1. 2009
  2. Cure induced Warpage of micro-electronics: comparison with experiments

    de Vreugd, J., Jansen, KMB., Ernst, LJ., Bohm, C. & Falat, TC., 2009, Proceedings of the 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2009, 27-29 April 2009, Delft, The Netherlands. Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P., Bailey, C. & Saint Leger, O. de (eds.). IEEE Society, p. 374-377 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  3. Effect of Postcure and Thermal Aging on Molding Compound Properties

    de Vreugd, J., Sanchez Monforte, A., Jansen, KMB., Ernst, LJ., Bohm, C., Kessler, A. & Preu, H., 2009, Proceedings of the 11th Electronics Packaging Technology Conference, EPTC 2009, 9-11 December 2009, Singapore. s.n. (ed.). Singapore: IEEE Society, p. 342-347 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  4. Establishing Fracture Properties of EMC-Copper Interfaces in the Visco-Elastic Temperature Region

    Xiao, A., de Vreugd, J., Pape, H., Wunderle, B., Jansen, KMB. & Ernst, LJ., 2009, Proceedings of the 2009 IEEE 59th Electronic Components and Technology Conference, 26-29 May 2009, San Diego, CA, USA. Bonda, R. & Dias, R. (eds.). San Diego, CA, USA: IEEE Society, p. 239-245 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  5. Establishing fracture properties of EMC-copper (-oxide) interfaces

    Ernst, LJ., Xiao, A., de Vreugd, J., Jansen, KMB., Pape, H., Schlottig, G. & Wunderle, B., 2009, Proceedings of the 2009 IEEE 70th Vehicular Technology Conference Fall, 20-23 September 2009, Anchorage, Alaska. n.a. (ed.). Anchorage, Alaska: IEEE Society, p. 1-6 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  6. Fast Qualification Using Thermal Shock Combined with Moisture Absorption

    Ma, X., Zhang, GQ., Jansen, KMB., van Driel, WD., van der Sluis, O., Ernst, LJ., Regard, C., Gautier, C. & Frémont, H., 2009, Proceedings of the International Conference on Electronic Packaging Technology & High Density Packaging, ICEPT-HDP 2009, August 10-13, 2009, Beijing, China. Keyun Bi & Jian CaI (eds.). IEEE Society, p. 1-6 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  7. Fast reliability qualification of SiP products

    Regard, C., Gautier, C., Frémont, H., Poirier, P., Ma, X. & Jansen, KMB., 2009, In : Microelectronics Reliability. 49, 2009, p. 958-962 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  8. Influence of Cure Dependency of molding Compound Properties on Warpage and Stress Distribution During and After the Encapsulation of Electronics Components

    Falat, TC., Jansen, KMB., de Vreugd, J. & Rzepka, S., 2009, Proceedings of the 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2009, 27-29 April 2009, Delft, The Netherlands. Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P., Bailey, C. & Saint Leger, O. de (eds.). IEEE Society, p. 330-335 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  9. Inhibition of glycosaminoglycan incorporation influences collagen network formation during cartilage matrix production

    Bastiaansen-Jenniskens, YM., Koevoet, W., Jansen, KMB., Verhaar, JAN., DeGroot, J. & VanOsch, GJVM., 2009, In : Biochemical and Biophysical Research Communications. 379, 2009, p. 222-226 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  10. Investigation on Thermal Properties of Crosslinked Epoxy Resin by MD Simulation

    Liao, N., Zhang, GQ., Pavel, D., van der Sluis, O., Jansen, KMB. & Ernst, LJ., 2009, Proceedings of the 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2009, 27-29 April 2009, Delft, The Netherlands. Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P., Bailey, C. & Saint Leger, O. de (eds.). IEEE Society, p. 546-549 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  11. Modeling and characterization of molding compound properties during cure

    Jansen, KMB., Qian, C., Ernst, LJ., Bohm, C., Kessler, A., Preu, H. & Stecher, M., 2009, In : Microelectronics Reliability. 49, 2009, p. 872-876 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  12. Moisture Effects on a System in Package Carrier

    Ma, X., Jansen, KMB., Ernst, LJ., van Driel, WD., van der Sluis, O. & Zhang, GQ., 2009, Proceedings of the 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2009, 27-29 April 2009, Delft, The Netherlands. Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P., Bailey, C. & Saint Leger, O. de (eds.). IEEE Society, p. 379-383 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  13. Moisture absorption and hygroscopic swelling characterization of molding compound

    de Vreugd, J., Jansen, KMB., Ernst, LJ. & Bohm, C., 2009, Proceedings of the 11th International Conference on Electronic Material and Packaging, 1-3 December 2009, Penang, Malaysia. n.a. (ed.). Penang, Malaysia: n.a., p. 1-6 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  14. 2008
  15. A Characterization Method for Viscoelastic Bulk Modulus of Molding Compounds

