1. 2014
  2. Fracture toughness of Cu-EMC interfaces in pressurized steam

    Sadeghinia, M., Jansen, KMB., Ernst, LJ., Pape, H., Maus, I., van Driel, WD. & Zhang, GQ., 2014, In : International Journal of Adhesion and Adhesives. 49, March, p. 73-79 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  3. Lifetime assessment of Bisphenol-A Polycarbonate (BPA-PC) plastic lens, used in LED-based products

    Yazdan Mehr, M., van Driel, WD., Jansen, KMB., Deeben, P. & Zhang, GQ., 2014, In : Microelectronics Reliability. 54, 1, p. 138-142 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  4. Material parameter identification by combination of stress chip measurements and FE-simulation in MERGE

    Rost, F., Schindler-Saefkow, F., Vogel, D., Rezaie Adli, AR., Jansen, KMB., Rzepka, S., Michel, B., Schaufuß, J., Tsapkolenko, A. & Nossol, P., 2014, Smart system integration conference. s.n. (ed.). s.l.: s.n., p. 1-8 8 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  5. Measuring the mechanical relevant shrinkage during in-mold and post-mold cure with the stress chip

    Rost, F., Schindler-Saefkow, F., Rezaie Adli, AR., Jansen, KMB., Wunderle, B., Keller, J., Rzepka, S. & Michel, B., 2014, Proceedings of the 15th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems. Vandevelde, B. (ed.). Piscataway: IEEE Society, p. 1-5 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  6. The influence of fiber-matrix adhesion on the linear viscoelastic creep behavior of CF/PPS composites

    Motta Dias, MH., Jansen, KMB., Luinge, H., Nayak, K. & Bersee, HEN., 2014, AMS2014: The 1st international conference on ageing of materials and structures. s.n. (ed.). s.l.: s.n., p. 1-15 15 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  7. Thermal-electric characterization and modelling of smart composite structure for architectural applications

    Lelieveld, C. & Jansen, KMB., 2014, In : Smart Materials and Structures. 23, 6, p. 1-8 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  8. 2013
  9. Design and thermal testing of smart composite structure for architecture applications

    Lelieveld, C. & Jansen, KMB., 2013, Proceedings of the 6th ECCOMAS conference on smart structures and materials SMART 2013. Carrera, E., Miglioretti, F. & Petrolo, M. (eds.). s.l.: s.n., p. 1-11 11 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  10. Finite element based design of a new dogbone specimen for low cycle fatigue testing of highly filled epoxy-based adhesives for automotive applications

    Ozturk, B., Gromala, P., Silber, C., Jansen, KMB. & Ernst, LJ., 2013, Proceedings of the 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. van Driel, W. & et al (eds.). Piscataway, NJ, USA: IEEE Society, p. 1-4 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  11. Indentation rolling resistance of pipe belt conveyors using threedimensional generalized Maxwell viscoelastic model

    Zamiralova, M., Jansen, KMB. & Lodewijks, G., 2013, Proceedings of the 11th International Congress on Bulk Materials Storage, Handling and Transportation. Jones, M. (ed.). Calaghan, NSW, Australia: University of Newcastle, p. 1-11 11 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  12. Material complexity: 3D printing perspectives

    Doubrovski, EL., Jansen, KMB. & Geraedts, JMP., 2013, In : Inside materials (Nieuwsbrief Delft Centre for Materials). 2013, November, p. 1-2 2 p.

    Research output: Contribution to journalArticleProfessional

  13. Mechanical characterization of epoxy moulding compound in pressurized steam

    Sadeghinia, M., Jansen, KMB., Ernst, LJ. & Pape, H., 2013, In : International Journal of Adhesion and Adhesives. 40, January, p. 103-107 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  14. Photodegradation of bisphenol A polycarbonate under blue light radiation and its effect on optical properties

    Yazdan Mehr, M., van Driel, WD., Jansen, KMB., Deeben, J., Boutelje, M. & Zhang, GQ., 2013, In : Optical Materials. 35, 3, p. 504-508 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  15. Tailoring the viscoelasticity of epoxy thermosets

    Nakka, JS., Jansen, KMB. & Ernst, LJ., 2013, In : Journal of Applied Polymer Science. 128, 6, p. 3794-3806 13 p.

