1. 2010
  2. Procedure to determine interfacial toughness of EMC-copper (oxide) interfaces

    Xiao, A., Pape, H., Schlottig, G., Wunderle, W., Leung, YY., Jansen, KMB. & Ernst, LJ., 2010, Proceedings of the 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 16-19 August 2010, Xi'an, China. n.a. (ed.). Xi'an, China: IEEE Society, p. 356-362 7 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  3. Surface modification of polyimide by atmospheric pressure plasma for adhesive bonding with titanium and its application to aviation and space

    Akram, M., Bhowmik, S., Jansen, KMB. & Ernst, LJ., 2010, Proceedings of the SAMPE USA 2010 Conference and Exhibition, 17-20 May 2010, Seattle, WA, USA. s.n. (ed.). Seattle, WA, USA: SAMPE USA, p. 1-10 10 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  4. Surface modification of titanium by atmospheric pressure plasma treatment for adhesive bonding and its application to aviation and space

    Akram, M., Bhowmik, S., Jansen, KMB. & Ernst, LJ., 2010, Proceedings of SEICO 10, SAMPE Europe 31st International Technical Conference and Forum, 12-14 April 2010, Paris, France. n.a. (ed.). Paris, France: SEICO, p. 188-194 7 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  5. Theory of aluminum metallization corrosion in microelectronics

    van Soestbergen, M., Mavinkurve, A., Rongen, RTH., Jansen, KMB., Ernst, LJ. & Zhang, GQ., 2010, In : Electrochimica Acta. 55, p. 5459-5469 11 p.

    Research output: Contribution to journalArticleScientificpeer-review

  6. Thermal aging of molding compounds

    Jansen, KMB., de Vreugd, J., Ernst, LJ. & Bohm, C., 2010, Proceedings of the 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 16-19 August 2010, Xi'an, China. n.a. (ed.). Xi'an, China: IEEE Society, p. 778-780 3 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  7. 2011
  8. Analytical estimate for cure-induced stresses and warpage in flat packages

    Jansen, KMB., de Vreugd, J. & Ernst, LJ., 2011, Proceedings of the 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011, 18-20 April 2011, Linz, Austria. Ernst, LJ., Zhang, GQ., Driel, WD. V., Rodgers, P., Bailey, C. & Saint Leger, O. D. (eds.). Linz, Austria: IEEE Society, p. 1-4 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  9. Atmospheric pressure plasma surface modification of titanium for high temperature adhesive bonding

    Akram, M., Jansen, KMB., Ernst, LJ. & Bhowmik, S., 2011, In : International Journal of Adhesion and Adhesives. 31, p. 598-604 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  10. Characterization and modeling the thermo-mechanical cure-dependent properties of epoxy molding compound

    Sadeghinia, M., Jansen, KMB. & Ernst, LJ., 2011, In : International Journal of Adhesion and Adhesives. 32, p. 82-88 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  11. Comprehensive material characterization and method of its validation by means of FEM simulation

    Gromala, P., Duerr, J., Dressler, M., Jansen, KMB., Hawryluk, ML. & de Vreugd, J., 2011, Proceedings of the 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011, 18-20 April 2011, Linz, Austria. Ernst, LJ., Zhang, GQ., Driel, WD. V., Rodgers, P., Bailey, C. & Saint Leger, O. D. (eds.). Linz, Austria: IEEE Society, p. 1-8 8 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  12. Cure dependent characterisation of moulding compounds

    Jansen, KMB., Hawryluk, ML. & Gromala, P., 2011, Proceedings of the 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011, 18-20 April 2011, Linz, Austria. Ernst, LJ., Zhang, GQ., Driel, WD. V., Rodgers, P., Bailey, C. & Saint Leger, O. D. (eds.). Linz, Austria: IEEE Society, p. 1-6 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  13. Delamination Toughness of Cu-EMC Interfaces at Harsh Environment

    Sadeghinia, M., Jansen, KMB., Ernst, LJ., Schlottig, G. & Pape, H., 2011, Proceedings of IEEE 61st Electronic Components and Technology Conference, 31 May -3 June, 2011, Lake Buena Vista, FL, USA. n.a. (ed.). Lake Buena Vista, FL, USA: IEEE Society, p. 1976-1980 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  14. Fracture toughness of Cu-EMC interfaces under pressure cooker conditions

