1. 2017
  2. Modelling of Thermal Aging of Moulding Compound by using an Equivalent Layer Assumption

    Zhang, B., Lion, A., Johlitz, M., Ernst, L., Jansen, K., Vu, D-K. & Weiss, L., 2017, 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017. IEEE, p. 1-6 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  3. 2016
  4. Aging of epoxy moulding compound: Thermomechanical properties during high temperature storage

    Zhang, B., Johlitz, M., Lion, A., Ernst, L., Jansen, K., Vu, D-K. & Weiss, L., 2016, Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE): 2016 17th International Conference. Piscataway: IEEE Society, p. 1-6 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  5. Atmospheric plasma modification of polyimide sheet for joining to titanium with high temperature adhesive

    Akram, M., Jansen, KMB., Ernst, LJ. & Bhowmik, S., 2016, In : International Journal of Adhesion and Adhesives. 65, p. 63-69

    Research output: Contribution to journalArticleScientificpeer-review

  6. 2015
  7. Characterization and simulation of LTCC/adhesive and alloy 42/adhesive interface strength for automotive applications

    Ozturk, B., Lou, P., Gromala, P., Silber, C., Jansen, KMB. & Ernst, LJ., 2015, Proceedings of the 2015 16th INternational Conference on Thermal, Mechanical and Multi-physics Simulation and Experiments in Microelectronics and Microsystems. s.n. (ed.). Piscataway, NJ, USA: IEEE Society, p. 1-10 10 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  8. Effect of atmospheric pressure plasma modification on polyimide and adhesive joining with titanium

    Akram, M., Jansen, KMB., Ernst, LJ., Bhowmik, S., Ajeesh, G., Ahmed, S. & Chakraborty, D., 2015, In : Metallurgical and Materials Transactions A - Physical Metallurgy and Materials Science. 46, 10, p. 4680-4687 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  9. Material characterization and nonlinear viscoelastic modelling of epoxy based thermosets for automotive application

    Gromala, P., Muthuraman, B., Ozturk, B., Jansen, KMB. & Ernst, LJ., 2015, Thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (EurosimE 2015), proceedings of the 16 international conference. s.n. (ed.). s.l.: IEEE Society, p. 1-7 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  10. Numerical prediction of residual stresses evolving during packaging of ICs

    Rezaie Adli, AR., Jansen, KMB. & Ernst, LJ., 2015, Thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (EurosimE 2015), proceedings of the 16 international conference. s.n. (ed.). Piscataway, NJ: IEEE Society, p. 1-6 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  11. 2014
  12. A product based lap shear fatigue testing of electrically conductive adhesives

    Ozturk, B., Youssef, A., Gromala, P., Silber, C., Jansen, KMB. & Ernst, LJ., 2014, Proceedings 15th International Conference on Thermal, Mechanical and Multi-physics Simulation and Experiments in Microelectronics and Microsystems. Vandevelde, B. (ed.). Piscataway, NJ, USA: IEEE Society, p. 1-5 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  13. Finite strain thermomechanical material characterization of adhesives used in automotive electronics for quantitative finite element simulations

    Gromala, P., Silber, C., Jansen, KMB. & Ernst, LJ., 2014, Proceedings of the16th Electronic Packaging Technology Conference - 2014. Yeo, A. & Hong Wan, NG. (eds.). Piscataway, NJ, USA: IEEE Society, p. 411-420 10 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  14. Fracture toughness of Cu-EMC interfaces in pressurized steam

    Sadeghinia, M., Jansen, KMB., Ernst, LJ., Pape, H., Maus, I., van Driel, WD. & Zhang, GQ., 2014, In : International Journal of Adhesion and Adhesives. 49, March, p. 73-79 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  15. 2013
  16. Finite element based design of a new dogbone specimen for low cycle fatigue testing of highly filled epoxy-based adhesives for automotive applications

    Ozturk, B., Gromala, P., Silber, C., Jansen, KMB. & Ernst, LJ., 2013, Proceedings of the 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. van Driel, W. & et al (eds.). Piscataway, NJ, USA: IEEE Society, p. 1-4 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  17. Mechanical characterization of epoxy moulding compound in pressurized steam

    Sadeghinia, M., Jansen, KMB., Ernst, LJ. & Pape, H., 2013, In : International Journal of Adhesion and Adhesives. 40, January, p. 103-107 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  18. Tailoring the viscoelasticity of epoxy thermosets

    Nakka, JS., Jansen, KMB. & Ernst, LJ., 2013, In : Journal of Applied Polymer Science. 128, 6, p. 3794-3806 13 p.

    Research output: Contribution to journalArticleScientificpeer-review

  19. 2012
  20. Analytical estimate for curing-induced stress and warpage in coating layers

    Jansen, KMB., de Vreugd, J. & Ernst, LJ., 2012, In : Journal of Applied Polymer Science. 126, 5, p. 1623-1630 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  21. Characterization of adhesives and interface strength for automotive applications

    Ozturk, B., Gromala, P., Otto, C., Fischer, A., Jansen, KMB. & Ernst, LJ., 2012, Proceedings of the 13th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and Microsystems, EuroSimE 2012. s.l.: IEEE Society, p. 1-4 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  22. Characterization of the viscoelastic properties of an epoxy molding compound during cure

    Sadeghinia, M., Jansen, KMB. & Ernst, LJ., 2012, In : Microelectronics Reliability. 52, 8, p. 1711-1718 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  23. Establishing the interfacial fracture properties of cu-emc interfaces at harsh condition

    Sadeghinia, M., Jansen, KMB., Ernst, LJ. & Pape, H., 2012, Proceedings of the 13th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and Microsystems, EuroSimE 2012. s.l.: IEEE Society, p. 1-4 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  24. Interfacial fracture properties of Cu-EMC interfaces at pressure cooker test conditions

    Sadeghinia, M., Jansen, KMB., Ernst, LJ. & Pape, H., 2012, Proceedings Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd. IEEE Society, p. 752-755 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  25. 2011
  26. Analytical estimate for cure-induced stresses and warpage in flat packages

    Jansen, KMB., de Vreugd, J. & Ernst, LJ., 2011, Proceedings of the 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011, 18-20 April 2011, Linz, Austria. Ernst, LJ., Zhang, GQ., Driel, WD. V., Rodgers, P., Bailey, C. & Saint Leger, O. D. (eds.). Linz, Austria: IEEE Society, p. 1-4 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  27. Atmospheric pressure plasma surface modification of titanium for high temperature adhesive bonding

    Akram, M., Jansen, KMB., Ernst, LJ. & Bhowmik, S., 2011, In : International Journal of Adhesion and Adhesives. 31, p. 598-604 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  28. Characterization and modeling the thermo-mechanical cure-dependent properties of epoxy molding compound

    Sadeghinia, M., Jansen, KMB. & Ernst, LJ., 2011, In : International Journal of Adhesion and Adhesives. 32, p. 82-88 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  29. Delamination Toughness of Cu-EMC Interfaces at Harsh Environment

    Sadeghinia, M., Jansen, KMB., Ernst, LJ., Schlottig, G. & Pape, H., 2011, Proceedings of IEEE 61st Electronic Components and Technology Conference, 31 May -3 June, 2011, Lake Buena Vista, FL, USA. n.a. (ed.). Lake Buena Vista, FL, USA: IEEE Society, p. 1976-1980 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  30. Fracture toughness of Cu-EMC interfaces under pressure cooker conditions

    Sadeghinia, M., Jansen, KMB., Ernst, LJ., Schlottig, G. & Pape, H., 2011, Proceedings of the 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011, 18-20 April 2011, Linz, Austria. Ernst, LJ., Zhang, GQ., Driel, WD. V., Rodgers, P., Bailey, C. & Saint Leger, O. D. (eds.). Linz, Austria: IEEE Society, p. 1-5 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  31. Moisture absorption analysis of high performance polyimide adhesive

    Akram, M., Jansen, KMB., Bhowmik, S. & Ernst, LJ., 2011, Proceedings of SAMPE Fall Technical Conference 2011, October 17-20, 2011, Fort Worth, Texas, USA. n.a. (ed.). Fort Worth, Texas, USA: SAMPE, p. 1-9 9 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  32. Prediction of mixed-mode interfacial fracture from cohesive zone finite element model: testing and determination of fracture process parameters

    Leung, YY., Sadeghinia, M., Pape, H. & Ernst, LJ., 2011, Proceedings of the 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011, 18-20 April 2011, Linz, Austria. Ernst, LJ., Zhang, GQ., Driel, WD. V., Rodgers, P., Bailey, C. & Saint Leger, O. D. (eds.). Linz, Austria: IEEE Society, p. 1-7 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  33. 2010
  34. A fast moisture sensitivity level qualification method

    Ma, X., Jansen, KMB., Zhang, GQ., van Driel, WD., van der Sluis, O., Ernst, LJ., Regards, C., Gautier, C. & Frémont, H., 2010, In : Microelectronics Reliability. 50, 2010, p. 1654-1660 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  35. Delamination and combined compound cracking of EMC-copper interfaces

    Xiao, A., Schlottig, G., Pape, H., Wunderle, B., Jansen, KMB. & Ernst, LJ., 2010, Proceedings of the 60th Electronic Components and Technology Conference (ECTC), 1-4 June 2010, Las Vegas, NV, USA. n.a. (ed.). Las Vegas, NV, USA: IEEE Society, p. 114-120 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  36. Die attach interface property characterization as function of temperature using cohesive zone modeling method

    Ma, X., Zhang, GQ., van der Sluis, O., Jansen, KMB., van Driel, WD. & Ernst, LJ., 2010, Proceedings of the 11th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2010, 26-28 April 2010, Bordeaux, France. Ernst, LJ, Zhang, GQ, Driel, WD van, Rodgers, P, Bailey, C & Saint Leger, O de (eds.). Bordeaux, France: IEEE Society, p. 1-8 8 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  37. Fracture and Delamination in Microelectronic Devices.

    Ernst, LJ., van Driel, WD., van der Sluis, O., Corigliano, A. & Tay, AAO., 2010, Smart systems integration and reliability.. Bernd, M. & Klaus-Dieter, L. (eds.). Dresden: Goldenbogen Verlag, p. 634-663 824 p.

