1. 2017
  2. Modelling of Thermal Aging of Moulding Compound by using an Equivalent Layer Assumption

    Zhang, B., Lion, A., Johlitz, M., Ernst, L., Jansen, K., Vu, D-K. & Weiss, L., 2017, 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017. IEEE, p. 1-6 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  3. 2016
  4. Aging of epoxy moulding compound: Thermomechanical properties during high temperature storage

    Zhang, B., Johlitz, M., Lion, A., Ernst, L., Jansen, K., Vu, D-K. & Weiss, L., 2016, Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE): 2016 17th International Conference. Piscataway: IEEE Society, p. 1-6 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  5. Atmospheric plasma modification of polyimide sheet for joining to titanium with high temperature adhesive

    Akram, M., Jansen, KMB., Ernst, LJ. & Bhowmik, S., 2016, In : International Journal of Adhesion and Adhesives. 65, p. 63-69

    Research output: Contribution to journalArticleScientificpeer-review

  6. 2015
  7. Characterization and simulation of LTCC/adhesive and alloy 42/adhesive interface strength for automotive applications

    Ozturk, B., Lou, P., Gromala, P., Silber, C., Jansen, KMB. & Ernst, LJ., 2015, Proceedings of the 2015 16th INternational Conference on Thermal, Mechanical and Multi-physics Simulation and Experiments in Microelectronics and Microsystems. s.n. (ed.). Piscataway, NJ, USA: IEEE Society, p. 1-10 10 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  8. Effect of atmospheric pressure plasma modification on polyimide and adhesive joining with titanium

    Akram, M., Jansen, KMB., Ernst, LJ., Bhowmik, S., Ajeesh, G., Ahmed, S. & Chakraborty, D., 2015, In : Metallurgical and Materials Transactions A - Physical Metallurgy and Materials Science. 46, 10, p. 4680-4687 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  9. Material characterization and nonlinear viscoelastic modelling of epoxy based thermosets for automotive application

    Gromala, P., Muthuraman, B., Ozturk, B., Jansen, KMB. & Ernst, LJ., 2015, Thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (EurosimE 2015), proceedings of the 16 international conference. s.n. (ed.). s.l.: IEEE Society, p. 1-7 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  10. Numerical prediction of residual stresses evolving during packaging of ICs

    Rezaie Adli, AR., Jansen, KMB. & Ernst, LJ., 2015, Thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (EurosimE 2015), proceedings of the 16 international conference. s.n. (ed.). Piscataway, NJ: IEEE Society, p. 1-6 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  11. 2014
  12. A product based lap shear fatigue testing of electrically conductive adhesives

    Ozturk, B., Youssef, A., Gromala, P., Silber, C., Jansen, KMB. & Ernst, LJ., 2014, Proceedings 15th International Conference on Thermal, Mechanical and Multi-physics Simulation and Experiments in Microelectronics and Microsystems. Vandevelde, B. (ed.). Piscataway, NJ, USA: IEEE Society, p. 1-5 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  13. Finite strain thermomechanical material characterization of adhesives used in automotive electronics for quantitative finite element simulations

    Gromala, P., Silber, C., Jansen, KMB. & Ernst, LJ., 2014, Proceedings of the16th Electronic Packaging Technology Conference - 2014. Yeo, A. & Hong Wan, NG. (eds.). Piscataway, NJ, USA: IEEE Society, p. 411-420 10 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  14. Fracture toughness of Cu-EMC interfaces in pressurized steam

    Sadeghinia, M., Jansen, KMB., Ernst, LJ., Pape, H., Maus, I., van Driel, WD. & Zhang, GQ., 2014, In : International Journal of Adhesion and Adhesives. 49, March, p. 73-79 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  15. 2013
  16. Finite element based design of a new dogbone specimen for low cycle fatigue testing of highly filled epoxy-based adhesives for automotive applications

    Ozturk, B., Gromala, P., Silber, C., Jansen, KMB. & Ernst, LJ., 2013, Proceedings of the 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. van Driel, W. & et al (eds.). Piscataway, NJ, USA: IEEE Society, p. 1-4 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  17. Mechanical characterization of epoxy moulding compound in pressurized steam

    Sadeghinia, M., Jansen, KMB., Ernst, LJ. & Pape, H., 2013, In : International Journal of Adhesion and Adhesives. 40, January, p. 103-107 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  18. Tailoring the viscoelasticity of epoxy thermosets

    Nakka, JS., Jansen, KMB. & Ernst, LJ., 2013, In : Journal of Applied Polymer Science. 128, 6, p. 3794-3806 13 p.