    Research output: Contribution to journalArticleScientificpeer-review

  16. The influence of fiber-matrix adhesion on the linear viscoelastic creep behavior of CF/PPS composites

    Motta Dias, MH., Jansen, KMB., Luinge, H., Nayak, K. & Bersee, HEN., 2013, ICSAAM 2013 The 5th international conference on structural analysis of advanced materials. s.n. (ed.). Islans of Kos, Greece: University of Patras, p. 1-15 15 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  17. Warpage estimation of a multilayer package including cure shrinkage effects

    Jansen, KMB. & Ozturk, B., 2013, In : IEEE Transactions on Components, Packaging and Manufacturing Technology. 3, 3, p. 459-466 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  18. 2012
  19. Analytical estimate for curing-induced stress and warpage in coating layers

    Jansen, KMB., de Vreugd, J. & Ernst, LJ., 2012, In : Journal of Applied Polymer Science. 126, 5, p. 1623-1630 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  20. Characterization of adhesives and interface strength for automotive applications

    Ozturk, B., Gromala, P., Otto, C., Fischer, A., Jansen, KMB. & Ernst, LJ., 2012, Proceedings of the 13th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and Microsystems, EuroSimE 2012. s.l.: IEEE Society, p. 1-4 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  21. Characterization of the viscoelastic properties of an epoxy molding compound during cure

    Sadeghinia, M., Jansen, KMB. & Ernst, LJ., 2012, In : Microelectronics Reliability. 52, 8, p. 1711-1718 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  22. Damping model for carbon nanotube composites in sports applications

    Dwaikat, MMS., Jansen, KMB. & Spitas, C., 2012, p. 1-1. 1 p.

    Research output: Contribution to conferenceAbstractScientific

  23. Establishing the interfacial fracture properties of cu-emc interfaces at harsh condition

    Sadeghinia, M., Jansen, KMB., Ernst, LJ. & Pape, H., 2012, Proceedings of the 13th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and Microsystems, EuroSimE 2012. s.l.: IEEE Society, p. 1-4 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  24. Establishment of the coarse grained parameters for epoxy-copper interfacial separation

    Wong, KY., Leung, YY., Poelma, RH., Jansen, KMB., Yuan, CA., van Driel, WD. & Zhang, GQ., 2012, In : Journal of Applied Physics. 111, May, p. 1-7 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  25. Establishment of the coarse grained parameters for epoxy-copper interfacial separation

    Wong, KY., Leung, YY., Poelma, RH., Jansen, KMB., Yuan, CA., van Driel, WD. & Zhang, GQ., 2012, Electronic packaging technology and high density packaging (ICEPT-HDP), 2012 Proceedings of the 13th international conference. s.n. (ed.). Piscataway: IEEE Society, p. 1467-1473 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  26. Establishment of the mesoscale parameters for epoxy-copper interfacial separation

    Wong, CKY., Leung, SYY., Poelma, RH., Jansen, KMB., Yuan, CCA., van Driel, WD. & Zhang, GQ., 2012, 13th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (EuroSimE 2012). s.l.: IEEE Society, p. 1-6 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  27. Interfacial fracture properties of Cu-EMC interfaces at pressure cooker test conditions

    Sadeghinia, M., Jansen, KMB., Ernst, LJ. & Pape, H., 2012, Proceedings Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd. IEEE Society, p. 752-755 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  28. Residual and bending stress measurements by X-ray diffraction and synchrotron diffraction analysis in silicon solar cells

    Popovich, V., van der Pers, NM., Janssen, M., Bennett, IJ., Jansen, KMB., Wright, J. & Richardson, IM., 2012, Photovoltaic Specialists Conference (PVSC), 2012 38th IEEE. IEEE, p. 442-447 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  29. 2011
  30. Analytical estimate for cure-induced stresses and warpage in flat packages

    Jansen, KMB., de Vreugd, J. & Ernst, LJ., 2011, Proceedings of the 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011, 18-20 April 2011, Linz, Austria. Ernst, LJ., Zhang, GQ., Driel, WD. V., Rodgers, P., Bailey, C. & Saint Leger, O. D. (eds.). Linz, Austria: IEEE Society, p. 1-4 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  31. Atmospheric pressure plasma surface modification of titanium for high temperature adhesive bonding

    Akram, M., Jansen, KMB., Ernst, LJ. & Bhowmik, S., 2011, In : International Journal of Adhesion and Adhesives. 31, p. 598-604 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  32. Characterization and modeling the thermo-mechanical cure-dependent properties of epoxy molding compound

    Sadeghinia, M., Jansen, KMB. & Ernst, LJ., 2011, In : International Journal of Adhesion and Adhesives. 32, p. 82-88 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  33. Comprehensive material characterization and method of its validation by means of FEM simulation