    Research output: Chapter in Book/Report/Conference proceedingChapterScientific

  38. High temperature storage influence on molding compound properties

    de Vreugd, J., Jansen, KMB., Ernst, LJ., Bohm, C. & Pufall, R., 2010, Proceedings of the 11th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2010, 26-28 April 2010, Bordeaux, France. Ernst, LJ, Zhang, GQ, Driel, WD van, Rodgers, P, Bailey, C & Saint Leger, O. de (eds.). IEEE Society, p. 1-6 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  39. Interfacial fracture parameters of silicon-to-molding compound

    Schlottig, G., Maus, I., Walter, H., Jansen, KMB., Pape, H., Wunderle, B. & Ernst, LJ., 2010, Proceedings 60th Electronic Components and Technology Conference (ECTC), 1-4- June 2010, Las Vegas, NV, USA. n.a. (ed.). IEEE Society, p. 1939-1945 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  40. Interfacial strength of silicon-to-molding compound changes with thermal residual stress

    Schlottig, G., Xiao, A., Pape, H., Wunderle, B. & Ernst, LJ., 2010, Proceedings of the 11th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2010, 26-28 April 2010, Bordeaux, France. Ernst, LJ, Zhang, GQ, Driel, WD van, Rodgers, P, Bailey, C & Saint Leger, O de (eds.). Bordeaux, France: IEEE Society, p. 1-5 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  41. Prediction of cure induced warpage of micro-electronic products

    de Vreugd, J., Jansen, KMB., Ernst, LJ. & Bohm, C., 2010, In : Microelectronics Reliability. 50, p. 910-916 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  42. Procedure to determine interfacial toughness of EMC-copper (oxide) interfaces

    Xiao, A., Pape, H., Schlottig, G., Wunderle, W., Leung, YY., Jansen, KMB. & Ernst, LJ., 2010, Proceedings of the 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 16-19 August 2010, Xi'an, China. n.a. (ed.). Xi'an, China: IEEE Society, p. 356-362 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  43. Surface modification of polyimide by atmospheric pressure plasma for adhesive bonding with titanium and its application to aviation and space

    Akram, M., Bhowmik, S., Jansen, KMB. & Ernst, LJ., 2010, Proceedings of the SAMPE USA 2010 Conference and Exhibition, 17-20 May 2010, Seattle, WA, USA. s.n. (ed.). Seattle, WA, USA: SAMPE USA, p. 1-10 10 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  44. Surface modification of titanium by atmospheric pressure plasma treatment for adhesive bonding and its application to aviation and space

    Akram, M., Bhowmik, S., Jansen, KMB. & Ernst, LJ., 2010, Proceedings of SEICO 10, SAMPE Europe 31st International Technical Conference and Forum, 12-14 April 2010, Paris, France. n.a. (ed.). Paris, France: SEICO, p. 188-194 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  45. Theory of aluminum metallization corrosion in microelectronics

    van Soestbergen, M., Mavinkurve, A., Rongen, RTH., Jansen, KMB., Ernst, LJ. & Zhang, GQ., 2010, In : Electrochimica Acta. 55, p. 5459-5469 11 p.

    Research output: Contribution to journalArticleScientificpeer-review

  46. Thermal aging of molding compounds

    Jansen, KMB., de Vreugd, J., Ernst, LJ. & Bohm, C., 2010, Proceedings of the 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 16-19 August 2010, Xi'an, China. n.a. (ed.). Xi'an, China: IEEE Society, p. 778-780 3 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  47. 2009
  48. A New Method to Measure the Moisture Expansion in Plastic Packaging Materials

    Ma, X., Jansen, KMB., Ernst, LJ., van Driel, WD., van der Sluis, O. & Zhang, GQ., 2009, Proceedings of the 2009 Electronic Components and Technology Conference, ECTC2009, May 26-29, 2009, San Diego, CA, USA. Banda, R., Trewhella, J. & Bezuk, S. (eds.). IEEE Society, p. 1271-1276 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  49. A new ultimate strength model of notched composite laminates - including the effects of matrix failure

    Liu, CJ., Nijhof, AHJ., Ernst, LJ. & Marissen, R., 2009, In : Journal of Composite Materials. 44, 11, p. 1335-1349 15 p.

    Research output: Contribution to journalArticleScientificpeer-review

  50. Cure induced Warpage of micro-electronics: comparison with experiments

    de Vreugd, J., Jansen, KMB., Ernst, LJ., Bohm, C. & Falat, TC., 2009, Proceedings of the 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2009, 27-29 April 2009, Delft, The Netherlands. Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P., Bailey, C. & Saint Leger, O. de (eds.). IEEE Society, p. 374-377 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  51. Effect of Postcure and Thermal Aging on Molding Compound Properties

    de Vreugd, J., Sanchez Monforte, A., Jansen, KMB., Ernst, LJ., Bohm, C., Kessler, A. & Preu, H., 2009, Proceedings of the 11th Electronics Packaging Technology Conference, EPTC 2009, 9-11 December 2009, Singapore. s.n. (ed.). Singapore: IEEE Society, p. 342-347 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  52. Establishing Fracture Properties of EMC-Copper Interfaces in the Visco-Elastic Temperature Region

    Xiao, A., de Vreugd, J., Pape, H., Wunderle, B., Jansen, KMB. & Ernst, LJ., 2009, Proceedings of the 2009 IEEE 59th Electronic Components and Technology Conference, 26-29 May 2009, San Diego, CA, USA. Bonda, R. & Dias, R. (eds.). San Diego, CA, USA: IEEE Society, p. 239-245 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  53. Establishing fracture properties of EMC-copper (-oxide) interfaces

    Ernst, LJ., Xiao, A., de Vreugd, J., Jansen, KMB., Pape, H., Schlottig, G. & Wunderle, B., 2009, Proceedings of the 2009 IEEE 70th Vehicular Technology Conference Fall, 20-23 September 2009, Anchorage, Alaska. n.a. (ed.). Anchorage, Alaska: IEEE Society, p. 1-6 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  54. Fast Qualification Using Thermal Shock Combined with Moisture Absorption

    Ma, X., Zhang, GQ., Jansen, KMB., van Driel, WD., van der Sluis, O., Ernst, LJ., Regard, C., Gautier, C. & Frémont, H., 2009, Proceedings of the International Conference on Electronic Packaging Technology & High Density Packaging, ICEPT-HDP 2009, August 10-13, 2009, Beijing, China. Keyun Bi & Jian CaI (eds.). IEEE Society, p. 1-6 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  55. Induced Delamination of Silicon-Molding Compound Interfaces

    Schlottig, G., Pape, H., Wunderle, B. & Ernst, LJ., 2009, Proceedings of the 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2009, 27-29 April 2009, Delft, The Netherlands. Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P., Bailey, C. & Saint Leger, O. de (eds.). IEEE Society, p. 731-734 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  56. Investigation on Thermal Properties of Crosslinked Epoxy Resin by MD Simulation

    Liao, N., Zhang, GQ., Pavel, D., van der Sluis, O., Jansen, KMB. & Ernst, LJ., 2009, Proceedings of the 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2009, 27-29 April 2009, Delft, The Netherlands. Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P., Bailey, C. & Saint Leger, O. de (eds.). IEEE Society, p. 546-549 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  57. Modeling Electrochemical Migration through Plastic Microelectronics Encapsulations

    van Soestbergen, M., Mavinkurve, A., Rongen, RTH., Ernst, LJ. & Zhang, GQ., 2009, Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging, ICEPT-HDP 2009, 10-13 August 2009, Beijing, China. Bi, K & Cai, J (eds.). Beijing, China: IEEE Society, p. 1079-1082 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  58. Modeling and characterization of molding compound properties during cure

    Jansen, KMB., Qian, C., Ernst, LJ., Bohm, C., Kessler, A., Preu, H. & Stecher, M., 2009, In : Microelectronics Reliability. 49, 2009, p. 872-876 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  59. Moisture Effects on a System in Package Carrier

    Ma, X., Jansen, KMB., Ernst, LJ., van Driel, WD., van der Sluis, O. & Zhang, GQ., 2009, Proceedings of the 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2009, 27-29 April 2009, Delft, The Netherlands. Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P., Bailey, C. & Saint Leger, O. de (eds.). IEEE Society, p. 379-383 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  60. Moisture absorption and hygroscopic swelling characterization of molding compound

    de Vreugd, J., Jansen, KMB., Ernst, LJ. & Bohm, C., 2009, Proceedings of the 11th International Conference on Electronic Material and Packaging, 1-3 December 2009, Penang, Malaysia. n.a. (ed.). Penang, Malaysia: n.a., p. 1-6 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  61. On Electrochemical Cell Modeling as Basis for Predicting Corrosion Failures in Plastic Encapsulated Microelectronics

    van Soestbergen, M., Rongen, RTH., Mavinkurve, A., Zhang, GQ. & Ernst, LJ., 2009, Proceedings of EuroSimE 2009. Ernst, L. J., Zhang, G. Q., Driel, W. D. V., Rodgers, P., Bailey, C. & Saint Leger, O. D. (eds.). Delft: IEEE Society, p. 1-7 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  62. 2008
  63. A Characterization Method for Viscoelastic Bulk Modulus of Molding Compounds

    Saraswat, MK., Jansen, KMB., Patel, MD., Ernst, LJ., Bohm, C., Kessler, A., Preu, H. & Stecher, M., 2008, Proceedings of the 9th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P. & Saint Leger, O. de (eds.). Freiburg-im-Breisgau: EuroSimE, p. 463-466 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  64. Advanced Viscoelastic Material Model for Predicting Warpage of a QFN Panel

    de Vreugd, J., Jansen, KMB., Xiao, A., Ernst, LJ., Bohm, C., Kessler, A., Preu, H. & Stecher, M., 2008, 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, USA. Wipiejewski, T. & Trewhella, J. (eds.). Orlando, FL, USA: IEEE Society, p. 1635-1640 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  65. Characterization and modeling of molding compound properties during cure

    Jansen, KMB., Qian, C., Ernst, LJ., Bohm, C., Kessler, A., Preu, H. & Stecher, M., 2008, Proceedings of the 9th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P. & Saint Leger, O. de (eds.). Freiburg-im-Breisgau: EuroSimE, p. 610-613 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  66. Driving Mechanisms of Delamination Related Reliability Problems in Exposed Pad Packages

    van Driel, WD., van Gils, M., Fan, X., Zhang, GQ. & Ernst, LJ., 2008, In : IEEE Transactions on Components and Packaging Technology. 31, 2, p. 260-268 9 p.