    Research output: Contribution to journalArticleScientificpeer-review

  19. 2012
  20. Analytical estimate for curing-induced stress and warpage in coating layers

    Jansen, KMB., de Vreugd, J. & Ernst, LJ., 2012, In : Journal of Applied Polymer Science. 126, 5, p. 1623-1630 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  21. Characterization of adhesives and interface strength for automotive applications

    Ozturk, B., Gromala, P., Otto, C., Fischer, A., Jansen, KMB. & Ernst, LJ., 2012, Proceedings of the 13th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and Microsystems, EuroSimE 2012. s.l.: IEEE Society, p. 1-4 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  22. Characterization of the viscoelastic properties of an epoxy molding compound during cure

    Sadeghinia, M., Jansen, KMB. & Ernst, LJ., 2012, In : Microelectronics Reliability. 52, 8, p. 1711-1718 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  23. Establishing the interfacial fracture properties of cu-emc interfaces at harsh condition

    Sadeghinia, M., Jansen, KMB., Ernst, LJ. & Pape, H., 2012, Proceedings of the 13th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and Microsystems, EuroSimE 2012. s.l.: IEEE Society, p. 1-4 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  24. Interfacial fracture properties of Cu-EMC interfaces at pressure cooker test conditions

    Sadeghinia, M., Jansen, KMB., Ernst, LJ. & Pape, H., 2012, Proceedings Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd. IEEE Society, p. 752-755 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  25. 2011
  26. Analytical estimate for cure-induced stresses and warpage in flat packages

    Jansen, KMB., de Vreugd, J. & Ernst, LJ., 2011, Proceedings of the 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011, 18-20 April 2011, Linz, Austria. Ernst, LJ., Zhang, GQ., Driel, WD. V., Rodgers, P., Bailey, C. & Saint Leger, O. D. (eds.). Linz, Austria: IEEE Society, p. 1-4 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  27. Atmospheric pressure plasma surface modification of titanium for high temperature adhesive bonding

    Akram, M., Jansen, KMB., Ernst, LJ. & Bhowmik, S., 2011, In : International Journal of Adhesion and Adhesives. 31, p. 598-604 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  28. Characterization and modeling the thermo-mechanical cure-dependent properties of epoxy molding compound

    Sadeghinia, M., Jansen, KMB. & Ernst, LJ., 2011, In : International Journal of Adhesion and Adhesives. 32, p. 82-88 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  29. Delamination Toughness of Cu-EMC Interfaces at Harsh Environment

    Sadeghinia, M., Jansen, KMB., Ernst, LJ., Schlottig, G. & Pape, H., 2011, Proceedings of IEEE 61st Electronic Components and Technology Conference, 31 May -3 June, 2011, Lake Buena Vista, FL, USA. n.a. (ed.). Lake Buena Vista, FL, USA: IEEE Society, p. 1976-1980 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  30. Fracture toughness of Cu-EMC interfaces under pressure cooker conditions

    Sadeghinia, M., Jansen, KMB., Ernst, LJ., Schlottig, G. & Pape, H., 2011, Proceedings of the 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011, 18-20 April 2011, Linz, Austria. Ernst, LJ., Zhang, GQ., Driel, WD. V., Rodgers, P., Bailey, C. & Saint Leger, O. D. (eds.). Linz, Austria: IEEE Society, p. 1-5 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  31. Moisture absorption analysis of high performance polyimide adhesive

    Akram, M., Jansen, KMB., Bhowmik, S. & Ernst, LJ., 2011, Proceedings of SAMPE Fall Technical Conference 2011, October 17-20, 2011, Fort Worth, Texas, USA. n.a. (ed.). Fort Worth, Texas, USA: SAMPE, p. 1-9 9 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  32. Prediction of mixed-mode interfacial fracture from cohesive zone finite element model: testing and determination of fracture process parameters

    Leung, YY., Sadeghinia, M., Pape, H. & Ernst, LJ., 2011, Proceedings of the 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011, 18-20 April 2011, Linz, Austria. Ernst, LJ., Zhang, GQ., Driel, WD. V., Rodgers, P., Bailey, C. & Saint Leger, O. D. (eds.). Linz, Austria: IEEE Society, p. 1-7 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  33. 2010
  34. A fast moisture sensitivity level qualification method

    Ma, X., Jansen, KMB., Zhang, GQ., van Driel, WD., van der Sluis, O., Ernst, LJ., Regards, C., Gautier, C. & Frémont, H., 2010, In : Microelectronics Reliability. 50, 2010, p. 1654-1660 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  35. Delamination and combined compound cracking of EMC-copper interfaces

