1. 2011
  2. Characterization and modeling the thermo-mechanical cure-dependent properties of epoxy molding compound

    Sadeghinia, M., Jansen, KMB. & Ernst, LJ., 2011, In : International Journal of Adhesion and Adhesives. 32, p. 82-88 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  3. Delamination Toughness of Cu-EMC Interfaces at Harsh Environment

    Sadeghinia, M., Jansen, KMB., Ernst, LJ., Schlottig, G. & Pape, H., 2011, Proceedings of IEEE 61st Electronic Components and Technology Conference, 31 May -3 June, 2011, Lake Buena Vista, FL, USA. n.a. (ed.). Lake Buena Vista, FL, USA: IEEE Society, p. 1976-1980 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  4. Fracture toughness of Cu-EMC interfaces under pressure cooker conditions

    Sadeghinia, M., Jansen, KMB., Ernst, LJ., Schlottig, G. & Pape, H., 2011, Proceedings of the 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011, 18-20 April 2011, Linz, Austria. Ernst, LJ., Zhang, GQ., Driel, WD. V., Rodgers, P., Bailey, C. & Saint Leger, O. D. (eds.). Linz, Austria: IEEE Society, p. 1-5 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  5. Moisture absorption analysis of high performance polyimide adhesive

    Akram, M., Jansen, KMB., Bhowmik, S. & Ernst, LJ., 2011, Proceedings of SAMPE Fall Technical Conference 2011, October 17-20, 2011, Fort Worth, Texas, USA. n.a. (ed.). Fort Worth, Texas, USA: SAMPE, p. 1-9 9 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  6. Prediction of mixed-mode interfacial fracture from cohesive zone finite element model: testing and determination of fracture process parameters

    Leung, YY., Sadeghinia, M., Pape, H. & Ernst, LJ., 2011, Proceedings of the 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011, 18-20 April 2011, Linz, Austria. Ernst, LJ., Zhang, GQ., Driel, WD. V., Rodgers, P., Bailey, C. & Saint Leger, O. D. (eds.). Linz, Austria: IEEE Society, p. 1-7 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  7. 2010
  8. A fast moisture sensitivity level qualification method

    Ma, X., Jansen, KMB., Zhang, GQ., van Driel, WD., van der Sluis, O., Ernst, LJ., Regards, C., Gautier, C. & Frémont, H., 2010, In : Microelectronics Reliability. 50, 2010, p. 1654-1660 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  9. Delamination and combined compound cracking of EMC-copper interfaces

    Xiao, A., Schlottig, G., Pape, H., Wunderle, B., Jansen, KMB. & Ernst, LJ., 2010, Proceedings of the 60th Electronic Components and Technology Conference (ECTC), 1-4 June 2010, Las Vegas, NV, USA. n.a. (ed.). Las Vegas, NV, USA: IEEE Society, p. 114-120 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  10. Die attach interface property characterization as function of temperature using cohesive zone modeling method

    Ma, X., Zhang, GQ., van der Sluis, O., Jansen, KMB., van Driel, WD. & Ernst, LJ., 2010, Proceedings of the 11th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2010, 26-28 April 2010, Bordeaux, France. Ernst, LJ, Zhang, GQ, Driel, WD van, Rodgers, P, Bailey, C & Saint Leger, O de (eds.). Bordeaux, France: IEEE Society, p. 1-8 8 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  11. Fracture and Delamination in Microelectronic Devices.

    Ernst, LJ., van Driel, WD., van der Sluis, O., Corigliano, A. & Tay, AAO., 2010, Smart systems integration and reliability.. Bernd, M. & Klaus-Dieter, L. (eds.). Dresden: Goldenbogen Verlag, p. 634-663 824 p.

    Research output: Chapter in Book/Report/Conference proceedingChapterScientific

  12. High temperature storage influence on molding compound properties

    de Vreugd, J., Jansen, KMB., Ernst, LJ., Bohm, C. & Pufall, R., 2010, Proceedings of the 11th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2010, 26-28 April 2010, Bordeaux, France. Ernst, LJ, Zhang, GQ, Driel, WD van, Rodgers, P, Bailey, C & Saint Leger, O. de (eds.). IEEE Society, p. 1-6 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

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