    Research output: Contribution to journalArticleScientificpeer-review

  67. Effecs of molding pressure on the warpage and the viscoelasticities of HVQFN packages

    Gui, DY., Ernst, LJ., Jansen, KMB., Yang, D., Goumans, L., Bressers, HJL. & Janssen, JHJ., 2008, In : Journal of Applied Polymer Science. 109, 3, p. 2016-2022 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  68. Effect of aging of packaging materials on die surface cracking of a SiP carrier

    Ma, X., Jansen, KMB., Ernst, LJ., van Driel, WD., van der Sluis, O., Zhang, GQ., Regard, C., Gautier, C. & Frémont, H., 2008, Proceedings of the 9th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P. & Saint Leger, O. de (eds.). Freiburg-im-Breisgau: EuroSimE, p. 361-364 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  69. Effect of the epoxy resin chemistry on the viscoelasticity of its cured product

    Nakka, JS., Jansen, KMB., Ernst, LJ. & Jager, WF., 2008, In : Journal of Applied Polymer Science. 108, p. 1414-1420 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  70. Effects of Molding Compound Cure on Warpage of Electronic Packages

    de Vreugd, J., Jansen, KMB., Ernst, LJ., Bohm, C., Kessler, A. & Preu, H., 2008, Proceedings EPTC 2008. Lee, R. (ed.). Singapore: IEEE Society, p. 675-682 8 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  71. Electrical Characterization Of Plastic Encapsulations Using An Alternative Gate Leakage Test Method

    van Soestbergen, M., Rongen, RTH., Knol, J., Mavinkurve, A., Egbers, JH., Nath, S., Zhang, GQ. & Ernst, LJ., 2008, 2008 IEEE International Reliability Physics Symposium Proceedings 46th Annual, Phoenix, Arizona, April 27-May 1, 2008. Cole, E.I., Graas, C.D., McPherson, J.W., Street, A.G., Kasprzak, L.A., Mielke, N.R., Suehle, J.S., Lacoe, R.C., Schafft, H.A. & Tonti, W.R. (eds.). Phoenix, AZ: IEEE Society, p. 462-467 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  72. Free-standing, parylene-sealed copper interconnect for stretchable silicon electronics

    Sosin, S., Zoumpoulidis, T., Bartek, M., Wang, L., Dekker, R., Jansen, KMB. & Ernst, LJ., 2008, 2008 proceedings 58th electronic components & technology conference, Lake Buena Vista, FL, USA. Wipiejewski, T. & Trewhella, J. (eds.). Orlando, FL, USA: IEEE Society, p. 1339-1345 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  73. Interface Characterization and Failure Modeling for Semiconductor Packages

    Ernst, LJ., Xiao, A., Wunderle, B., Jansen, KMB. & Pape, H., 2008, Proceedings EPTC 2008. Lee, R. (ed.). Singapore: IEEE Society, p. 808-815 8 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  74. Interfacial Delamination Mechanisms During Soldering Reflow With Moisture Preconditioning

    Fan, X., Zhang, GQ., van Driel, WD. & Ernst, LJ., 2008, In : IEEE Transactions on Components and Packaging Technology. 31, 2, p. 252-259 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  75. Interfacial Fracture Properties and Failure Modeling for Microelectronics

    Xiao, A., Pape, H., Wunderle, B., Jansen, KMB., de Vreugd, J. & Ernst, LJ., 2008, 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, USA. Wipiejewski, T. & Trewhella, J. (eds.). Orlando, FL, USA: IEEE Society, p. 1724-1730 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  76. Ionic polarisation layers in polymer electrolytes

    Biesheuvel, PM., van Soestbergen, M., Mavinkurve, A., Ernst, LJ. & Zhang, GQ., 2008, Proceedings of the 9th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P. & Saint Leger, O. de (eds.). Freiburg-im-Breisgau: EuroSimE, p. 644-648 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  77. Mesh interconnects for silicone embedded stretchable silicon electronics

    Sosin, S., Zoumpoulidis, T., Bartek, M., Wang, L., Jansen, KMB. & Ernst, LJ., 2008, Proc. 10th electronics packaging technology conference (EPTC 2008). Yang, T. & Kheng, T. (eds.). Piscataway, Singapore: IEEE Society, p. 230-235 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  78. Mixed mode interface characerization considering thermal redisidual stress

    Xiao, A., Schlottig, G., Wunderle, B., Jansen, KMB. & Ernst, LJ., 2008, Proceedings 2008 International conference on electronic packaging technology & high density packaging. Bi, K. & Xiao, F. (eds.). IEEE Society, p. 1-8 8 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  79. Modeling failure interaction in notched cross-ply laminates

    Liu, CJ., Nijhof, AHJ., Ernst, LJ. & Marissen, R., 2008, In : Journal of Composite Materials. 42, 20, p. 2175-2193 19 p.

    Research output: Contribution to journalArticleScientificpeer-review

  80. Modeling ion transport through molding compounds and its relation to product reliability

    van Soestbergen, M., Rongen, RTH., Ernst, LJ. & Zhang, GQ., 2008, Proceedings 2008 International conference on electronic packaging technology & high density packaging. Bi, K. & Xiao, F. (eds.). IEEE Society, p. 1-8 8 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  81. Modified Poisson-Nernst-Planck theory for ion transport in polymeric electrolytes

    van Soestbergen, M., Biesheuvel, PM., Rongen, RTH., Ernst, LJ. & Zhang, GQ., 2008, In : Journal of Electrostatics. 66, 2008, p. 567-573 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  82. Moisture Diffusion Model Verification of Packaging Materials

    Ma, X., Jansen, KMB., Ernst, LJ., van Driel, WD., van der Sluis, O., Zhang, GQ., Regard, C., Gautier, C. & Frémont, H., 2008, Proceedings of the 2008 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2008), July 28-31, 2008, Shanghai, China. Keyun Bi & Fei Xiao (eds.). IEEE Society, p. 636-640 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  83. Molecular simulation strategy for mechanical modeling of amorphous/porous low-dielectric constant materials

    Yuan, CA., van der Sluis, O., Zhang, GQ., Ernst, LJ., van Driel, WD., Flower, AE. & van Silfhout, RBR., 2008, In : Applied Physics Letters. 92, p. 1-3 3 p.

    Research output: Contribution to journalArticleScientificpeer-review

  84. Process technology of high-aspect-ratio silicon beams for stretchable silicon electronics

    Zoumpoulidis, T., Tian, J., Sosin, S., Bartek, M., Wang, L., Jansen, KMB., Ernst, LJ., Dekker, R. & de Graaf, P., 2008, Proc. 10th electronics packaging technology conference (EPTC 2008). Yang, T. & Kheng, T. (eds.). Piscataway, ingapore: IEEE Society, p. 361-366 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  85. Stretchable mesh copper interconnect for batc fabrication of array-type microsystems

    Sosin, S., Zoumpoulidis, T., Bartek, M., Wang, L., Dekker, R., Jansen, KMB. & Ernst, LJ., 2008, 22nd international conference EUROSENSORS. Gerlach, G. (ed.). Dusseldorf, Germany: VDI e.V, p. 1528-1531 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  86. The mechanical influence of the porosity and nano-scale pore size effect of the SiOC(H) dielectric film

    Yuan, CA., Flower, AE., van der Sluis, O., Zhang, GQ., Ernst, LJ., Cherkaoui, M. & van Driel, WD., 2008, Proceedings of the 9th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P. & Saint Leger, O. de (eds.). Freiburg-im-Breisgau: EuroSimE, p. 199-203 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  87. The mechanical influence of the porosity and nano-scale pore size effect of the SiOC(H) dielectric film

    Yuan, CA., Flower, AE., van der Sluis, O., Zhang, GQ., Ernst, LJ., Cherkaoui, M. & van Driel, WD., 2008, Proceedings of EuroSimE 2008. Ernst, LJ., Zhang, GQ., van Driel, WD., Rodgers, P. & de Saint Leger, O. (eds.). Freiburg: IEEE Society, p. 27-30 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  88. 2007
  89. Characterization of moisture properties of polymers for IC packaging

    Ma, X., Jansen, KMB., Ernst, LJ., van Driel, WD., van der Sluis, O. & Zhang, GQ., 2007, In : Microelectronics Reliability. 47, p. 1685-1689 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  90. Chemical-mechanical relationship of amorphous/porous low-dielectric film materials

    Yuan, CA., van der Sluis, O., Zhang, GQ., Ernst, LJ., van Driel, WD., van Silfhout, RBR. & Thijsse, BJ., 2007, In : Computational Materials Science. 42, p. 606-613 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  91. Correlation between chemistry of polymer building blocks and microelectronics reliability

    Bressers, HJL., van Driel, WD., Jansen, KMB., Ernst, LJ. & Zhang, GQ., 2007, In : Microelectronics Reliability. 47, p. 290-294 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  92. Deformable silicon electronics using segmentation and flexible interconnect

    Zoumpoulidis, T., WANG, L., Bartek, M., Jansen, KMB. & Ernst, LJ., 2007, Proc. 57th Electronic Components & Technology Conference (ECTC 2007). Bonda R (ed.). Piscataway: IEEE Society, p. 1544-1599 56 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  93. Deformable silicon electronics using segmentation and ultra-thin substrates

    Bartek, M., Zoumpoulidis, T., WANG, L., Jansen, KMB. & Ernst, LJ., 2007, Proceedings of the 4th International Wafer-Level Packaging Conference (IWLPC 2007). s.n. (ed.). Edina: Surface Mount Technology Association (smta.org), p. 1-6 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  94. Design and fabrication of micro-system embedding in flexible substrates

    WANG, L., Zoumpoulidis, T., Jansen, KMB., Bartek, M., Ernst, LJ. & Zhang, GQ., 2007, Proc. 57th Electronic Components & Technology Conference (ECTC 2007). Bonda R (ed.). Piscataway: IEEE Society, p. 311-315 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  95. Detailed modeling of projectile impact on dyneema composite using dynamic properties

    Heru Utomo, BD. & Ernst, LJ., 2007, Advanced Technology of Engineering Mechatics. Kazuo Arakawa (ed.). Fukuoha: JSME, p. 1-6 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  96. Effect of filler concentration of rubbery shear and bulk modulus of molding compounds

    Yang, D., Jansen, KMB., Ernst, LJ., Zhang, GQ., Bressers, HJL. & Janssen, JHJ., 2007, In : Microelectronics Reliability. 47, p. 233-239 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  97. High speed fracture phenomena in dyneema composite

    Heru Utomo, BD., Meer, BJ., Ernst, LJ. & Rixen, DJ., 2007, In : Key Engineering Materials. 353, p. 120-125 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

  98. Influence of matrix viscoelastic properties on thermal conductivity of TCA - Numerical approach

    Falat, TC., Wymyslowski, A., Kolbe, J., Jansen, KMB. & Ernst, LJ., 2007, In : Microelectronics Reliability. 47, p. 1989-1996 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  99. Measuring the through-plane elastic modulus of thin polymer films in situ

    van Soestbergen, M., Ernst, LJ., Jansen, KMB. & van Driel, WD., 2007, In : Microelectronics Reliability. 47, p. 1983-1988 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

  100. Mechanical characterization of deformable ultra-thin substrates by experiment and FE simulation

    WANG, L., Zoumpoulidis, T., Jansen, KMB., Bartek, M., Zhang, GQ. & Ernst, LJ., 2007, Proc. 57th Electronic Components & Technology Conference (ECTC 2007). Bonda R (ed.). Piscataway: IEEE Society, p. 1056-1061 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  101. Mechanical reliability of a segmented silicon layer on ultra-thin polyimide substrates

    WANG, L., Xiao, A., Jansen, KMB., Bartek, M., Zoumpoulidis, T., Ernst, LJ. & Zhang, GQ., 2007, In : Key Engineering Materials. 353-358, p. 2529-2532 4 p.