    Gromala, P., Duerr, J., Dressler, M., Jansen, KMB., Hawryluk, ML. & de Vreugd, J., 2011, Proceedings of the 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011, 18-20 April 2011, Linz, Austria. Ernst, LJ., Zhang, GQ., Driel, WD. V., Rodgers, P., Bailey, C. & Saint Leger, O. D. (eds.). Linz, Austria: IEEE Society, p. 1-8 8 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  34. Cure dependent characterisation of moulding compounds

    Jansen, KMB., Hawryluk, ML. & Gromala, P., 2011, Proceedings of the 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011, 18-20 April 2011, Linz, Austria. Ernst, LJ., Zhang, GQ., Driel, WD. V., Rodgers, P., Bailey, C. & Saint Leger, O. D. (eds.). Linz, Austria: IEEE Society, p. 1-6 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  35. Delamination Toughness of Cu-EMC Interfaces at Harsh Environment

    Sadeghinia, M., Jansen, KMB., Ernst, LJ., Schlottig, G. & Pape, H., 2011, Proceedings of IEEE 61st Electronic Components and Technology Conference, 31 May -3 June, 2011, Lake Buena Vista, FL, USA. n.a. (ed.). Lake Buena Vista, FL, USA: IEEE Society, p. 1976-1980 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  36. Fracture toughness of Cu-EMC interfaces under pressure cooker conditions

    Sadeghinia, M., Jansen, KMB., Ernst, LJ., Schlottig, G. & Pape, H., 2011, Proceedings of the 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011, 18-20 April 2011, Linz, Austria. Ernst, LJ., Zhang, GQ., Driel, WD. V., Rodgers, P., Bailey, C. & Saint Leger, O. D. (eds.). Linz, Austria: IEEE Society, p. 1-5 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  37. Moisture absorption analysis of high performance polyimide adhesive

    Akram, M., Jansen, KMB., Bhowmik, S. & Ernst, LJ., 2011, Proceedings of SAMPE Fall Technical Conference 2011, October 17-20, 2011, Fort Worth, Texas, USA. n.a. (ed.). Fort Worth, Texas, USA: SAMPE, p. 1-9 9 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  38. Molecular dynamics study of the traction-displacement relations of epoxy-copper interfaces

    Wong, CKY., Leung, SYY., Poelma, RH., Jansen, KMB., Yuan, CA., van Driel, WD. & Zhang, GQ., 2011, 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2011). Ernst, LJ., Zhang, GQ., Driel, WD. V., Rodgers, P., Bailey, C. & Saint Leger, O. D. (eds.). Piscataway: IEEE Society, p. 1-5 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  39. 2010
  40. A fast moisture sensitivity level qualification method

    Ma, X., Jansen, KMB., Zhang, GQ., van Driel, WD., van der Sluis, O., Ernst, LJ., Regards, C., Gautier, C. & Frémont, H., 2010, In : Microelectronics Reliability. 50, 2010, p. 1654-1660 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  41. Delamination and combined compound cracking of EMC-copper interfaces

    Xiao, A., Schlottig, G., Pape, H., Wunderle, B., Jansen, KMB. & Ernst, LJ., 2010, Proceedings of the 60th Electronic Components and Technology Conference (ECTC), 1-4 June 2010, Las Vegas, NV, USA. n.a. (ed.). Las Vegas, NV, USA: IEEE Society, p. 114-120 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  42. Die attach interface property characterization as function of temperature using cohesive zone modeling method

    Ma, X., Zhang, GQ., van der Sluis, O., Jansen, KMB., van Driel, WD. & Ernst, LJ., 2010, Proceedings of the 11th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2010, 26-28 April 2010, Bordeaux, France. Ernst, LJ, Zhang, GQ, Driel, WD van, Rodgers, P, Bailey, C & Saint Leger, O de (eds.). Bordeaux, France: IEEE Society, p. 1-8 8 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  43. High temperature storage influence on molding compound properties

    de Vreugd, J., Jansen, KMB., Ernst, LJ., Bohm, C. & Pufall, R., 2010, Proceedings of the 11th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2010, 26-28 April 2010, Bordeaux, France. Ernst, LJ, Zhang, GQ, Driel, WD van, Rodgers, P, Bailey, C & Saint Leger, O. de (eds.). IEEE Society, p. 1-6 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  44. Interfacial fracture parameters of silicon-to-molding compound