    Sadeghinia, M., Jansen, KMB., Ernst, LJ., Schlottig, G. & Pape, H., 2011, Proceedings of the 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011, 18-20 April 2011, Linz, Austria. Ernst, LJ., Zhang, GQ., Driel, WD. V., Rodgers, P., Bailey, C. & Saint Leger, O. D. (eds.). Linz, Austria: IEEE Society, p. 1-5 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  15. Moisture absorption analysis of high performance polyimide adhesive

    Akram, M., Jansen, KMB., Bhowmik, S. & Ernst, LJ., 2011, Proceedings of SAMPE Fall Technical Conference 2011, October 17-20, 2011, Fort Worth, Texas, USA. n.a. (ed.). Fort Worth, Texas, USA: SAMPE, p. 1-9 9 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  16. Molecular dynamics study of the traction-displacement relations of epoxy-copper interfaces

    Wong, CKY., Leung, SYY., Poelma, RH., Jansen, KMB., Yuan, CA., van Driel, WD. & Zhang, GQ., 2011, 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2011). Ernst, LJ., Zhang, GQ., Driel, WD. V., Rodgers, P., Bailey, C. & Saint Leger, O. D. (eds.). Piscataway: IEEE Society, p. 1-5 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  17. 2012
  18. Analytical estimate for curing-induced stress and warpage in coating layers

    Jansen, KMB., de Vreugd, J. & Ernst, LJ., 2012, In : Journal of Applied Polymer Science. 126, 5, p. 1623-1630 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  19. Characterization of adhesives and interface strength for automotive applications

    Ozturk, B., Gromala, P., Otto, C., Fischer, A., Jansen, KMB. & Ernst, LJ., 2012, Proceedings of the 13th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and Microsystems, EuroSimE 2012. s.l.: IEEE Society, p. 1-4 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  20. Characterization of the viscoelastic properties of an epoxy molding compound during cure

    Sadeghinia, M., Jansen, KMB. & Ernst, LJ., 2012, In : Microelectronics Reliability. 52, 8, p. 1711-1718 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  21. Damping model for carbon nanotube composites in sports applications

    Dwaikat, MMS., Jansen, KMB. & Spitas, C., 2012, p. 1-1. 1 p.

    Research output: Contribution to conferenceAbstractScientific

  22. Establishing the interfacial fracture properties of cu-emc interfaces at harsh condition

    Sadeghinia, M., Jansen, KMB., Ernst, LJ. & Pape, H., 2012, Proceedings of the 13th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and Microsystems, EuroSimE 2012. s.l.: IEEE Society, p. 1-4 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  23. Establishment of the coarse grained parameters for epoxy-copper interfacial separation

    Wong, KY., Leung, YY., Poelma, RH., Jansen, KMB., Yuan, CA., van Driel, WD. & Zhang, GQ., 2012, In : Journal of Applied Physics. 111, May, p. 1-7 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  24. Establishment of the coarse grained parameters for epoxy-copper interfacial separation

    Wong, KY., Leung, YY., Poelma, RH., Jansen, KMB., Yuan, CA., van Driel, WD. & Zhang, GQ., 2012, Electronic packaging technology and high density packaging (ICEPT-HDP), 2012 Proceedings of the 13th international conference. s.n. (ed.). Piscataway: IEEE Society, p. 1467-1473 7 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  25. Establishment of the mesoscale parameters for epoxy-copper interfacial separation

    Wong, CKY., Leung, SYY., Poelma, RH., Jansen, KMB., Yuan, CCA., van Driel, WD. & Zhang, GQ., 2012, 13th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (EuroSimE 2012). s.l.: IEEE Society, p. 1-6 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  26. Interfacial fracture properties of Cu-EMC interfaces at pressure cooker test conditions

    Sadeghinia, M., Jansen, KMB., Ernst, LJ. & Pape, H., 2012, Proceedings Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd. IEEE Society, p. 752-755 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  27. Residual and bending stress measurements by X-ray diffraction and synchrotron diffraction analysis in silicon solar cells

    Popovich, V., van der Pers, NM., Janssen, M., Bennett, IJ., Jansen, KMB., Wright, J. & Richardson, IM., 2012, Photovoltaic Specialists Conference (PVSC), 2012 38th IEEE. IEEE, p. 442-447 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  28. 2013
  29. Design and thermal testing of smart composite structure for architecture applications