    Saraswat, MK., Jansen, KMB., Patel, MD., Ernst, LJ., Bohm, C., Kessler, A., Preu, H. & Stecher, M., 2008, Proceedings of the 9th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P. & Saint Leger, O. de (eds.). Freiburg-im-Breisgau: EuroSimE, p. 463-466 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  16. Advanced Viscoelastic Material Model for Predicting Warpage of a QFN Panel

    de Vreugd, J., Jansen, KMB., Xiao, A., Ernst, LJ., Bohm, C., Kessler, A., Preu, H. & Stecher, M., 2008, 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, USA. Wipiejewski, T. & Trewhella, J. (eds.). Orlando, FL, USA: IEEE Society, p. 1635-1640 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  17. Characterization and modeling of molding compound properties during cure

    Jansen, KMB., Qian, C., Ernst, LJ., Bohm, C., Kessler, A., Preu, H. & Stecher, M., 2008, Proceedings of the 9th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P. & Saint Leger, O. de (eds.). Freiburg-im-Breisgau: EuroSimE, p. 610-613 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  18. Characterization of polymer films and coating process evaluation as tool for determination of coating strength: "Quality by Design" approach

    Perfetti, G., Jansen, KMB., Meesters, GMH. & wildeboer, W. J., 2008.

    Research output: Contribution to conferencePosterProfessional

  19. Characterization of polymer films and coating process evaluation as tool for determination of coating strength: "Quality by Design" approach

    Perfetti, G., Jansen, KMB., Meesters, GMH. & wildeboer, W. J., 2008, Proceedings International Symposium Reliable Flow of Particulate Solids IV (RELPOWFLO IV). s.n. (ed.). Tomso: s.n., p. 1-5 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  20. Determination of cure dependent properties for curing simulation of thick-walled composites

    Balvers, JM., Bersee, HEN., Jansen, KMB. & Beukers, A., 2008, proceedings of the 49th AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics and Materials conference. Hajela, P. & Pepin, JE. (eds.). Schaumburg, Il. USA: AIAA, p. 1-15 15 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  21. Effecs of molding pressure on the warpage and the viscoelasticities of HVQFN packages

    Gui, DY., Ernst, LJ., Jansen, KMB., Yang, D., Goumans, L., Bressers, HJL. & Janssen, JHJ., 2008, In : Journal of Applied Polymer Science. 109, 3, p. 2016-2022 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  22. Effect of aging of packaging materials on die surface cracking of a SiP carrier

    Ma, X., Jansen, KMB., Ernst, LJ., van Driel, WD., van der Sluis, O., Zhang, GQ., Regard, C., Gautier, C. & Frémont, H., 2008, Proceedings of the 9th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P. & Saint Leger, O. de (eds.). Freiburg-im-Breisgau: EuroSimE, p. 361-364 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  23. Effect of the epoxy resin chemistry on the viscoelasticity of its cured product

    Nakka, JS., Jansen, KMB., Ernst, LJ. & Jager, WF., 2008, In : Journal of Applied Polymer Science. 108, p. 1414-1420 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  24. Effects of Molding Compound Cure on Warpage of Electronic Packages

    de Vreugd, J., Jansen, KMB., Ernst, LJ., Bohm, C., Kessler, A. & Preu, H., 2008, Proceedings EPTC 2008. Lee, R. (ed.). Singapore: IEEE Society, p. 675-682 8 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  25. Free-standing, parylene-sealed copper interconnect for stretchable silicon electronics

    Sosin, S., Zoumpoulidis, T., Bartek, M., Wang, L., Dekker, R., Jansen, KMB. & Ernst, LJ., 2008, 2008 proceedings 58th electronic components & technology conference, Lake Buena Vista, FL, USA. Wipiejewski, T. & Trewhella, J. (eds.). Orlando, FL, USA: IEEE Society, p. 1339-1345 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  26. Inhibition of proteoglycan productioninfluences cartilage collagen network information

    Bastiaansen-Jenniskens, YM., Koevoet, W. & Jansen, KMB., 2008, In : Tissue Engineering. Part A. 14, 5, p. 748-752 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  27. Interface Characterization and Failure Modeling for Semiconductor Packages

    Ernst, LJ., Xiao, A., Wunderle, B., Jansen, KMB. & Pape, H., 2008, Proceedings EPTC 2008. Lee, R. (ed.). Singapore: IEEE Society, p. 808-815 8 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  28. Interfacial Fracture Properties and Failure Modeling for Microelectronics