    Research output: Contribution to journalArticleScientificpeer-review

  102. Micro-mechanical testing of SiLK by nanoindentation and substrate curvature techniques

    Gonda, V., Jansen, KMB., Ernst, LJ., den Toonder, J. & Zhang, GQ., 2007, In : Microelectronics Reliability. 47, p. 248-251 4 p.

    Research output: Contribution to journalArticleScientificpeer-review

  103. Modelling delamination of composites using cohesive zone techniques

    Heru Utomo, BD., Meer, BJ., Ernst, LJ. & Rixen, DJ., 2007, 23rd International symposium of ballistics. S.N. (ed.). Tarragona: s.n., p. 1-8 8 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  104. Molecular simulation on the material/interfacial strength of the low-dielectric materials

    Yuan, CA., van der Sluis, O., Zhang, GQ., Ernst, LJ., van Driel, WD. & van Silfhout, RBR., 2007, In : Microelectronics Reliability. 47, p. 1483-1491 9 p.

    Research output: Contribution to journalArticleScientificpeer-review

  105. Novel shear tools for viscoelastic characterization of packaging polymers

    van t Hof, C., Jansen, KMB., Wisse, G., Ernst, LJ., Yang, DG., Zhang, GQ. & Bressers, HJL., 2007, In : Microelectronics Reliability. 47, p. 240-247 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  106. Numerical modeling of warpage induced in QFN array molding process

    Yang, D., Jansen, KMB., Ernst, LJ., Zhang, GQ., van Driel, WD., Bressers, HJL. & Janssen, JHJ., 2007, In : Microelectronics Reliability. 47, p. 310-318 9 p.

    Research output: Contribution to journalArticleScientificpeer-review

  107. Pattern Shifting Analyses of Micro-structures of IC Package

    He, Y., Shi, R., Li, HP., Li, F., Zhang, GQ. & Ernst, LJ., 2007, In : Key Engineering Materials. 340-341, p. 1333-1338 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

  108. Polymer Materials Characterization, Modeling and Application

    Ernst, LJ., Jansen, KMB., Yang, D., van t Hof, C., Bressers, HJL., Janssen, JHJ. & Zhang, GQ., 2007, Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging. Suhir, E., Lee, YC. & Wong, CP. (eds.). New York, NY, USA: Springer, p. 1-63 701 p.

    Research output: Chapter in Book/Report/Conference proceedingChapterScientificpeer-review

  109. The chemical-mechanical relationship of the SiOC(H) dielectric film

    Yuan, CA., van der Sluis, O., Zhang, GQ., Ernst, LJ., van Driel, WD., van Silfhout, RBR. & Thijsse, BJ., 2007, EuroSimE 2007. Ernst, LJ. (ed.). London: EuroSimE, p. 1-6 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  110. The prediction of the mechanical stiffness of the silicon based crystalline/amorphous nano-structures using molecular dynamic (MD) simulation

    Yuan, CA., van der Sluis, O., Zhang, GQ., Ernst, LJ., van Driel, WD. & van Silfhout, RBR., 2007, NanoTech 2007. Laudon, M. (ed.). Santa Clara, CA, USA: NanoTech, p. 1-4 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  111. Ultra-thin deformable silicon substrates with lateral segmentation and flexible metal interconnect

    Zoumpoulidis, T., WANG, L., Bartek, M., Jansen, KMB. & Ernst, LJ., 2007, In : ECS Transactions. 9, 1, p. 103-112 10 p.

    Research output: Contribution to journalConference articleScientificpeer-review

  112. Virtual Thermo-Mechanical Prototyping of Microelectronics and Microsystems

    Wymyslowski, A., Zhang, GQ., van Driel, WD. & Ernst, LJ., 2007, Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging. Suhir, E., Lee, YC. & Wong, CP. (eds.). New York, NY, USA: Springer, p. 205-266 701 p.

    Research output: Chapter in Book/Report/Conference proceedingChapterScientificpeer-review

  113. 2006
  114. Curing stresses in matrix resins containing filler and low profile additives

    Kissat, MS., Ernst, LJ. & Marissen, R., 2006, Proceeding of the 12th European Conference on Composite Materials. lamon, J. & torres-marques, A. (eds.). Bordeaux: ICTS, p. 1-9 9 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  115. Delamination Analysis of Cu/low-k Technology Subjected to Chemical-Mechanical Polishing Process Conditions

    Yuan, CA., van Driel, WD., van Silfhout, RBR., van der Sluis, O., Engelen, RAB., Ernst, LJ., van Keulen, F. & Zhang, GQ., 2006, In : Microelectronics Reliability. 46, p. 1679-1684 6 p.

    Research output: Contribution to journalArticleScientific

  116. Effects of aeronautical conditions on passivation cracking of micro-structures of IC packages

    He, YT., Li, HP., Li, F., WANG, L., Zhang, GQ. & Ernst, LJ., 2006, Proceedings of the 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Micro-Systems, EuroSimE 2006. Ernst, L.J., Zhang, G.Q., Rodgers, P., Marco, S., Meuwissen, M. & Saint Leger, O. de (eds.). Como, Italy: EuroSimE, p. 1-4 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  117. Filler Contents Effects on the Moisture Absorption and Viscoelasticity of Thermosetting IC Packaging Polymers

    Ma, X., Jansen, KMB., Zhang, GQ. & Ernst, LJ., 2006, Proceedings of 2006 7th International Conference on Electronics Packaging Technology. Sheng Liu (ed.). Shanghai. China: Institute of Electrical and Electronics Engineers (IEEE), p. 161-165 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  118. Flexible interconnects for deformable ultra-thin substrates

    Zoumpoulidis, T., WANG, L., Bartek, M., Jansen, KMB., Polyakov, A., Sosin, S., Ernst, LJ., Dekker, R. & Burghartz, JN., 2006, Proc. 39th International Symposium on Microelectronics. s.n. (ed.). Washington: IMAPS, p. 204-210 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  119. Fully Cure-Dependent Modeling and Characterization of EMC's with Application to Package Warpage Simulation

    Ernst, LJ., Jansen, KMB., Saraswat, MK., van t Hof, C., Zhang, GQ., Yang, DG. & Bressers, HJL., 2006, Proceedings of 2006 7th International Conference on Electronics Packaging Technology. Sheng Liu (ed.). Shanghai, China: Institute of Electrical and Electronics Engineers (IEEE), p. 123-129 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  120. Fully Cure-Dependent Modelling and Characterization of EMC's with Application to Package Warpage Simulation

    Ernst, LJ., Jansen, KMB., Saraswat, MK., Zhang, GQ., Yang, D., van t Hof, C. & Bressers, HJL., 2006, Proceedings 2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties, and Interfaces. sn (ed.). Atlanta, GA, USA: IEEE Society, p. 23-27 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  121. High speed fracture phenomena in dyneema composite

    Heru Utomo, BD., Meer, BJ., Ernst, LJ. & Rixen, DJ., 2006, Asian Pacific Conference of Fracture and Strength 06. SN (ed.). Hainan China: Asian Pacific Conference of Fracture and Strength 06, p. 1-4 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  122. High speed fracture phenomena in dyneema composite

    Heru Utomo, BD., Meer, BJ., Ernst, LJ. & Rixen, DJ., 2006, Asian Pacific Conference of Fracture and Strength 06. Y. Zhou (ed.). Hainan: CMES, p. 1-4 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  123. High speed impact modelling and testing of dyneema composite

    Heru Utomo, BD., Meer, BJ., Ernst, LJ. & Rixen, DJ., 2006, 11th International conference on Mechanics and Technology of Composite Materials. Georgi Zachariev (ed.). Sofia: Bulgarian Academy of Science, p. 31-36 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionProfessional

  124. Hygroscopic Effects on Swelling and Viscoelasticity of Electronic Packaging Epoxy

    Ma, X., Jansen, KMB., Zhang, GQ. & Ernst, LJ., 2006, Proceedings of 2006 7th International Conference on Electronics Packaging Technology. Sheng Liu (ed.). Shanghai, China: Institute of Electrical and Electronics Engineers (IEEE), p. 262-266 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  125. Measuring in-thickness mechanical properties of sub micron polymer dielectric films

    van Soestbergen, M., Ernst, LJ., Jansen, KMB., van Driel, WD., Bartek, M. & Polyakov, A., 2006, Proceedings of the 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006. Ernst, L.J., Zhang, G.Q., Rodgers, P., Marco, S., Meuwissen, M. & Saint Leger, O. de (eds.). Como, Italy: EuroSimE, p. 1-5 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  126. Mechanical Characterization Analysis of a Segmented Silicon Layer on Ultra-thin Polyimide Substrates by Experiment and FE Simulation

    Wang, L., Jansen, KMB., Bartek, M., Polyakov, A. & Ernst, LJ., 2006, Proceedings of the 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006. Ernst, L.J., Zhang, G.Q., Rodgers, P., Marco, S., Meuwissen, M. & Saint Leger, O. de (eds.). Como, Italy: EuroSimE, p. 1-6 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  127. Mechanical Properties of Polymer Dielectric Films at Elevated Temperatures

    van Soestbergen, M., Ernst, LJ., Jansen, KMB. & van Driel, WD., 2006, Proceedings of 2006 7th International Conference on Electronics Packaging Technology. Sheng Liu (ed.). Shanghai, China: Institute of Electrical and Electronic Engineers, Inc., p. 664-667 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  128. Mechanical characterization of microelectronics embedded in flexible and stretchable substrate

    WANG, L., Zoumpoulidis, T., Bartek, M., Poliakov, A., Jansen, KMB. & Ernst, LJ., 2006, Proc. 8th Electronics Packaging Technology Conference (EPTC 2006). Pang, JHL. (ed.). Piscataway: IEEE Society, p. 766-772 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  129. Mechanical characterization of microelectronics embedded in flexible substrate

    Zoumpoulidis, T., WANG, L., Bartek, M., Polyakov, A., Jansen, KMB. & Ernst, LJ., 2006, Proceedings of 2006 7th International Conference on Electronics Packaging Technology. Sheng Liu (ed.). Shanghai, China: Institute of Electrical and Electronics Engineers (IEEE), p. 672-678 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  130. Moisture Effects on the Creep of Thermosetting IC Packaging Polymers

    Ma, X., Jansen, KMB. & Ernst, LJ., 2006, Proceedings of the 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006. Ernst, L.J., Zhang, G.Q., Rodgers, P., Marco, S., Meuwissen, M. & Saint Leger, O. de (eds.). Como, Italy: EuroSimE, p. 1-5 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  131. Numerical Approach to Characterization of Thermally Conductive Adhesives

    Falat, T., Wymyslowski, A., Kolbe, J., Jansen, KMB. & Ernst, LJ., 2006, Proceedings of the 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006. Ernst, L.J., Zhang, G.Q., Rodgers, P., Marco, S., Meuwissen, M. & Saint Leger, O. de (eds.). Como, Italy: EuroSimE, p. 1-7 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  132. Passivation Cracking Analyses of ICs for Different Fixing Position under the Aeronautical Working Conditions

    He, YT., Li, HP., Li, F., Shi, R., Zhang, GQ. & Ernst, LJ., 2006, Proceedings of 2006 7th International Conference on Electronics Packaging Technology. Sheng Liu (ed.). Shanghai, China: Institute of Electrical and Electronics Engineers (IEEE), p. 755-759 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  133. Passivation Cracking Analyses of Micro-structures of IC Packages

    He, Y., Li, H., Shi, R., Li, F., Zhang, GQ. & Ernst, LJ., 2006, In : Key Engineering Materials. 324-325, p. 515-518 4 p.