    Schlottig, G., Maus, I., Walter, H., Jansen, KMB., Pape, H., Wunderle, B. & Ernst, LJ., 2010, Proceedings 60th Electronic Components and Technology Conference (ECTC), 1-4- June 2010, Las Vegas, NV, USA. n.a. (ed.). IEEE Society, p. 1939-1945 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  45. Prediction of cure induced warpage of micro-electronic products

    de Vreugd, J., Jansen, KMB., Ernst, LJ. & Bohm, C., 2010, In : Microelectronics Reliability. 50, p. 910-916 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  46. Procedure to determine interfacial toughness of EMC-copper (oxide) interfaces

    Xiao, A., Pape, H., Schlottig, G., Wunderle, W., Leung, YY., Jansen, KMB. & Ernst, LJ., 2010, Proceedings of the 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 16-19 August 2010, Xi'an, China. n.a. (ed.). Xi'an, China: IEEE Society, p. 356-362 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  47. Surface modification of polyimide by atmospheric pressure plasma for adhesive bonding with titanium and its application to aviation and space

    Akram, M., Bhowmik, S., Jansen, KMB. & Ernst, LJ., 2010, Proceedings of the SAMPE USA 2010 Conference and Exhibition, 17-20 May 2010, Seattle, WA, USA. s.n. (ed.). Seattle, WA, USA: SAMPE USA, p. 1-10 10 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  48. Surface modification of titanium by atmospheric pressure plasma treatment for adhesive bonding and its application to aviation and space

    Akram, M., Bhowmik, S., Jansen, KMB. & Ernst, LJ., 2010, Proceedings of SEICO 10, SAMPE Europe 31st International Technical Conference and Forum, 12-14 April 2010, Paris, France. n.a. (ed.). Paris, France: SEICO, p. 188-194 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  49. Theory of aluminum metallization corrosion in microelectronics

    van Soestbergen, M., Mavinkurve, A., Rongen, RTH., Jansen, KMB., Ernst, LJ. & Zhang, GQ., 2010, In : Electrochimica Acta. 55, p. 5459-5469 11 p.

    Research output: Contribution to journalArticleScientificpeer-review

  50. Thermal aging of molding compounds

    Jansen, KMB., de Vreugd, J., Ernst, LJ. & Bohm, C., 2010, Proceedings of the 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 16-19 August 2010, Xi'an, China. n.a. (ed.). Xi'an, China: IEEE Society, p. 778-780 3 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  51. 2009
  52. A New Method to Measure the Moisture Expansion in Plastic Packaging Materials

    Ma, X., Jansen, KMB., Ernst, LJ., van Driel, WD., van der Sluis, O. & Zhang, GQ., 2009, Proceedings of the 2009 Electronic Components and Technology Conference, ECTC2009, May 26-29, 2009, San Diego, CA, USA. Banda, R., Trewhella, J. & Bezuk, S. (eds.). IEEE Society, p. 1271-1276 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  53. Characterization of physical and viscoelastic properties of polymer films for coating applications under different temperature of drying and storage

    Perfetti, G., Jansen, KMB., wildeboer, W. J., Hee, P. V. & Meesters, GMH., 2009, In : International Journal of Pharmaceutics. 384, p. 109-119 11 p.

    Research output: Contribution to journalArticleScientificpeer-review

  54. Comprehensive Material Characterization of Organic Packaging Materials

    Boehme, B., Jansen, KMB., Rzepka, S. & Wolter, K-J., 2009, Proceedings of the 10th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2009, April 27-29, 2009, Delft, The Netherlands. Ernst, LJ, Zhang, GQ, Driel, WD van, Rodgers, P, Bailey, C & Saint Leger, O de (eds.). Delft, The Netherlands: EuroSimE, p. 289-296 8 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  55. Cure induced Warpage of micro-electronics: comparison with experiments

    de Vreugd, J., Jansen, KMB., Ernst, LJ., Bohm, C. & Falat, TC., 2009, Proceedings of the 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2009, 27-29 April 2009, Delft, The Netherlands. Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P., Bailey, C. & Saint Leger, O. de (eds.). IEEE Society, p. 374-377 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  56. Effect of Postcure and Thermal Aging on Molding Compound Properties

    de Vreugd, J., Sanchez Monforte, A., Jansen, KMB., Ernst, LJ., Bohm, C., Kessler, A. & Preu, H., 2009, Proceedings of the 11th Electronics Packaging Technology Conference, EPTC 2009, 9-11 December 2009, Singapore. s.n. (ed.). Singapore: IEEE Society, p. 342-347 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

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