    Xiao, A., Pape, H., Wunderle, B., Jansen, KMB., de Vreugd, J. & Ernst, LJ., 2008, 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, USA. Wipiejewski, T. & Trewhella, J. (eds.). Orlando, FL, USA: IEEE Society, p. 1724-1730 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  29. Mesh interconnects for silicone embedded stretchable silicon electronics

    Sosin, S., Zoumpoulidis, T., Bartek, M., Wang, L., Jansen, KMB. & Ernst, LJ., 2008, Proc. 10th electronics packaging technology conference (EPTC 2008). Yang, T. & Kheng, T. (eds.). Piscataway, Singapore: IEEE Society, p. 230-235 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  30. Mixed mode interface characerization considering thermal redisidual stress

    Xiao, A., Schlottig, G., Wunderle, B., Jansen, KMB. & Ernst, LJ., 2008, Proceedings 2008 International conference on electronic packaging technology & high density packaging. Bi, K. & Xiao, F. (eds.). IEEE Society, p. 1-8 8 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  31. Moisture Diffusion Model Verification of Packaging Materials

    Ma, X., Jansen, KMB., Ernst, LJ., van Driel, WD., van der Sluis, O., Zhang, GQ., Regard, C., Gautier, C. & Frémont, H., 2008, Proceedings of the 2008 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2008), July 28-31, 2008, Shanghai, China. Keyun Bi & Fei Xiao (eds.). IEEE Society, p. 636-640 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  32. Process technology of high-aspect-ratio silicon beams for stretchable silicon electronics

    Zoumpoulidis, T., Tian, J., Sosin, S., Bartek, M., Wang, L., Jansen, KMB., Ernst, LJ., Dekker, R. & de Graaf, P., 2008, Proc. 10th electronics packaging technology conference (EPTC 2008). Yang, T. & Kheng, T. (eds.). Piscataway, ingapore: IEEE Society, p. 361-366 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  33. Stretchable mesh copper interconnect for batc fabrication of array-type microsystems

    Sosin, S., Zoumpoulidis, T., Bartek, M., Wang, L., Dekker, R., Jansen, KMB. & Ernst, LJ., 2008, 22nd international conference EUROSENSORS. Gerlach, G. (ed.). Dusseldorf, Germany: VDI e.V, p. 1528-1531 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  34. 2007
  35. Characterization of moisture properties of polymers for IC packaging

    Ma, X., Jansen, KMB., Ernst, LJ., van Driel, WD., van der Sluis, O. & Zhang, GQ., 2007, In : Microelectronics Reliability. 47, p. 1685-1689 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  36. Correlation between chemistry of polymer building blocks and microelectronics reliability

    Bressers, HJL., van Driel, WD., Jansen, KMB., Ernst, LJ. & Zhang, GQ., 2007, In : Microelectronics Reliability. 47, p. 290-294 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  37. Deformable silicon electronics using segmentation and flexible interconnect

    Zoumpoulidis, T., WANG, L., Bartek, M., Jansen, KMB. & Ernst, LJ., 2007, Proc. 57th Electronic Components & Technology Conference (ECTC 2007). Bonda R (ed.). Piscataway: IEEE Society, p. 1544-1599 56 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  38. Deformable silicon electronics using segmentation and ultra-thin substrates

    Bartek, M., Zoumpoulidis, T., WANG, L., Jansen, KMB. & Ernst, LJ., 2007, Proceedings of the 4th International Wafer-Level Packaging Conference (IWLPC 2007). s.n. (ed.). Edina: Surface Mount Technology Association (smta.org), p. 1-6 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  39. Design and fabrication of micro-system embedding in flexible substrates

    WANG, L., Zoumpoulidis, T., Jansen, KMB., Bartek, M., Ernst, LJ. & Zhang, GQ., 2007, Proc. 57th Electronic Components & Technology Conference (ECTC 2007). Bonda R (ed.). Piscataway: IEEE Society, p. 311-315 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  40. Effect of filler concentration of rubbery shear and bulk modulus of molding compounds

    Yang, D., Jansen, KMB., Ernst, LJ., Zhang, GQ., Bressers, HJL. & Janssen, JHJ., 2007, In : Microelectronics Reliability. 47, p. 233-239 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  41. Influence of matrix viscoelastic properties on thermal conductivity of TCA - Numerical approach