    Research output: Contribution to journalArticleScientificpeer-review

  134. Process technology for electronics on flexible and stretchable substrates

    Zoumpoulidis, T., Wang, L., Bartek, M., Polyakov, A., Jansen, KMB. & Ernst, LJ., 2006, Proceedings of the 9th STW Annual Workshop on Semiconductor Advances for Future Electronics and Sensors (SAFE 2006). s.n. (ed.). Utrecht: STW, p. 502-507 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  135. Sliding simulation for adhesion problems in micro gear trains based on an atomistic simplified model

    Ping, Y., Ning Bo, L., Daoguo, Y. & Ernst, LJ., 2006, In : Microsystem Technologies: micro and nanosystems - information storage and processing systems. 2006, p. 1-7 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  136. 2005
  137. A Micromechanics-Based Vapor Pressure Model in Electronic Packages

    Fan, XJ., Zhou, J., Zhang, GQ. & Ernst, LJ., 2005, In : Journal of Electronic Packaging. 127, p. 262-267 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

  138. A model for determining crack opening stress intensity factor ratio under tri-axial stress state

    He, YT., Li, F., Shi, R., Zhang, GQ., Ernst, LJ. & Fu, XJ., 2005, In : Key Engineering Materials. 297-300, p. 1572-1578 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  139. Advanced structural similarity rules for the BGA package family

    van Driel, WD., Mavinkurve, A., van Gils, MAJ., Zhang, GQ., Yang, DG. & Ernst, LJ., 2005, Proceedings of the 6th international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems. Ernst, LJ., Zhang, GQ., Rodgers, P., Marco, S. & de Saint Leger, O. (eds.). Piscataway: IEEE Society, p. 524-530 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  140. Bending and stretching studies on ultra-thin silicon substrates

    Wang, L., Jansen, KMB., Bartek, M., Poliakov, A. & Ernst, LJ., 2005, Proceedings of the 6th international conference on electronics packaging technology. Keyun, B. & Chunqing, W. (eds.). Piscataway: IEEE Society, p. 682-686 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  141. Driving mechanisms of delamination related reliability problems in exposed pad packages

    van Driel, WD., Bressers, HJL., Janssen, JHJ., Bielen, JA., Yan, X., van Gils, MAJ., Stevens, PMP., Habets, PJJHA., Zhang, GQ. & Ernst, LJ., 2005, Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Proceedings of EuroSIME 2005. Ernst, LJ, Zhang, GQ, Rodgers, P, Meuwissen, M, Marco, S & Saint Leger, O de (eds.). IEEE Society, p. 183-189 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  142. Effects of rheology of compound materials on passivation cracking of micro-structure of ic packages

    He, YT., Li, F., He, WF., Hui, J., Zhang, GQ. & Ernst, LJ., 2005, Advances in Rheology and its Applications (Proceedings of 4th Pacific Rim Conference on Rheology). Luo, YS., Rao, Q. & Xu, Y. (eds.). New York: Science Press USA inc, p. 900-903 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  143. Electronics on deformable ultra-thin substrates

    Bartek, M., Poliakov, A., Wang, L., Jansen, KMB. & Ernst, LJ., 2005, Proceedings of the 2nd International wafer-level packaging congress (IWLPC). s.n. (ed.). SMTA, p. 16-21 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  144. Experimental and numerical investigation on warpage of QFN packages induced during the array molding process

    Yang, D., Jansen, KMB., Ernst, LJ., Zhang, GQ., Beijer, JGJ. & Janssen, JHJ., 2005, Polytronic 2005 - Proceedings of the 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics. Dziedzic, A. & Felba, J. (eds.). Piscataway: IEEE Society, p. 1-5 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  145. Experimental and numerical investigation on warpage of QFN packages induced during the array molding process

    Yang, D., Jansen, KMB., Ernst, LJ., Zhang, GQ., Beijer, JGJ. & Janssen, JHJ., 2005, Proceedings of 2005 6th International Conference on Electronic Packaging Technology. Keyun, Bi, Chunqing & Wang (eds.). Piscataway, New Jersey: IEEE Society, p. 94-98 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  146. Finite thickness influence on spherical and conical indentation on viscoelastic thin polymer film

    Gonda, V., den Toonder, J., Beijer, J., Zhang, GQ. & Ernst, LJ., 2005, In : Journal of Electronic Packaging. 127, 1, p. 33-37 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  147. Flexibility studies on ultra-thin silicon substrates

    Wang, L., Bartek, M., Poliakov, A., Jansen, KMB. & Ernst, LJ., 2005, Proceedings of the STW annual workshop on semiconductor advances for future electronics and sensors (SAFE 2005). Krautschneider, W. (ed.). Utrecht: Technology Stichting STW, p. 175-180 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  148. Geometry Sensitivity Analyses of Microstructures of IC Packages on Passivation Cracking

    He, Y., Li, F., Shi, R., Zhang, GQ., Ernst, LJ., Zhang, J. & Song, ZT., 2005, In : Key Engineering Materials. 297-300, p. 819-824 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

  149. Measuring and modeling the cure-dependent rubbery moduli of epoxy molding compound

    Yang, DG., Jansen, KMB., Ernst, LJ., Zhang, GQ., Bressers, HJL. & Jansen, JHJ., 2005, Proceedings of the 6th international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems. Ernst, LJ., Zhang, GQ., Rodgers, P., Marco, S. & de Saint Leger, O. (eds.). Piscataway: IEEE Society, p. 120-125 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  150. Multi-physics based structural similarity rules for the BGA package family

    van Driel, WD., Mavinkurve, A., van Gils, MAJ., Zhang, GQ., Yang, D. & Ernst, LJ., 2005, Proceedings of the 55th Electronic Components and Technology Conference. s.n. (ed.). Piscataway, NJ: IEEE Society, p. 165-171 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  151. Process-induced warpage in HVQFN package: effect of design parameters and processing conditions

    Yang, D., Ernst, LJ., Jansen, KMB., Zhang, GQ., Janssen, JHJ. & Bressers, HJL., 2005, Polytronic 2005 - Proceedings of the 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics. Dziedzic, A. & Felba, J. (eds.). Piscataway: IEEE Society, p. 25-29 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  152. State-of-the-Art of Thermo-Mechanical Characterization of Thin Polymer Films

    Jansen, KMB., Gonda, V., Ernst, LJ., Bressers, HJL. & Zhang, GQ., 2005, In : Journal of Electronic Packaging. 127, p. 530-536 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  153. Structural similarity as a method to reduce qualification tests

    van Driel, WD., Zhang, GQ. & Ernst, LJ., 2005, Proceedings of 2005 6th International Conference on Electronic Packaging Technology. Keyun, Bi, Chunqing & Wang (eds.). Piscataway, New Jersey: IEEE Society, p. 647-652 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  154. Study of the Effects of Molding Pressure on the Warpage of HVQFN Packages

    Gui, DY., Ernst, LJ., Jansen, KMB., Yang, D., Goumans, L., Bressers, HJL. & Janssen, JHJ., 2005, Proceedings of 2005 6th International Conference on Electronic Packaging Technology. Keyun, Bi, Chunqing & Wang (eds.). Piscataway, New Jersey: IEEE Society, p. 338-343 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  155. Viscoelastic characterization of fast curing moulding compounds

    Milosheva, BV., Jansen, KMB., Jansen, JHJ., Bressers, HJL. & Ernst, LJ., 2005, Proceedings of the 6th international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems. Ernst, LJ., Zhang, GQ., Rodgers, P., Marco, S. & de Saint Leger, O. (eds.). Piscataway: IEEE Society, p. 462-467 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  156. 2004
  157. A novel tool for cure dependent viscoelastic characterization of packaging polymers

    van t Hof, C., Wisse, G., Ernst, LJ., Jansen, KMB., Yang, D., Zhang, GQ. & Bressers, HJL., 2004, EuroSimE 2004: 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems. Ernst, LJ., Zhang, GQ., Rodgers, P. & de Saint Leger, O. (eds.). Piscataway: IEEE Society, p. 385-389 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  158. A theoretical approach for estimating fracture toughness of suctile metals

    He, YT., Li, F., Zhang, GQ., Ernst, LJ. & Fu, XJ., 2004, AEPA 2004: 7th Asia-Pacific symposium on engineering plasticity and its applications : Advances in engineering plasticity and its applications. Part III - the supplementary collection. Shen, WP. & Xu, JQ. (eds.). Uetikon-Zuerich: Trans Tech Publications, p. 114-119 6 p. (Shanghai Jiaotong Daxue Xuebao (Journal of Shanghai Jiaotong University); vol. 38).