    Xiao, A., Schlottig, G., Pape, H., Wunderle, B., Jansen, KMB. & Ernst, LJ., 2010, Proceedings of the 60th Electronic Components and Technology Conference (ECTC), 1-4 June 2010, Las Vegas, NV, USA. n.a. (ed.). Las Vegas, NV, USA: IEEE Society, p. 114-120 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  36. Die attach interface property characterization as function of temperature using cohesive zone modeling method

    Ma, X., Zhang, GQ., van der Sluis, O., Jansen, KMB., van Driel, WD. & Ernst, LJ., 2010, Proceedings of the 11th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2010, 26-28 April 2010, Bordeaux, France. Ernst, LJ, Zhang, GQ, Driel, WD van, Rodgers, P, Bailey, C & Saint Leger, O de (eds.). Bordeaux, France: IEEE Society, p. 1-8 8 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  37. Fracture and Delamination in Microelectronic Devices.

    Ernst, LJ., van Driel, WD., van der Sluis, O., Corigliano, A. & Tay, AAO., 2010, Smart systems integration and reliability.. Bernd, M. & Klaus-Dieter, L. (eds.). Dresden: Goldenbogen Verlag, p. 634-663 824 p.

    Research output: Chapter in Book/Report/Conference proceedingChapterScientific

  38. High temperature storage influence on molding compound properties

    de Vreugd, J., Jansen, KMB., Ernst, LJ., Bohm, C. & Pufall, R., 2010, Proceedings of the 11th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2010, 26-28 April 2010, Bordeaux, France. Ernst, LJ, Zhang, GQ, Driel, WD van, Rodgers, P, Bailey, C & Saint Leger, O. de (eds.). IEEE Society, p. 1-6 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  39. Interfacial fracture parameters of silicon-to-molding compound

    Schlottig, G., Maus, I., Walter, H., Jansen, KMB., Pape, H., Wunderle, B. & Ernst, LJ., 2010, Proceedings 60th Electronic Components and Technology Conference (ECTC), 1-4- June 2010, Las Vegas, NV, USA. n.a. (ed.). IEEE Society, p. 1939-1945 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  40. Interfacial strength of silicon-to-molding compound changes with thermal residual stress

    Schlottig, G., Xiao, A., Pape, H., Wunderle, B. & Ernst, LJ., 2010, Proceedings of the 11th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2010, 26-28 April 2010, Bordeaux, France. Ernst, LJ, Zhang, GQ, Driel, WD van, Rodgers, P, Bailey, C & Saint Leger, O de (eds.). Bordeaux, France: IEEE Society, p. 1-5 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  41. Prediction of cure induced warpage of micro-electronic products

    de Vreugd, J., Jansen, KMB., Ernst, LJ. & Bohm, C., 2010, In : Microelectronics Reliability. 50, p. 910-916 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  42. Procedure to determine interfacial toughness of EMC-copper (oxide) interfaces

    Xiao, A., Pape, H., Schlottig, G., Wunderle, W., Leung, YY., Jansen, KMB. & Ernst, LJ., 2010, Proceedings of the 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 16-19 August 2010, Xi'an, China. n.a. (ed.). Xi'an, China: IEEE Society, p. 356-362 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  43. Surface modification of polyimide by atmospheric pressure plasma for adhesive bonding with titanium and its application to aviation and space

    Akram, M., Bhowmik, S., Jansen, KMB. & Ernst, LJ., 2010, Proceedings of the SAMPE USA 2010 Conference and Exhibition, 17-20 May 2010, Seattle, WA, USA. s.n. (ed.). Seattle, WA, USA: SAMPE USA, p. 1-10 10 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  44. Surface modification of titanium by atmospheric pressure plasma treatment for adhesive bonding and its application to aviation and space

    Akram, M., Bhowmik, S., Jansen, KMB. & Ernst, LJ., 2010, Proceedings of SEICO 10, SAMPE Europe 31st International Technical Conference and Forum, 12-14 April 2010, Paris, France. n.a. (ed.). Paris, France: SEICO, p. 188-194 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  45. Theory of aluminum metallization corrosion in microelectronics

    van Soestbergen, M., Mavinkurve, A., Rongen, RTH., Jansen, KMB., Ernst, LJ. & Zhang, GQ., 2010, In : Electrochimica Acta. 55, p. 5459-5469 11 p.

    Research output: Contribution to journalArticleScientificpeer-review

  46. Thermal aging of molding compounds

    Jansen, KMB., de Vreugd, J., Ernst, LJ. & Bohm, C., 2010, Proceedings of the 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 16-19 August 2010, Xi'an, China. n.a. (ed.). Xi'an, China: IEEE Society, p. 778-780 3 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  47. 2009
  48. A New Method to Measure the Moisture Expansion in Plastic Packaging Materials

    Ma, X., Jansen, KMB., Ernst, LJ., van Driel, WD., van der Sluis, O. & Zhang, GQ., 2009, Proceedings of the 2009 Electronic Components and Technology Conference, ECTC2009, May 26-29, 2009, San Diego, CA, USA. Banda, R., Trewhella, J. & Bezuk, S. (eds.). IEEE Society, p. 1271-1276 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  49. A new ultimate strength model of notched composite laminates - including the effects of matrix failure

    Liu, CJ., Nijhof, AHJ., Ernst, LJ. & Marissen, R., 2009, In : Journal of Composite Materials. 44, 11, p. 1335-1349 15 p.

