., Regards, C., Gautier, C. & Frémont, H., 2010, In : Microelectronics Reliability. 50, 2010, p. 1654-1660 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  5. A new procedure for thermo-viscoelastic modelling of composites with general orthotropy and geometry

    Abouhamzeh, M., Sinke, J., Jansen, KMB. & Benedictus, R., 2015, In : Composite Structures. 133, p. 871-877 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  6. A novel 12-lead electrocardiographic system for home use: Development and usability testing

    Steijlen, A., Jansen, K., Albayrak, A., Verschure, D. O. & Van Wijk, D. F., 2018, In : JMIR mHealth and uHealth. 6, 7, p. 1-14 14 p., e10126.

    Research output: Contribution to journalArticleScientificpeer-review

  7. A novel tool for cure dependent viscoelastic characterization of packaging polymers

    van t Hof, C., Wisse, G., Ernst, LJ., Jansen, KMB., Yang, D., Zhang, GQ. & Bressers, HJL., 2004, EuroSimE 2004: 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems. Ernst, LJ., Zhang, GQ., Rodgers, P. & de Saint Leger, O. (eds.). Piscataway: IEEE Society, p. 385-389 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  8. A product based lap shear fatigue testing of electrically conductive adhesives

    Ozturk, B., Youssef, A., Gromala, P., Silber, C., Jansen, KMB. & Ernst, LJ., 2014, Proceedings 15th International Conference on Thermal, Mechanical and Multi-physics Simulation and Experiments in Microelectronics and Microsystems. Vandevelde, B. (ed.). Piscataway, NJ, USA: IEEE Society, p. 1-5 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  9. Advanced Viscoelastic Material Model for Predicting Warpage of a QFN Panel

    de Vreugd, J., Jansen, KMB., Xiao, A., Ernst, LJ., Bohm, C., Kessler, A., Preu, H. & Stecher, M., 2008, 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, USA. Wipiejewski, T. & Trewhella, J. (eds.). Orlando, FL, USA: IEEE Society, p. 1635-1640 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  10. Aging of epoxy moulding compound: Thermomechanical properties during high temperature storage

    Zhang, B., Johlitz, M., Lion, A., Ernst, L., Jansen, K., Vu, D-K. & Weiss, L., 2016, 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). Piscataway, NJ, USA: IEEE Society, 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  11. Analytical estimate for cure-induced stresses and warpage in flat packages

    Jansen, KMB., de Vreugd, J. & Ernst, LJ., 2011, Proceedings of the 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011, 18-20 April 2011, Linz, Austria. Ernst, LJ., Zhang, GQ., Driel, WD. V., Rodgers, P., Bailey, C. & Saint Leger, O. D. (eds.). Linz, Austria: IEEE Society, p. 1-4 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  12. Analytical estimate for curing-induced stress and warpage in coating layers

    Jansen, KMB., de Vreugd, J. & Ernst, LJ., 2012, In : Journal of Applied Polymer Science. 126, 5, p. 1623-1630 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  13. Atmospheric plasma modification of polyimide sheet for joining to titanium with high temperature adhesive

    Akram, M., Jansen, KMB., Ernst, LJ. & Bhowmik, S., 2016, In : International Journal of Adhesion and Adhesives. 65, p. 63-69

    Research output: Contribution to journalArticleScientificpeer-review

  14. Atmospheric pressure plasma surface modification of titanium for high temperature adhesive bonding

    Akram, M., Jansen, KMB., Ernst, LJ. & Bhowmik, S., 2011, In : International Journal of Adhesion and Adhesives. 31, p. 598-604 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  15. Bending and stretching studies on ultra-thin silicon substrates

    Wang, L., Jansen, KMB., Bartek, M., Poliakov, A. & Ernst, LJ., 2005, Proceedings of the 6th international conference on electronics packaging technology. Keyun, B. & Chunqing, W. (eds.). Piscataway: IEEE Society, p. 682-686 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  16. Challenges of viscoelastic characterization of low Tg epoxy based adhesives for automotive applications in DMA and relaxation experiments

