1. 2008
  2. Electrical Characterization Of Plastic Encapsulations Using An Alternative Gate Leakage Test Method

    van Soestbergen, M., Rongen, RTH., Knol, J., Mavinkurve, A., Egbers, JH., Nath, S., Zhang, GQ. & Ernst, LJ., 2008, 2008 IEEE International Reliability Physics Symposium Proceedings 46th Annual, Phoenix, Arizona, April 27-May 1, 2008. Cole, E.I., Graas, C.D., McPherson, J.W., Street, A.G., Kasprzak, L.A., Mielke, N.R., Suehle, J.S., Lacoe, R.C., Schafft, H.A. & Tonti, W.R. (eds.). Phoenix, AZ: IEEE Society, p. 462-467 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  3. Free-standing, parylene-sealed copper interconnect for stretchable silicon electronics

    Sosin, S., Zoumpoulidis, T., Bartek, M., Wang, L., Dekker, R., Jansen, KMB. & Ernst, LJ., 2008, 2008 proceedings 58th electronic components & technology conference, Lake Buena Vista, FL, USA. Wipiejewski, T. & Trewhella, J. (eds.). Orlando, FL, USA: IEEE Society, p. 1339-1345 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  4. Interface Characterization and Failure Modeling for Semiconductor Packages

    Ernst, LJ., Xiao, A., Wunderle, B., Jansen, KMB. & Pape, H., 2008, Proceedings EPTC 2008. Lee, R. (ed.). Singapore: IEEE Society, p. 808-815 8 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  5. Interfacial Delamination Mechanisms During Soldering Reflow With Moisture Preconditioning

    Fan, X., Zhang, GQ., van Driel, WD. & Ernst, LJ., 2008, In : IEEE Transactions on Components and Packaging Technology. 31, 2, p. 252-259 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  6. Interfacial Fracture Properties and Failure Modeling for Microelectronics

    Xiao, A., Pape, H., Wunderle, B., Jansen, KMB., de Vreugd, J. & Ernst, LJ., 2008, 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, USA. Wipiejewski, T. & Trewhella, J. (eds.). Orlando, FL, USA: IEEE Society, p. 1724-1730 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  7. Ionic polarisation layers in polymer electrolytes

    Biesheuvel, PM., van Soestbergen, M., Mavinkurve, A., Ernst, LJ. & Zhang, GQ., 2008, Proceedings of the 9th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P. & Saint Leger, O. de (eds.). Freiburg-im-Breisgau: EuroSimE, p. 644-648 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  8. Mesh interconnects for silicone embedded stretchable silicon electronics

    Sosin, S., Zoumpoulidis, T., Bartek, M., Wang, L., Jansen, KMB. & Ernst, LJ., 2008, Proc. 10th electronics packaging technology conference (EPTC 2008). Yang, T. & Kheng, T. (eds.). Piscataway, Singapore: IEEE Society, p. 230-235 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  9. Mixed mode interface characerization considering thermal redisidual stress

    Xiao, A., Schlottig, G., Wunderle, B., Jansen, KMB. & Ernst, LJ., 2008, Proceedings 2008 International conference on electronic packaging technology & high density packaging. Bi, K. & Xiao, F. (eds.). IEEE Society, p. 1-8 8 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  10. Modeling failure interaction in notched cross-ply laminates

    Liu, CJ., Nijhof, AHJ., Ernst, LJ. & Marissen, R., 2008, In : Journal of Composite Materials. 42, 20, p. 2175-2193 19 p.

    Research output: Contribution to journalArticleScientificpeer-review

  11. Modeling ion transport through molding compounds and its relation to product reliability

    van Soestbergen, M., Rongen, RTH., Ernst, LJ. & Zhang, GQ., 2008, Proceedings 2008 International conference on electronic packaging technology & high density packaging. Bi, K. & Xiao, F. (eds.). IEEE Society, p. 1-8 8 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

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