    Falat, TC., Wymyslowski, A., Kolbe, J., Jansen, KMB. & Ernst, LJ., 2007, In : Microelectronics Reliability. 47, p. 1989-1996 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  42. Measuring the through-plane elastic modulus of thin polymer films in situ

    van Soestbergen, M., Ernst, LJ., Jansen, KMB. & van Driel, WD., 2007, In : Microelectronics Reliability. 47, p. 1983-1988 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

  43. Mechanical characterization of deformable ultra-thin substrates by experiment and FE simulation

    WANG, L., Zoumpoulidis, T., Jansen, KMB., Bartek, M., Zhang, GQ. & Ernst, LJ., 2007, Proc. 57th Electronic Components & Technology Conference (ECTC 2007). Bonda R (ed.). Piscataway: IEEE Society, p. 1056-1061 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  44. Mechanical reliability of a segmented silicon layer on ultra-thin polyimide substrates

    WANG, L., Xiao, A., Jansen, KMB., Bartek, M., Zoumpoulidis, T., Ernst, LJ. & Zhang, GQ., 2007, In : Key Engineering Materials. 353-358, p. 2529-2532 4 p.

    Research output: Contribution to journalArticleScientificpeer-review

  45. Micro-mechanical testing of SiLK by nanoindentation and substrate curvature techniques

    Gonda, V., Jansen, KMB., Ernst, LJ., den Toonder, J. & Zhang, GQ., 2007, In : Microelectronics Reliability. 47, p. 248-251 4 p.

    Research output: Contribution to journalArticleScientificpeer-review

  46. Novel shear tools for viscoelastic characterization of packaging polymers

    van t Hof, C., Jansen, KMB., Wisse, G., Ernst, LJ., Yang, DG., Zhang, GQ. & Bressers, HJL., 2007, In : Microelectronics Reliability. 47, p. 240-247 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  47. Numerical modeling of warpage induced in QFN array molding process

    Yang, D., Jansen, KMB., Ernst, LJ., Zhang, GQ., van Driel, WD., Bressers, HJL. & Janssen, JHJ., 2007, In : Microelectronics Reliability. 47, p. 310-318 9 p.

    Research output: Contribution to journalArticleScientificpeer-review

  48. Polymer Materials Characterization, Modeling and Application

    Ernst, LJ., Jansen, KMB., Yang, D., van t Hof, C., Bressers, HJL., Janssen, JHJ. & Zhang, GQ., 2007, Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging. Suhir, E., Lee, YC. & Wong, CP. (eds.). New York, NY, USA: Springer, p. 1-63 701 p.

    Research output: Chapter in Book/Report/Conference proceedingChapterScientificpeer-review

  49. Ultra-thin deformable silicon substrates with lateral segmentation and flexible metal interconnect

    Zoumpoulidis, T., WANG, L., Bartek, M., Jansen, KMB. & Ernst, LJ., 2007, In : ECS Transactions. 9, 1, p. 103-112 10 p.

    Research output: Contribution to journalConference articleScientificpeer-review

  50. 2006
  51. Filler Contents Effects on the Moisture Absorption and Viscoelasticity of Thermosetting IC Packaging Polymers

    Ma, X., Jansen, KMB., Zhang, GQ. & Ernst, LJ., 2006, Proceedings of 2006 7th International Conference on Electronics Packaging Technology. Sheng Liu (ed.). Shanghai. China: Institute of Electrical and Electronics Engineers (IEEE), p. 161-165 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  52. Flexible interconnects for deformable ultra-thin substrates

    Zoumpoulidis, T., WANG, L., Bartek, M., Jansen, KMB., Polyakov, A., Sosin, S., Ernst, LJ., Dekker, R. & Burghartz, JN., 2006, Proc. 39th International Symposium on Microelectronics. s.n. (ed.). Washington: IMAPS, p. 204-210 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  53. Fully Cure-Dependent Modeling and Characterization of EMC's with Application to Package Warpage Simulation

    Ernst, LJ., Jansen, KMB., Saraswat, MK., van t Hof, C., Zhang, GQ., Yang, DG. & Bressers, HJL., 2006, Proceedings of 2006 7th International Conference on Electronics Packaging Technology. Sheng Liu (ed.). Shanghai, China: Institute of Electrical and Electronics Engineers (IEEE), p. 123-129 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  54. Fully Cure-Dependent Modelling and Characterization of EMC's with Application to Package Warpage Simulation

    Ernst, LJ., Jansen, KMB., Saraswat, MK., Zhang, GQ., Yang, D., van t Hof, C. & Bressers, HJL., 2006, Proceedings 2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties, and Interfaces. sn (ed.). Atlanta, GA, USA: IEEE Society, p. 23-27 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

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