    Maus, I., Preu, H., Niessner, M., Fink, M., Jansen, KMB., Pantou, R., Michel, B. & Wunderle, B., 2014, Proceedings of the 15th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems. Vandevelde, B. (ed.). Piscataway: IEEE Society, p. 1-7 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  17. Characterization and modeling of molding compound properties during cure

    Jansen, KMB., Qian, C., Ernst, LJ., Bohm, C., Kessler, A., Preu, H. & Stecher, M., 2008, Proceedings of the 9th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P. & Saint Leger, O. de (eds.). Freiburg-im-Breisgau: EuroSimE, p. 610-613 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  18. Characterization and modeling the thermo-mechanical cure-dependent properties of epoxy molding compound

    Sadeghinia, M., Jansen, KMB. & Ernst, LJ., 2011, In : International Journal of Adhesion and Adhesives. 32, p. 82-88 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  19. Characterization and simulation of LTCC/adhesive and alloy 42/adhesive interface strength for automotive applications

    Ozturk, B., Lou, P., Gromala, P., Silber, C., Jansen, KMB. & Ernst, LJ., 2015, Proceedings of the 2015 16th INternational Conference on Thermal, Mechanical and Multi-physics Simulation and Experiments in Microelectronics and Microsystems. s.n. (ed.). Piscataway, NJ, USA: IEEE Society, p. 1-10 10 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  20. Characterization of adhesives and interface strength for automotive applications

    Ozturk, B., Gromala, P., Otto, C., Fischer, A., Jansen, KMB. & Ernst, LJ., 2012, Proceedings of the 13th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and Microsystems, EuroSimE 2012. s.l.: IEEE Society, p. 1-4 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  21. Characterization of adhesives for microelectronic industry in DMA and relaxation experiments for interfacial fracture toughness characterization- difficulties and solution

    Maus, I., Preu, H., Niessner, M., Nabi, H., Jansen, KMB., Pantou, R., Weiss, L., Michel, B. & Wunderle, B., 2014, Proceedings of the ESTC Electronic sytem-integration technology conference 2014. s.n. (ed.). Piscataway: IEEE Society, p. 1-7 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  22. Characterization of epoxy based highly filled die attach materials in microelectronics

    Maus, I., Liebl, C., Fink, M., Vu, D-K., Hartung, M., Preu, H., Jansen, K., Michel, B., Wunderle, B. & Weiss, L., 2017, 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017. IEEE, p. 1-7 7 p. 7926237

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  23. Characterization of moisture properties of polymers for IC packaging

    Ma, X., Jansen, KMB., Ernst, LJ., van Driel, WD., van der Sluis, O. & Zhang, GQ., 2007, In : Microelectronics Reliability. 47, p. 1685-1689 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  24. Characterization of physical and viscoelastic properties of polymer films for coating applications under different temperature of drying and storage

    Perfetti, G., Jansen, KMB., wildeboer, W. J., Hee, P. V. & Meesters, GMH., 2009, In : International Journal of Pharmaceutics. 384, p. 109-119 11 p.

    Research output: Contribution to journalArticleScientificpeer-review

  25. Characterization of polymer films and coating process evaluation as tool for determination of coating strength: "Quality by Design" approach

    Perfetti, G., Jansen, KMB., Meesters, GMH. & wildeboer, W. J., 2008, Proceedings International Symposium Reliable Flow of Particulate Solids IV (RELPOWFLO IV). s.n. (ed.). Tomso: s.n., p. 1-5 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  26. Characterization of polymer films and coating process evaluation as tool for determination of coating strength: "Quality by Design" approach

    Perfetti, G., Jansen, KMB., Meesters, GMH. & wildeboer, W. J., 2008.

    Research output: Contribution to conferencePosterProfessional

  27. Characterization of the viscoelastic properties of an epoxy molding compound during cure

    Sadeghinia, M., Jansen, KMB. & Ernst, LJ., 2012, In : Microelectronics Reliability. 52, 8, p. 1711-1718 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  28. Closed form expression for residual stresses and warpage during cure of composite laminates

    Abouhamzeh, M., Sinke, J., Jansen, KMB. & Benedictus, R., 2015, In : Composite Structures. 133, 01, p. 902-910 9 p.

