1. 2009
  2. Moisture absorption and hygroscopic swelling characterization of molding compound

    de Vreugd, J., Jansen, KMB., Ernst, LJ. & Bohm, C., 2009, Proceedings of the 11th International Conference on Electronic Material and Packaging, 1-3 December 2009, Penang, Malaysia. n.a. (ed.). Penang, Malaysia: n.a., p. 1-6 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  3. On Electrochemical Cell Modeling as Basis for Predicting Corrosion Failures in Plastic Encapsulated Microelectronics

    van Soestbergen, M., Rongen, RTH., Mavinkurve, A., Zhang, GQ. & Ernst, LJ., 2009, Proceedings of EuroSimE 2009. Ernst, L. J., Zhang, G. Q., Driel, W. D. V., Rodgers, P., Bailey, C. & Saint Leger, O. D. (eds.). Delft: IEEE Society, p. 1-7 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  4. 2008
  5. A Characterization Method for Viscoelastic Bulk Modulus of Molding Compounds

    Saraswat, MK., Jansen, KMB., Patel, MD., Ernst, LJ., Bohm, C., Kessler, A., Preu, H. & Stecher, M., 2008, Proceedings of the 9th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P. & Saint Leger, O. de (eds.). Freiburg-im-Breisgau: EuroSimE, p. 463-466 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  6. Advanced Viscoelastic Material Model for Predicting Warpage of a QFN Panel

    de Vreugd, J., Jansen, KMB., Xiao, A., Ernst, LJ., Bohm, C., Kessler, A., Preu, H. & Stecher, M., 2008, 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, USA. Wipiejewski, T. & Trewhella, J. (eds.). Orlando, FL, USA: IEEE Society, p. 1635-1640 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  7. Characterization and modeling of molding compound properties during cure

    Jansen, KMB., Qian, C., Ernst, LJ., Bohm, C., Kessler, A., Preu, H. & Stecher, M., 2008, Proceedings of the 9th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P. & Saint Leger, O. de (eds.). Freiburg-im-Breisgau: EuroSimE, p. 610-613 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  8. Driving Mechanisms of Delamination Related Reliability Problems in Exposed Pad Packages

    van Driel, WD., van Gils, M., Fan, X., Zhang, GQ. & Ernst, LJ., 2008, In : IEEE Transactions on Components and Packaging Technology. 31, 2, p. 260-268 9 p.

    Research output: Contribution to journalArticleScientificpeer-review

  9. Effecs of molding pressure on the warpage and the viscoelasticities of HVQFN packages

    Gui, DY., Ernst, LJ., Jansen, KMB., Yang, D., Goumans, L., Bressers, HJL. & Janssen, JHJ., 2008, In : Journal of Applied Polymer Science. 109, 3, p. 2016-2022 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  10. Effect of aging of packaging materials on die surface cracking of a SiP carrier

    Ma, X., Jansen, KMB., Ernst, LJ., van Driel, WD., van der Sluis, O., Zhang, GQ., Regard, C., Gautier, C. & Frémont, H., 2008, Proceedings of the 9th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P. & Saint Leger, O. de (eds.). Freiburg-im-Breisgau: EuroSimE, p. 361-364 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  11. Effect of the epoxy resin chemistry on the viscoelasticity of its cured product

    Nakka, JS., Jansen, KMB., Ernst, LJ. & Jager, WF., 2008, In : Journal of Applied Polymer Science. 108, p. 1414-1420 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  12. Effects of Molding Compound Cure on Warpage of Electronic Packages

    de Vreugd, J., Jansen, KMB., Ernst, LJ., Bohm, C., Kessler, A. & Preu, H., 2008, Proceedings EPTC 2008. Lee, R. (ed.). Singapore: IEEE Society, p. 675-682 8 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

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