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  159. Constitutive modeling of moulding compounds

    Jansen, KMB., WANG, L., Yang, D., van t Hof, C., Ernst, LJ., Bressers, HJL. & Zhang, GQ., 2004, 54th electronic components and technology conference. Vol. 2. S.n. (ed.). Piscataway: IEEE Society, p. 1-5 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  160. Cure, temperature and time dependent constitutive of moulding compounds

    Jansen, KMB., WANG, L., van t Hof, C., Ernst, LJ., Bressers, HJL. & Zhang, GQ., 2004, EuroSimE 2004: 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems. Ernst, LJ., Zhang, GQ., Rodgers, P. & de Saint Leger, O. (eds.). Piscataway: IEEE Society, p. 581-585 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  161. Effect of metal layout design on passivation crack occurrence using both experimental and simulation techniques

    van Silfhout, RBR., van Driel, WD., Li, Y., van Gils, MAJ., Jansen, JHJ., Zhang, GQ., Tao, G., Bisschop, J. & Ernst, LJ., 2004, EuroSimE 2004: 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems. Ernst, LJ., Zhang, GQ., Rodgers, P. & de Saint Leger, O. (eds.). Piscataway: IEEE Society, p. 69-74 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  162. From chemical building blocks of polymers to microelectronics reliability

    Bressers, HJL., van Driel, WD., Jansen, KMB., Ernst, LJ. & Zhang, GQ., 2004, EuroSimE 2004: 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems. Ernst, LJ., Zhang, GQ., Rodgers, P. & de Saint Leger, O. (eds.). Piscataway: IEEE Society, p. 621-625 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  163. Fully cure-dependent polymer modeling and application to QFN-packages warpage

    Yang, D., Ernst, LJ., Jansen, KMB., van t Hof, C., Zhang, GQ., van Driel, WD. & Bressers, HJL., 2004, EPTC 2004: 6th electronic packaging technology Conference. Toh, KC., Mui, YC., How, J. & Pang, JHL. (eds.). S.l.: IEEE CPMT Society, p. 87-91 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  164. Geometry sensivity analyses of micro-structures of IC packages on metal lines shifting induced by plastic deformation

    He, YT., Zhang, GQ., Li, F., Ernst, LJ. & Zhang, J., 2004, AEPA 2004: 7th Asia-Pacific symposium on engineering plasticity and its applications : Advances in engineering plasticity and its applications. Part I. Shen, WP. & Xu, JQ. (eds.). Uetikon-Zuerich: Trans Tech Publications, p. 361-366 6 p. (Key Engineering Materials; vol. 274-276).

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  165. Mechanical characterization of SiLK by Nanoindentation and substrate curvature techniques

    Gonda, V., Jansen, KMB., Ernst, LJ., den Toonder, J. & Zhang, GQ., 2004, EuroSimE 2004: 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems. Ernst, LJ., Zhang, GQ., Rodgers, P. & de Saint Leger, O. (eds.). Piscataway: IEEE Society, p. 373-376 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  166. Mechanism-based delamination prediction during reflow with moisture preconditioning

    Fan, X., Zhang, GQ., van Driel, WD. & Ernst, LJ., 2004, EuroSimE 2004: 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems. Ernst, LJ., Zhang, GQ., Rodgers, P. & de Saint Leger, O. (eds.). Piscataway: IEEE Society, p. 329-335 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  167. Micromechanical modeling of stress evolution induced during cure in a particle-filled electronic packaging polymer

    Yang, D., Jansen, KMB., WANG, L., Ernst, LJ., Zhang, GQ., Bressers, HJL. & Fan, X., 2004, In : IEEE Transactions on Components and Packaging Technology. 27, 4, p. 676-683 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  168. Modeling of cure-induced warpage of plastic IC packages

    Yang, D., Jansen, KMB., Ernst, LJ., Zhang, GQ., van Driel, WD. & Bressers, HJL., 2004, EuroSimE 2004: 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems. Ernst, LJ., Zhang, GQ., Rodgers, P. & de Saint Leger, O. (eds.). Piscataway: IEEE Society, p. 33-40 8 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  169. Network density as scaling parameter for thermoset viscoelasticity

    Jansen, KMB., van Buchem, B., Bressers, HJL. & Ernst, LJ., 2004, 40th international symposium on macromolecules. S.n. (ed.). s.n., p. 1-2 2 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  170. On wire failures in micro-electronic packages

    van Driel, WD., Jansen, JHJ., van Silfhout, RBR., van Gils, MAJ., Zhang, GQ. & Ernst, LJ., 2004, EuroSimE 2004: 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems. Ernst, LJ., Zhang, GQ., Rodgers, P. & de Saint Leger, O. (eds.). Piscataway: IEEE Society, p. 53-57 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  171. Parametric study on flip chip package with lead-free solder joints by using the probabilistic designing approach

    Yang, DG., Liang, JS., Li, QY., Ernst, LJ. & Zhang, GQ., 2004, In : Microelectronics Reliability. 44, p. 1947-1955 9 p.

    Research output: Contribution to journalArticleScientificpeer-review

  172. Prediction of crack growth in IC passivation layers

    He, Y., van Gils, MAJ., van Driel, WD., Zhang, GQ., van Silfhout, RBR. & Ernst, LJ., 2004, In : Microelectronics Reliability. 44, p. 2003-2009 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  173. Prediction of interfacial delamination in stacked IC structures using combined experimental and simulation methods

    van Driel, WD., Liu, C., Zhang, GQ., Janssen, JHJ., van Silfhout, RBR., van Gils, MAJ. & Ernst, LJ., 2004, In : Microelectronics Reliability. 44, p. 2019-2027 9 p.

    Research output: Contribution to journalArticleScientificpeer-review

  174. Prediction of process-induced warpage of IC packages encapsulated with thermosetting polymers

    Yang, D., Jansen, KMB., Ernst, LJ., Zhang, GQ., van Driel, WD., Bressers, HJL. & Fan, XJ., 2004, 54th electronic components and technology conference. Vol. 2. S.n. (ed.). Piscataway: IEEE, p. 98-105 8 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  175. Prediction of thermo-mechanical integrity of wafer backend processes

    Gonda, V., den Toonder, JMJ., Beijer, J., Zhang, GQ., van Driel, WD., Hoofman, ROJM. & Ernst, LJ., 2004, In : Microelectronics Reliability. 44, p. 2011-2017 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  176. State dependent constitutive modeling of curing molding compounds

    Ernst, LJ., Jansen, KMB., Yang, D., van t Hof, C., Bressers, HJL. & Zhang, GQ., 2004, EMAP 2004: 6th international conference on electronic materials and packaging. Ripin, ZM., Seetharamu, KN., Abdullah, MZ., Samad, Z. & Shuib, S. (eds.). S.l.: IEEE CPMT, p. 23-29 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  177. Virtual prototyping and qualification of Board Level Assembly

    van Driel, WD., Zhang, GQ., de Vries, JWC., Jansen, M. & Ernst, LJ., 2004, EPTC 2004: 6th electronic packaging technology Conference. Toh, KC., Mui, YC., How, J. & Pang, JHL. (eds.). S.l.: IEEE CPMT Society, p. 772-775 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  178. 2003
  179. A study on the creep damage of epoxy molding compound in IC package

    Liu, S., Qin, L., Yang, D., Ernst, LJ. & Zhang, GQ., 2003, ICEPT 2003. Bi, K., Barnwell, PG. & Wang, J. (eds.). Piscataway: IEEE Society, p. 254-259 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  180. Analytical solution for moisture-induced interface delamination in electronic packaging

    Fan, X., Zhang, GQ., van Driel, W. & Ernst, LJ., 2003, 53rd electronic components & technology conference. Sitaraman, SK. & Lamson, M. (eds.). Piscataway: IEEE Society, p. 733-738 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  181. Combined experimental and numerical study of notched cross-ply laminates

    Liu, CJ., Ernst, LJ. & Marissen, R., 2003, Proceedings of the 10th international conference on mechanics and technology of composite materials. Naidenov, V., Stoyanov, V. & Rostovsky, I. (eds.). s.l.: s.n., p. 323-328 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  182. Cracking prediction of IC's passivation layer using J-integral

    Zhang, GQ., van Driel, WD., Fan, XJ. & Ernst, LJ., 2003, ICEPT 2003. Bi, K., Barnwell, PG. & Wang, J. (eds.). Piscataway: IEEE Society, p. 362-367 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  183. Finite thickness influence on spherical and conical indentation on viscoelastic thin polymer film

    Gonda, V., den Toonder, J., Beijer, J., Zhang, GQ. & Ernst, LJ., 2003, Polytronic 2003. Courtois, B. (ed.). Laboratoire TIMA, p. 51-56 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  184. Image measurements on curing polymers and a cross-ply laminate

    Gonda, V., Liu, C., van t Hof, C., Ernst, LJ. & Koppany, I., 2003, In : Materials Science Forum. 414/415, p. 79-84 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

  185. Influence of material combinations on delamination failures in a cavity down TBGA package

    van Driel, WD., Wisse, G., Chang, AYL., Zhang, GQ. & Ernst, LJ., 2003, Thermal & mechanical simulation and experiments in microelectronics and microsystems. Ernst, LJ., Zhang, GQ., Dudek, R. & de Saint Leger, O. (eds.). Piscataway: IEEE Society, p. 421-426 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  186. Influence of visco-elasticity of low-k dielectrics on thermo-mechanical behavior of dual damascene process

    Gonda, V., Zhang, GQ., den Toonder, J., Beijer, J. & Ernst, LJ., 2003, ICEPT 2003. Bi, K., Barnwell, PG. & Wang, J. (eds.). Piscataway: IEEE Society, p. 288-293 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  187. Investigation on flip chip solder joint fatigue with cure-dependent underfill properties

    Yang, DG., Zhang, GQ., Ernst, LJ., van t Hof, C., Caers, JFJM., Bressers, HJL. & Janssen, JHJ., 2003, In : IEEE Transactions on Components and Packaging Technology. 26, 2, p. 388-398 11 p.

    Research output: Contribution to journalArticleScientificpeer-review

  188. Mechanical characterization and modeling of low-dielectric-constant SiLK films using nano-indentation: time- and temperature-effects

    den Toonder, J., van Dijken, A., Gonda, V., Beijer, J., Zhang, K. & Ernst, LJ., 2003, 53rd electronic components & technology conference. Sitaraman, SK. & Lamson, M. (eds.). Piscataway: IEEE Society, p. 708-713 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  189. Micromechanical modeling of stress evolution induced during cure in a particle-filled electronic packaging polymer

    Yang, D., Jansen, KMB., Wang, L., Ernst, LJ., Zhang, GQ. & Bressers, HJL., 2003, Thermal & mechanical simulation and experiments in microelectronics and microsystems. Ernst, LJ., Zhang, GQ., Dudek, R. & de Saint Leger, O. (eds.). Piscataway: IEEE Society, p. 57-62 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  190. Packaging induced die stresses - effect of chip anisotropy and time-dependent behavior of a molding compound

    van Driel, WD., Janssen, JHJ., Zhang, GQ., Ernst, LJ. & Yang, DG., 2003, In : Journal of Electronic Packaging. 125, 4, p. 520-526 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  191. Parametric study on flip chip package with lead-free solder joints by using the probabilistic designing approach

    Liang, JS., Yang, D., Li, QY., Ernst, LJ. & Zhang, GQ., 2003, Thermal & mechanical simulation and experiments in microelectronics and microsystems. Ernst, LJ., Zhang, GQ., Dudek, R. & de Saint Leger, O. (eds.). Piscataway: IEEE Society, p. 455-463 9 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  192. Prediction and verification of process induced warpage of electronic packages

    van Driel, WD., Zhang, GQ., Janssen, JHJ., Ernst, LJ., Su, F., Chian, KS. & Yi, S., 2003, In : Microelectronics Reliability. 43, p. 765-774 10 p.

