1. A Characterization Method for Viscoelastic Bulk Modulus of Molding Compounds

    Saraswat, MK., Jansen, KMB., Patel, MD., Ernst, LJ., Bohm, C., Kessler, A., Preu, H. & Stecher, M., 2008, Proceedings of the 9th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P. & Saint Leger, O. de (eds.). Freiburg-im-Breisgau: EuroSimE, p. 463-466 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  2. A Micromechanics-Based Vapor Pressure Model in Electronic Packages

    Fan, XJ., Zhou, J., Zhang, GQ. & Ernst, LJ., 2005, In : Journal of Electronic Packaging. 127, p. 262-267 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

  3. A New Method to Measure the Moisture Expansion in Plastic Packaging Materials

    Ma, X., Jansen, KMB., Ernst, LJ., van Driel, WD., van der Sluis, O. & Zhang, GQ., 2009, Proceedings of the 2009 Electronic Components and Technology Conference, ECTC2009, May 26-29, 2009, San Diego, CA, USA. Banda, R., Trewhella, J. & Bezuk, S. (eds.). IEEE Society, p. 1271-1276 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  4. A fast moisture sensitivity level qualification method

    Ma, X., Jansen, KMB., Zhang, GQ., van Driel, WD., van der Sluis, O., Ernst, LJ., Regards, C., Gautier, C. & Frémont, H., 2010, In : Microelectronics Reliability. 50, 2010, p. 1654-1660 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  5. A micro-mechanics approach for polymeric material failures in microelectronic packaging

    Fan, XJ., Zhang, GQ. & Ernst, LJ., 2002, 3rd international conference on benefiting from thermal and mechanical simulation in (micro)-electronics. Ernst, LJ., Zhang, GQ., Dudek, R. & de Saint Leger, O. (eds.). Piscataway: IEEE Society, p. 154-164 11 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  6. A model for determining crack opening stress intensity factor ratio under tri-axial stress state

    He, YT., Li, F., Shi, R., Zhang, GQ., Ernst, LJ. & Fu, XJ., 2005, In : Key Engineering Materials. 297-300, p. 1572-1578 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  7. A new ultimate strength model of notched composite laminates - including the effects of matrix failure

    Liu, CJ., Nijhof, AHJ., Ernst, LJ. & Marissen, R., 2009, In : Journal of Composite Materials. 44, 11, p. 1335-1349 15 p.

    Research output: Contribution to journalArticleScientificpeer-review

  8. A non-Gaussian network alteration model

    Ernst, LJ. & Septanika, EG., 1999, Proceedings of the first European conference on constitutive models for rubber, 9-10 September 1999. A Dorfman & A Muhr (eds.). Rotterdam: CRC Press / Balkema - Taylor & Francis Group, p. 169-180 12 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  9. A novel tool for cure dependent viscoelastic characterization of packaging polymers

    van t Hof, C., Wisse, G., Ernst, LJ., Jansen, KMB., Yang, D., Zhang, GQ. & Bressers, HJL., 2004, EuroSimE 2004: 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems. Ernst, LJ., Zhang, GQ., Rodgers, P. & de Saint Leger, O. (eds.). Piscataway: IEEE Society, p. 385-389 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  10. A product based lap shear fatigue testing of electrically conductive adhesives

    Ozturk, B., Youssef, A., Gromala, P., Silber, C., Jansen, KMB. & Ernst, LJ., 2014, Proceedings 15th International Conference on Thermal, Mechanical and Multi-physics Simulation and Experiments in Microelectronics and Microsystems. Vandevelde, B. (ed.). Piscataway, NJ, USA: IEEE Society, p. 1-5 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

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