    Lelieveld, C. & Jansen, KMB., 2013, Proceedings of the 6th ECCOMAS conference on smart structures and materials SMART 2013. Carrera, E., Miglioretti, F. & Petrolo, M. (eds.). s.l.: s.n., p. 1-11 11 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  30. Finite element based design of a new dogbone specimen for low cycle fatigue testing of highly filled epoxy-based adhesives for automotive applications

    Ozturk, B., Gromala, P., Silber, C., Jansen, KMB. & Ernst, LJ., 2013, Proceedings of the 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. van Driel, W. & et al (eds.). Piscataway, NJ, USA: IEEE Society, p. 1-4 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  31. Indentation rolling resistance of pipe belt conveyors using threedimensional generalized Maxwell viscoelastic model

    Zamiralova, M., Jansen, KMB. & Lodewijks, G., 2013, Proceedings of the 11th International Congress on Bulk Materials Storage, Handling and Transportation. Jones, M. (ed.). Calaghan, NSW, Australia: University of Newcastle, p. 1-11 11 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  32. Material complexity: 3D printing perspectives

    Doubrovski, EL., Jansen, KMB. & Geraedts, JMP., 2013, In : Inside materials (Nieuwsbrief Delft Centre for Materials). 2013, November, p. 1-2 2 p.

    Research output: Contribution to journalArticleProfessional

  33. Mechanical characterization of epoxy moulding compound in pressurized steam

    Sadeghinia, M., Jansen, KMB., Ernst, LJ. & Pape, H., 2013, In : International Journal of Adhesion and Adhesives. 40, January, p. 103-107 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  34. Photodegradation of bisphenol A polycarbonate under blue light radiation and its effect on optical properties

    Yazdan Mehr, M., van Driel, WD., Jansen, KMB., Deeben, J., Boutelje, M. & Zhang, GQ., 2013, In : Optical Materials. 35, 3, p. 504-508 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  35. Tailoring the viscoelasticity of epoxy thermosets

    Nakka, JS., Jansen, KMB. & Ernst, LJ., 2013, In : Journal of Applied Polymer Science. 128, 6, p. 3794-3806 13 p.

    Research output: Contribution to journalArticleScientificpeer-review

  36. The influence of fiber-matrix adhesion on the linear viscoelastic creep behavior of CF/PPS composites

    Motta Dias, MH., Jansen, KMB., Luinge, H., Nayak, K. & Bersee, HEN., 2013, ICSAAM 2013 The 5th international conference on structural analysis of advanced materials. s.n. (ed.). Islans of Kos, Greece: University of Patras, p. 1-15 15 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

  37. Warpage estimation of a multilayer package including cure shrinkage effects

    Jansen, KMB. & Ozturk, B., 2013, In : IEEE Transactions on Components, Packaging and Manufacturing Technology. 3, 3, p. 459-466 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  38. 2014
  39. A product based lap shear fatigue testing of electrically conductive adhesives

    Ozturk, B., Youssef, A., Gromala, P., Silber, C., Jansen, KMB. & Ernst, LJ., 2014, Proceedings 15th International Conference on Thermal, Mechanical and Multi-physics Simulation and Experiments in Microelectronics and Microsystems. Vandevelde, B. (ed.). Piscataway, NJ, USA: IEEE Society, p. 1-5 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  40. Challenges of viscoelastic characterization of low Tg epoxy based adhesives for automotive applications in DMA and relaxation experiments

    Maus, I., Preu, H., Niessner, M., Fink, M., Jansen, KMB., Pantou, R., Michel, B. & Wunderle, B., 2014, Proceedings of the 15th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems. Vandevelde, B. (ed.). Piscataway: IEEE Society, p. 1-7 7 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  41. Characterization of adhesives for microelectronic industry in DMA and relaxation experiments for interfacial fracture toughness characterization- difficulties and solution

    Maus, I., Preu, H., Niessner, M., Nabi, H., Jansen, KMB., Pantou, R., Weiss, L., Michel, B. & Wunderle, B., 2014, Proceedings of the ESTC Electronic sytem-integration technology conference 2014. s.n. (ed.). Piscataway: IEEE Society, p. 1-7 7 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  42. Experimental investigation and interpretation of the real time, in situ stress measurement during transfer molding using the piezoresistive stress chips

    Rezaie Adli, AR., Jansen, KMB., Schindler-Saefkow, F. & Rost, F., 2014, Proceedings of the 15th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems. Vandevelde, B. (ed.). Piscataway: IEEE Society, p. 1-4 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  43. Finite strain thermomechanical material characterization of adhesives used in automotive electronics for quantitative finite element simulations