    Research output: Contribution to journalArticleScientificpeer-review

  193. Prediction of crack growth in IC passivation layers

    He, Y., Zhang, GQ., van Gils, MAJ., van Silfhout, RBR., van Driel, WD. & Ernst, LJ., 2003, Thermal & mechanical simulation and experiments in microelectronics and microsystems. Ernst, LJ., Zhang, GQ., Dudek, R. & de Saint Leger, O. (eds.). Piscataway: IEEE Society, p. 323-328 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  194. Prediction of interfacial delamination in stacked IC structures using combined experimental and simulation methods

    Liu, C., Zhang, GQ., van Driel, WD., van Silfhout, RBR., van Gils, MAJ. & Ernst, LJ., 2003, Thermal & mechanical simulation and experiments in microelectronics and microsystems. Ernst, LJ., Zhang, GQ., Dudek, R. & de Saint Leger, O. (eds.). Piscataway: IEEE Society, p. 337-343 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  195. Prediction of thermo-mechanical integrity of wafer backend processes

    Gonda, V., den Toonder, JMJ., Beijer, J., Zhang, GQ., Hoofman, RJOM. & Ernst, LJ., 2003, Thermal & mechanical simulation and experiments in microelectronics and microsystems. Ernst, LJ., Zhang, GQ., Dudek, R. & de Saint Leger, O. (eds.). Piscataway: IEEE Society, p. 359-363 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  196. Progressive failure modelling of notched composite laminates and its experimental verification

    Liu, CJ., Jansen, KMB., Ernst, LJ. & Marissen, R., 2003, ICCM-14. s.n. (ed.). Dearborn: Society of Manufacturing engineers, p. 1-12 12 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  197. Recent developments in thermal mechanical modeling of the curing process of filled thermoset polymers

    Ernst, LJ., Jansen, KMB., van t Hof, C., Yang, DG., Zhang, GQ. & Bressers, HJL., 2003, Proceedings of the 10th international conference on mechanics and technology of composite materials. Naidenov, V., Stoyanov, V. & Rostovsky, I. (eds.). s.l.: s.n., p. 38-44 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  198. Response surface modeling for nonlinear packaging stresses

    van Driel, WD., Zhang, GQ., Janssen, JHJ. & Ernst, LJ., 2003, In : Journal of Electronic Packaging. 125, 4, p. 490-497 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  199. Solders fatigue prediction using interfacial boundary volume criterion

    Ernst, LJ., Zhang, GQ., Jansen, KMB. & Bressers, HJL., 2003, In : Journal of Electronic Packaging. 125, 4, p. 582-588 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  200. The influence of leadframe on passivation cracks growth

    Zhang, GQ., van Driel, WD., Fan, XJ. & Ernst, LJ., 2003, ICEPT 2003. Bi, K., Barnwell, PG. & Wang, J. (eds.). Piscataway: IEEE Society, p. 430-437 8 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  201. Thermally induced delamination buckling of a thin metal layer on a ceramic substrate

    Liu, CJ., Ernst, LJ., Wisse, G., Zhang, GQ. & Vervoort, M., 2003, In : Journal of Electronic Packaging. 125, 4, p. 512-519 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  202. Time- and tempearature-dependent thermo-mechanical modeling of a packaging molding compound and its effect on packaging process stresses

    Ernst, LJ., Zhang, GQ., Jansen, KMB. & Bressers, HJL., 2003, In : Journal of Electronic Packaging. 125, 4, p. 539-548 10 p.

    Research output: Contribution to journalArticleScientificpeer-review

  203. Warpage-based optimization of the curing profile for electronic packaging polymers

    Yang, DG., Jansen, KMB., Li, QY., Liang, JS., Ernst, LJ. & Zhang, GQ., 2003, ICEPT 2003. Bi, K., Barnwell, PG. & Wang, J. (eds.). Piscataway: IEEE Society, p. 345-350 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  204. 2002
  205. A micro-mechanics approach for polymeric material failures in microelectronic packaging

    Fan, XJ., Zhang, GQ. & Ernst, LJ., 2002, 3rd international conference on benefiting from thermal and mechanical simulation in (micro)-electronics. Ernst, LJ., Zhang, GQ., Dudek, R. & de Saint Leger, O. (eds.). Piscataway: IEEE Society, p. 154-164 11 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  206. Improvement of material characterization of curing polymers by image processing

    Gonda, V., Liu, C., van t Hof, C., Ernst, LJ. & Zhang, GQ., 2002, Modeling of materials and its applications in advanced technologies. Chiu, C-H., Chen, Z., Gao, H., Lam, KY. & Tay, AAO. (eds.). Enfield: Trans Tech, p. 205-210 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  207. Mechanical modeling and characterization of the curing process of underfill materials

    Ernst, LJ., van t Hof, C., Yang, D., Zhang, GQ., Bressers, HJL., Caers, JFJ., den Boer, AWJ. & Janssen, J., 2002, In : Journal of Electronic Packaging. 124, p. 97-105 9 p.

    Research output: Contribution to journalArticleScientificpeer-review

  208. Microstructure and mechanical properties of TiB2 solid solution composites

    Wang, W., Ernst, LJ. & Fu, Z., 2002, International conference on processing and manufacturing of advanced materials. Chandra, T. & Higashi, K. (eds.). p. 1-6 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  209. On the effect of cure-residual stress on flip chip failure prediction

    Ernst, LJ., Yang, D., Jansen, KMB., van t Hof, C., Zhang, GQ. & van Driel, WD., 2002, Proceedings of 4th electronics packaging technology conference (EPTC 2002). Lee, C., Chuan, TK. & Iyer, MK. (eds.). Piscataway: IEEE Society, p. 398-403 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  210. Parameter sensitivity study of cure-dependent underfill properties on flip chip failures

    Yang, D., Zhang, GQ., van Driel, W., Janssen, J., Bressers, HJL. & Ernst, LJ., 2002, 52nd electronic components & technology conference 2002. Piscataway: IEEE Society, p. 865-872 8 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  211. Prediction and verification of process-induced thermal deformation of electronic packages using non-linear FEM and 3D interferometry

    van Driel, WD., Zhang, GQ., Janssen, J., Ernst, LJ., Su, F. & Yi, S., 2002, 3rd international conference on benefiting from thermal and mechanical simulation in (micro)electronics. Ernst, LJ., Zhang, GQ., Dudek, R. & de Saint Leger, O. (eds.). Piscataway: The Institute of Electrical and Electronics Engineers, p. 362-368 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  212. Prediction of back-end process-induced wafer warpage and experimental verification

    van Silfhout, RBR., van Driel, WD., Li, Y., Zhang, GQ. & Ernst, LJ., 2002, 52nd electronic components & technology conference 2002. Piscataway: IEEE Society, p. 1182-1187 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  213. Progressive failure modelling of matrix cracking in notched cross-ply laminates

    Liu, C., Nijhof, AHJ., Ernst, LJ. & Marissen, R., 2002, ECCM 10: composites for the future. p. 1-8 8 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  214. Progressive failure modelling of matrix cracking in notched cross-ply laminates

    Liu, CJ., Nijhof, AHJ., Ernst, LJ. & Marissen, R., 2002, Composites for the future; proceedings. Sol, H. & Degrieck, J. (eds.). Brussel, Belgie: ESCM, european society of composite materials, p. 1-8 8 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  215. Progressive failure modelling of transverse cracking in cross-ply laminates with double-edge-semicircular notches

    Liu, C., Nijhof, AHJ., Ernst, LJ. & Marissen, R., 2002, In : Engineering Transactions. 50, 4, p. 287-303 17 p.

    Research output: Contribution to journalArticleProfessional

  216. Progressive failure prediction of notc-induced splits (NIS) in notched cross-ply laminates

    Liu, CJ., Ernst, LJ. & Marissen, R., 2002, In : Journal of Iron and Steel Research International. p. 1-9 9 p.

    Research output: Contribution to journalArticleScientificpeer-review

  217. Solders fatigue prediction using interfacial boundary volume criterion

    Zhao, XJ., Zhang, GQ., Caers, JFJM. & Ernst, LJ., 2002, 3rd international conference on benefiting from thermal and mechanical simulation in (micro)electronics. Ernst, LJ., Zhang, GQ., Dudek, R. & de Saint Leger, O. (eds.). Piscataway: The Institute of Electrical and Electronics Engineers, p. 140-147 8 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  218. The effect of interface models on the interface stresses between a thin oxide layer and a substrate

    He, YT., Zhang, GQ. & Ernst, LJ., 2002, 3rd international conference on benefiting from thermal and mechanical simulation in (micro)electronics. Ernst, LJ., Zhang, GQ., Dudek, R. & de Saint Leger, O. (eds.). Piscataway: The Institute of Electrical and Electronics Engineers, p. 213-219 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  219. The state-of-the-art of thermo-mechanical characterisation of thin polymer films

    Pelletier, C., Bressers, HJL., Zhang, GQ., Jansen, KMB., Gonda, V. & Ernst, LJ., 2002, 3rd international conference on benefiting from thermal and mechanical simulation in (micro)electronics. Ernst, LJ., Zhang, GQ., Dudek, R. & de Saint Leger, O. (eds.). Piscataway: The Institute of Electrical and Electronics Engineers, p. 293-300 8 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  220. 2001
  221. Buckling driven interface delamination between a thin metal layer and a ceramic substrate

    Liu, CJ., Zhang, G. Q., Ernst, LJ., Vervoort, M. & Wisse, G., 2001, 51st electronic components and technology conference, May 26 - June 1. P Slota Jr. & WJ Howell (eds.). s.l.: IEEE Society, p. 624-631 8 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  222. Combined experimental and numerical investigation on flip chip solder fatigue with cure-dependent underfill properties

    Yang, DG., Zhang, G. Q., Ernst, LJ. & et al, ., 2001, 51st electronic components and technology conference, May 26 - June 1. P Slota Jr. & WJ Howell (eds.). s.l.: IEEE Society, p. 919-924 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  223. Combined experimental and theoretical investigation of fracture in unidirectional glass fibre reinforced polyester under varying mixed mode ratio

    Rizov, V., Ernst, LJ. & Wisse, G., 2001, Proceedings of the 9th national congress on theoretical and applied mechanics. Ivanov, YA. & Baltov, A. (eds.). Sofia: Bulgarian Academy of Science, p. 593-598 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  224. Creep behavior of a molding compound and its effect on packaging process stresses

    Kiasat, MS., Zhang, G. Q., Ernst, LJ. & Wisse, G., 2001, 51st electronic components and technology conference, May 26 - June 1. P Slota Jr. & WJ Howell (eds.). s.l.: IEEE Society, p. 931-938 8 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  225. Effect of chip anisotropy on packaging process induced stresses

    Janssen, JHJ., Yang, DG., Ernst, LJ. & et al, ., 2001, Proceedings of the 2nd international conference on benefiting from thermal and mechanical simulation in (micro)-electronics, April 9-11. LJ Ernst, O Saint Leger, D. & GQ Zhang (eds.). Paris: Europia, p. 83-88 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  226. Finite element modeling of solder interconnection reliability with variable solder geometry

    Zhao, XJ., Zhang, G. Q., Caers, JFJ. & Ernst, LJ., 2001, Proceedings of the 2nd international conference on benefiting from thermal and mechanical simulation in (micro)-electronics, April 9-11. GQ Zhang, LJ Ernst & O Saint Leger, D. (eds.). Paris: Europia, p. 337-342 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  227. Innovative thermo-mechanical design and qualification of microelectronics - the challenges for mechanical professionals

    Zhang, G. Q., Maessen, P., Bisschop, J. & Ernst, LJ., 2001, Proceedings of the fourth international symposium on electronic packaging technology, August 8-11. K Bi & et al (eds.). s.l.: IEEE Society, p. 314-318 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  228. On the analysis of the interlaminar strain-energy release rates in ring-fracture specimens

    Rizov, V. & Ernst, LJ., 2001, In : Composite Structures. 54, p. 331-334 4 p.