    Research output: Contribution to journalArticleScientificpeer-review

  50. Cure induced Warpage of micro-electronics: comparison with experiments

    de Vreugd, J., Jansen, KMB., Ernst, LJ., Bohm, C. & Falat, TC., 2009, Proceedings of the 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2009, 27-29 April 2009, Delft, The Netherlands. Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P., Bailey, C. & Saint Leger, O. de (eds.). IEEE Society, p. 374-377 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  51. Effect of Postcure and Thermal Aging on Molding Compound Properties

    de Vreugd, J., Sanchez Monforte, A., Jansen, KMB., Ernst, LJ., Bohm, C., Kessler, A. & Preu, H., 2009, Proceedings of the 11th Electronics Packaging Technology Conference, EPTC 2009, 9-11 December 2009, Singapore. s.n. (ed.). Singapore: IEEE Society, p. 342-347 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  52. Establishing Fracture Properties of EMC-Copper Interfaces in the Visco-Elastic Temperature Region

    Xiao, A., de Vreugd, J., Pape, H., Wunderle, B., Jansen, KMB. & Ernst, LJ., 2009, Proceedings of the 2009 IEEE 59th Electronic Components and Technology Conference, 26-29 May 2009, San Diego, CA, USA. Bonda, R. & Dias, R. (eds.). San Diego, CA, USA: IEEE Society, p. 239-245 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  53. Establishing fracture properties of EMC-copper (-oxide) interfaces

    Ernst, LJ., Xiao, A., de Vreugd, J., Jansen, KMB., Pape, H., Schlottig, G. & Wunderle, B., 2009, Proceedings of the 2009 IEEE 70th Vehicular Technology Conference Fall, 20-23 September 2009, Anchorage, Alaska. n.a. (ed.). Anchorage, Alaska: IEEE Society, p. 1-6 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  54. Fast Qualification Using Thermal Shock Combined with Moisture Absorption

    Ma, X., Zhang, GQ., Jansen, KMB., van Driel, WD., van der Sluis, O., Ernst, LJ., Regard, C., Gautier, C. & Frémont, H., 2009, Proceedings of the International Conference on Electronic Packaging Technology & High Density Packaging, ICEPT-HDP 2009, August 10-13, 2009, Beijing, China. Keyun Bi & Jian CaI (eds.). IEEE Society, p. 1-6 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  55. Induced Delamination of Silicon-Molding Compound Interfaces

    Schlottig, G., Pape, H., Wunderle, B. & Ernst, LJ., 2009, Proceedings of the 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2009, 27-29 April 2009, Delft, The Netherlands. Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P., Bailey, C. & Saint Leger, O. de (eds.). IEEE Society, p. 731-734 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  56. Investigation on Thermal Properties of Crosslinked Epoxy Resin by MD Simulation

    Liao, N., Zhang, GQ., Pavel, D., van der Sluis, O., Jansen, KMB. & Ernst, LJ., 2009, Proceedings of the 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2009, 27-29 April 2009, Delft, The Netherlands. Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P., Bailey, C. & Saint Leger, O. de (eds.). IEEE Society, p. 546-549 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  57. Modeling Electrochemical Migration through Plastic Microelectronics Encapsulations

    van Soestbergen, M., Mavinkurve, A., Rongen, RTH., Ernst, LJ. & Zhang, GQ., 2009, Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging, ICEPT-HDP 2009, 10-13 August 2009, Beijing, China. Bi, K & Cai, J (eds.). Beijing, China: IEEE Society, p. 1079-1082 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  58. Modeling and characterization of molding compound properties during cure

    Jansen, KMB., Qian, C., Ernst, LJ., Bohm, C., Kessler, A., Preu, H. & Stecher, M., 2009, In : Microelectronics Reliability. 49, 2009, p. 872-876 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  59. Moisture Effects on a System in Package Carrier

    Ma, X., Jansen, KMB., Ernst, LJ., van Driel, WD., van der Sluis, O. & Zhang, GQ., 2009, Proceedings of the 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2009, 27-29 April 2009, Delft, The Netherlands. Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P., Bailey, C. & Saint Leger, O. de (eds.). IEEE Society, p. 379-383 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

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