    Research output: Contribution to journalArticleScientificpeer-review

  29. Color shift investigations for LED secondary optical designs: Comparison between BPA-PC and PMMA

    Lu, G., Yazdan Mehr, M., van Driel, WD., Fan, X., Fan, J., Jansen, KMB. & Zhang, GQ., 2015, In : Optical Materials. 45, p. 37-41 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  30. Colour shift and mechanism investigation on the PMMA diffuser used in LED-based luminaires

    Lu, G., van Driel, WD., Fan, X., Yazdan Mehr, M., Fan, J., Qian, C., Jansen, KMB. & Zhang, GQ., 2016, In : Optical Materials. 54, p. 282-287 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

  31. Composition dependent properties of graphene (oxide)-alginate biopolymer nanocomposites

    Vilcinskas, K., Jansen, K. M. B., Mulder, F. M., Picken, S. J. & Koper, G. J. M., 2016, In : Polymer Composites. 39 (2018), S1, p. E236-E249

    Research output: Contribution to journalArticleScientificpeer-review

  32. Comprehensive Material Characterization of Organic Packaging Materials

    Boehme, B., Jansen, KMB., Rzepka, S. & Wolter, K-J., 2009, Proceedings of the 10th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2009, April 27-29, 2009, Delft, The Netherlands. Ernst, LJ, Zhang, GQ, Driel, WD van, Rodgers, P, Bailey, C & Saint Leger, O de (eds.). Delft, The Netherlands: EuroSimE, p. 289-296 8 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  33. Comprehensive material characterization and method of its validation by means of FEM simulation

    Gromala, P., Duerr, J., Dressler, M., Jansen, KMB., Hawryluk, ML. & de Vreugd, J., 2011, Proceedings of the 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011, 18-20 April 2011, Linz, Austria. Ernst, LJ., Zhang, GQ., Driel, WD. V., Rodgers, P., Bailey, C. & Saint Leger, O. D. (eds.). Linz, Austria: IEEE Society, p. 1-8 8 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  34. Constitutive modeling of moulding compounds

    Jansen, KMB., WANG, L., Yang, D., van t Hof, C., Ernst, LJ., Bressers, HJL. & Zhang, GQ., 2004, 54th electronic components and technology conference. Vol. 2. S.n. (ed.). Piscataway: IEEE Society, p. 1-5 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  35. Correlation between chemistry of polymer building blocks and microelectronics reliability

    Bressers, HJL., van Driel, WD., Jansen, KMB., Ernst, LJ. & Zhang, GQ., 2007, In : Microelectronics Reliability. 47, p. 290-294 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  36. Creep behaviour of FM906 glass-fibre epoxy as used in heated fibre metal laminates

    Hagenbeek, M., Dias, M. M., Sinke, J. & Jansen, K., Nov 2019, In : Journal of Composite Materials. 53, 26-27, p. 3829-3840 12 p.

    Research output: Contribution to journalArticleScientificpeer-review

  37. Cure dependent characterisation of moulding compounds

    Jansen, KMB., Hawryluk, ML. & Gromala, P., 2011, Proceedings of the 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011, 18-20 April 2011, Linz, Austria. Ernst, LJ., Zhang, GQ., Driel, WD. V., Rodgers, P., Bailey, C. & Saint Leger, O. D. (eds.). Linz, Austria: IEEE Society, p. 1-6 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  38. Cure induced Warpage of micro-electronics: comparison with experiments

    de Vreugd, J., Jansen, KMB., Ernst, LJ., Bohm, C. & Falat, TC., 2009, Proceedings of the 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2009, 27-29 April 2009, Delft, The Netherlands. Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P., Bailey, C. & Saint Leger, O. de (eds.). IEEE Society, p. 374-377 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  39. Cure, temperature and time dependent constitutive of moulding compounds

    Jansen, KMB., WANG, L., van t Hof, C., Ernst, LJ., Bressers, HJL. & Zhang, GQ., 2004, EuroSimE 2004: 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems. Ernst, LJ., Zhang, GQ., Rodgers, P. & de Saint Leger, O. (eds.). Piscataway: IEEE Society, p. 581-585 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  40. Damping model for carbon nanotube composites in sports applications

    Dwaikat, MMS., Jansen, KMB. & Spitas, C., 2012, p. 1-1. 1 p.