    Gromala, P., Silber, C., Jansen, KMB. & Ernst, LJ., 2014, Proceedings of the16th Electronic Packaging Technology Conference - 2014. Yeo, A. & Hong Wan, NG. (eds.). Piscataway, NJ, USA: IEEE Society, p. 411-420 10 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  44. Fracture toughness of Cu-EMC interfaces in pressurized steam

    Sadeghinia, M., Jansen, KMB., Ernst, LJ., Pape, H., Maus, I., van Driel, WD. & Zhang, GQ., 2014, In : International Journal of Adhesion and Adhesives. 49, March, p. 73-79 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  45. Lifetime assessment of Bisphenol-A Polycarbonate (BPA-PC) plastic lens, used in LED-based products

    Yazdan Mehr, M., van Driel, WD., Jansen, KMB., Deeben, P. & Zhang, GQ., 2014, In : Microelectronics Reliability. 54, 1, p. 138-142 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  46. Material parameter identification by combination of stress chip measurements and FE-simulation in MERGE

    Rost, F., Schindler-Saefkow, F., Vogel, D., Rezaie Adli, AR., Jansen, KMB., Rzepka, S., Michel, B., Schaufuß, J., Tsapkolenko, A. & Nossol, P., 2014, Smart system integration conference. s.n. (ed.). s.l.: s.n., p. 1-8 8 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

  47. Measuring the mechanical relevant shrinkage during in-mold and post-mold cure with the stress chip

    Rost, F., Schindler-Saefkow, F., Rezaie Adli, AR., Jansen, KMB., Wunderle, B., Keller, J., Rzepka, S. & Michel, B., 2014, Proceedings of the 15th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems. Vandevelde, B. (ed.). Piscataway: IEEE Society, p. 1-5 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  48. The influence of fiber-matrix adhesion on the linear viscoelastic creep behavior of CF/PPS composites

    Motta Dias, MH., Jansen, KMB., Luinge, H., Nayak, K. & Bersee, HEN., 2014, AMS2014: The 1st international conference on ageing of materials and structures. s.n. (ed.). s.l.: s.n., p. 1-15 15 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  49. Thermal-electric characterization and modelling of smart composite structure for architectural applications

    Lelieveld, C. & Jansen, KMB., 2014, In : Smart Materials and Structures. 23, 6, p. 1-8 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  50. 2015
  51. A new procedure for thermo-viscoelastic modelling of composites with general orthotropy and geometry

    Abouhamzeh, M., Sinke, J., Jansen, KMB. & Benedictus, R., 2015, In : Composite Structures. 133, p. 871-877 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  52. Characterization and simulation of LTCC/adhesive and alloy 42/adhesive interface strength for automotive applications

    Ozturk, B., Lou, P., Gromala, P., Silber, C., Jansen, KMB. & Ernst, LJ., 2015, Proceedings of the 2015 16th INternational Conference on Thermal, Mechanical and Multi-physics Simulation and Experiments in Microelectronics and Microsystems. s.n. (ed.). Piscataway, NJ, USA: IEEE Society, p. 1-10 10 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  53. Closed form expression for residual stresses and warpage during cure of composite laminates

    Abouhamzeh, M., Sinke, J., Jansen, KMB. & Benedictus, R., 2015, In : Composite Structures. 133, 01, p. 902-910 9 p.

    Research output: Contribution to journalArticleScientificpeer-review

  54. Color shift investigations for LED secondary optical designs: Comparison between BPA-PC and PMMA

    Lu, G., Yazdan Mehr, M., van Driel, WD., Fan, X., Fan, J., Jansen, KMB. & Zhang, GQ., 2015, In : Optical Materials. 45, p. 37-41 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  55. Degradation of microcellular PET reflective materials used in LED-based products

    Lu, G., van Driel, WD., Fan, X., Yazdan Mehr, M., Fan, J., Jansen, KMB. & Zhang, GQ., 2015, In : Optical Materials. 49, November, p. 79-84 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

  56. Effect of atmospheric pressure plasma modification on polyimide and adhesive joining with titanium

    Akram, M., Jansen, KMB., Ernst, LJ., Bhowmik, S., Ajeesh, G., Ahmed, S. & Chakraborty, D., 2015, In : Metallurgical and Materials Transactions A - Physical Metallurgy and Materials Science. 46, 10, p. 4680-4687 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

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