    Research output: Contribution to conferenceAbstractScientific

  41. Deformable silicon electronics using segmentation and flexible interconnect

    Zoumpoulidis, T., WANG, L., Bartek, M., Jansen, KMB. & Ernst, LJ., 2007, Proc. 57th Electronic Components & Technology Conference (ECTC 2007). Bonda R (ed.). Piscataway: IEEE Society, p. 1544-1599 56 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  42. Deformable silicon electronics using segmentation and ultra-thin substrates

    Bartek, M., Zoumpoulidis, T., WANG, L., Jansen, KMB. & Ernst, LJ., 2007, Proceedings of the 4th International Wafer-Level Packaging Conference (IWLPC 2007). s.n. (ed.). Edina: Surface Mount Technology Association (smta.org), p. 1-6 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  43. Degradation of microcellular PET reflective materials used in LED-based products

    Lu, G., van Driel, WD., Fan, X., Yazdan Mehr, M., Fan, J., Jansen, KMB. & Zhang, GQ., 2015, In : Optical Materials. 49, November, p. 79-84 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

  44. Delamination Toughness of Cu-EMC Interfaces at Harsh Environment

    Sadeghinia, M., Jansen, KMB., Ernst, LJ., Schlottig, G. & Pape, H., 2011, Proceedings of IEEE 61st Electronic Components and Technology Conference, 31 May -3 June, 2011, Lake Buena Vista, FL, USA. n.a. (ed.). Lake Buena Vista, FL, USA: IEEE Society, p. 1976-1980 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  45. Delamination and combined compound cracking of EMC-copper interfaces

    Xiao, A., Schlottig, G., Pape, H., Wunderle, B., Jansen, KMB. & Ernst, LJ., 2010, Proceedings of the 60th Electronic Components and Technology Conference (ECTC), 1-4 June 2010, Las Vegas, NV, USA. n.a. (ed.). Las Vegas, NV, USA: IEEE Society, p. 114-120 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  46. Design and characterization of variable stiffness structural joints

    Wang, Q., Senatore, G., Jansen, K., Habraken, A. & Teuffel, P., 2020, In : Materials and Design. 187, 108353.

    Research output: Contribution to journalArticleScientificpeer-review

  47. Design and fabrication of micro-system embedding in flexible substrates

    WANG, L., Zoumpoulidis, T., Jansen, KMB., Bartek, M., Ernst, LJ. & Zhang, GQ., 2007, Proc. 57th Electronic Components & Technology Conference (ECTC 2007). Bonda R (ed.). Piscataway: IEEE Society, p. 311-315 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  48. Design and thermal testing of smart composite structure for architecture applications

    Lelieveld, C. & Jansen, KMB., 2013, Proceedings of the 6th ECCOMAS conference on smart structures and materials SMART 2013. Carrera, E., Miglioretti, F. & Petrolo, M. (eds.). s.l.: s.n., p. 1-11 11 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  49. Designing of a semi-transparent Electroluminescent Umbrella

    Jansen, K., Claus, S. & Barati, B., 2017, Smart Systems Integration 2017: International Conference and Exhibition on Integration Issues of Miniaturized Systems. Otto, T. (ed.). Mesago Messe Frankfurt GmbH, p. 123-129 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  50. Determination of cure dependent properties for curing simulation of thick-walled composites

    Balvers, JM., Bersee, HEN., Jansen, KMB. & Beukers, A., 2008, proceedings of the 49th AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics and Materials conference. Hajela, P. & Pepin, JE. (eds.). Schaumburg, Il. USA: AIAA, p. 1-15 15 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

Previous 1 2 3 4 Next

ID: 208613