    Research output: Contribution to journalArticleScientific

  229. On the constitutive modeling of thermosetting polymers for assembly process simulations

    Ernst, LJ., van t Hof, C., Yang, D., Kiasat, MS., Zhang, GQ., den Bressers, AWJ. & Janssen, J., 2001, Proceedings of the 9th national congress on theoretical and applied mechanics. Ivanov, YA. & Baltov, A. (eds.). Sofia: Bulgarian Academy of Science, p. 81-94 14 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  230. On the stress, strain and damage evolution in thermosetting polymers due to assembly processing of electronic packages

    Ernst, LJ., van t Hof, C., Yang, DG. & et al, ., 2001, Proceedings of the fourth international symposium on electronic packaging technology, August 8-11. K Bi & et al (eds.). s.l.: IEEE Society, p. 365-369 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  231. Packaging induced die stresses considering time-dependent behaviour of a molding compound

    Janssen, JHJ., Zhang, G. Q., Ernst, LJ., Kiasat, MS. & et al, ., 2001, Proceedings of the 2nd international conference on benefiting from thermal and mechanical simulation in (micro)-electronics, April 9-11. LJ Ernst, O Saint Leger, D. & GQ Zhang (eds.). Paris: Europia, p. 227-231 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  232. Response surface modeling for non-linear packaging stresses

    van Driel, W., Zhang, G. Q., Bergman, JW., Steenbruggen, G. & Ernst, LJ., 2001, Proceedings of the 2nd international conference on benefiting from thermal and mechanical simulation in (micro)-electronics, April 9-11. LJ Ernst, O Saint Leger, D. & GQ Zhang (eds.). Paris: Europia, p. 27-34 8 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  233. Thermally induced delamination-buckling in a copper-ceramic microelectronic product

    Liu, CJ., Zhang, G. Q., Ernst, LJ. & Wisse, G., 2001, Proceedings of the 2nd international conference on benefiting from thermal and mechanical simulation in (micro)electronics, April 9-11. LJ Ernst, O Saint Leger, D. & GQ Zhang (eds.). Paris: Europia, p. 75-82 8 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  234. Time and temperature dependent thermo-mechanical characterization and modeling of a packaging molding compound

    Kiasat, MS., Ernst, LJ., Zhang, G. Q. & et al, ., 2001, Proceedings of the 2nd international conference on benefiting from thermal and mechanical simulation in (micro)-electronics, April 9-11. LJ Ernst, O Saint Leger, D. & GQ Zhang (eds.). Paris: Europia, p. 155-162 8 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  235. Time dependent behavior of molding compound in packaging

    Wisse, G., Jansen, KMB., Ernst, LJ., Kiasat, MS. & et al, ., 2001, 13th European microelectronics and packaging conference, May 30-31. Reston: International Microelectronics and Packaging Society, p. 389-392 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  236. Trends in virtual thermo-mechanical prototyping of microelectronics - the challenges for applied mechanics professionals

    Ernst, LJ. & Zhang, GQ., 2001, Proceedings of the 9th national congress on theoretical and applied mechanics. Ivanov, YA. & Baltov, A. (eds.). Sofia: Bulgarian Academy of Science, p. 68-80 13 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  237. Virtual thermo-mechanical prototyping of electronic packaging - challenges in material characterization and modeling

    Zhang, G. Q., Tay, AAO., Ernst, LJ. & et al, ., 2001, 51st electronic components and tecjnology conference, May 26 - June 1. P Slota Jr. & WJ Howell (eds.). s.l.: IEEE Society, p. 1479-1486 8 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  238. Virtual thermo-mechanical prototyping of microelectronics: the challenges for mechanics professionals

    Zhang, G. Q., Maessen, P., Ernst, LJ. & et al, ., 2001, Proceedings of the 2nd international conference on benefiting from thermal and mechanical simulation in (micro)-electronics, April 9-11. LJ Ernst, O Saint Leger, D. & GQ Zhang (eds.). Paris: Europia, p. 21-24 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  239. 2000
  240. Constitutive modelling of the curing process of encapsulate polymers for electronic packages

    van t Hof, C. & Ernst, LJ., 2000, Plastic and viscoplastic response of materials and metal forming. AS Khan, H Zhang & Y Yuan (eds.). Fulton: Neat, p. 161-163

    Research output: Chapter in Book/Report/Conference proceedingChapterScientific

  241. Determination of visco-elastic properties during the curing process of underfill materials

    Ernst, LJ. & et al, ., 2000, Proceedings of the 50th electronic components & technology conference, May 21-24. Piscataway, NJ: IEEE Society, p. 1070-1077 8 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  242. Mechanical characterisation and simulation of packaging polymer curing

    Ernst, LJ., van t Hof, C., Yang, DG., Kiasat, MS. & et al, ., 2000, Proceedings 3rd international conference and poster exhibition micro materials, April 17-19. B Michel & et al (eds.). Dresden: DDP Goldenbogen, p. 269-273 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  243. Microstructure and mechanical properties of TiB2 ceramics fabricated by hot pressing

    Wang, W. & Ernst, LJ., 2000, Proceedings of the 1st international conference on advanced materials processing, November 19-23. DL Zhang, KL Pickering & XY Xiong (eds.). s.l.: Institute of Materials Engineering, Australasia, p. 525-530 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  244. Mixed mode failure of undirectional fiber reinforced composite: an investigation by using the ring fracture test

    Rizov, V. & Ernst, LJ., 2000, Proceedings third international conference on composite science and technology, January 11-13. S Adali, EV Morozov & VE Verijenko (eds.). Durban: CCMS, p. 429-434 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  245. Polymer material characterization and modeling

    Ernst, LJ., 2000, Profiting from thermal and mechanical simulation of microelectronics, March 23-24. Eindhoven: Compete, p. 1-35 35 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  246. Polymer material characterization and modeling

    Ernst, LJ., 2000, Benefiting from thermal and mechanical simulation in micro-electronics. GQ Zhang, LJ Ernst & O Saint Leger, D. (eds.). Boston: Kluwer, p. 37-58

    Research output: Chapter in Book/Report/Conference proceedingChapterScientific

  247. Subcritical matrix failures in cross-ply composite laminates with double-edge-semicircular notches

    Liu, CJ., Nijhof, AHJ., Ernst, LJ. & Marissen, R., 2000, Proceedings of the fourth international colloquium on computation of shell and spatial structures, June 4-7 (CD-ROM). M Papadrakis, A Samartin & E Onate (eds.). s.l.: s.n., p. 1-14 14 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  248. Vertical die crack stresses of Flip Chip induced in major package assembly processes

    Yang, DG., Ernst, LJ., van t Hof, C., Kiasat, MS. & et al, ., 2000, In : Microelectronics Reliability. 40, p. 1533-1538 6 p.

    Research output: Contribution to journalArticleScientific

  249. Virtual thermo-mechanical prototyping of electronic packaging - the bottlenecks and solutions for damage modeling

    Zhang, G. Q., Tay, AAO. & Ernst, LJ., 2000, Proceedings of 3rd electronics packaging technology conference, December 5-7. TB Lim, C Lee & KC Toh (eds.). Piscataway, NJ: IEEE Society, p. 263-269 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  250. Virtual thremo-mechanical prototyping of electronic packaging using Philips optimization strategy

    Janssen, J., Zhang, G. Q., Ernst, LJ. & et al, ., 2000, Proceedings 2000 international symposium on microelectronics, September 20-22. Reston: International Microelectronics and Packaging Society, p. 398-405 8 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  251. 1999
  252. A non-Gaussian network alteration model

    Ernst, LJ. & Septanika, EG., 1999, Proceedings of the first European conference on constitutive models for rubber, 9-10 September 1999. A Dorfman & A Muhr (eds.). Rotterdam: CRC Press / Balkema - Taylor & Francis Group, p. 169-180 12 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  253. Hysteresis and time-dependent constitutive modelling of filled vulcanised rubber

    Ernst, LJ. & Septanika, EG., 1999, In : The European Physical Journal. Special Topics. 9, p. 63-72 10 p.

    Research output: Contribution to journalArticleScientific

  254. Packaging polymer's curing process characterisation and modelling

    van t Hof, C., Kiasat, MS., Yang, DG., Ernst, LJ., Zhang, G. Q., Bressers, H., den Boer, A. & Caers, J., 1999, Eindhoven: Unknown Publisher. 77 p.

    Research output: Book/ReportReportProfessional

  255. Thermo-mechanical characterization of packaging polymers during the curing process

    van t Hof, C., Yang, DG., Kiasat, MS., Ernst, LJ. & et al, ., 1999, Proceedings of the 1999 workshop on polymeric materials for microelectronics and photonics applications: mechanisms, physics, reliability, processing, December 12-15. E Suhir, Y Koike, B Michel & J Lu (eds.). New York: ASME, p. 153-158 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  256. Thermo-mechanical characterization of packaging polymers during the curing process (niet eerder opgenomen)

    van t Hof, C., Yang, DG., Kiasat, MS., Ernst, LJ. & et al, ., 1999, Proceedings of the 1999 workshop on polymeric materials for microelectronics and photonics applications: mechanics physics, reliability, processing, December 12-15. E Suhir & et al (eds.). New York: ASME, p. 153-158 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  257. 1998
  258. An automatic and interactive large-deformation measurement system based on image processing

    Septanika, EG., Ernst, LJ. & van den Hooff, LACM., 1998, In : Experimental Mechanics. 18, 3, p. 181-188 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  259. Application of the network alteration theory for modeling the time-dependent constitutive behaviour of rubbers, part II. Further evaluation of the general theory and experimental verification

    Septanika, EG. & Ernst, LJ., 1998, In : Mechanics of Materials. 30, p. 265-273 9 p.

    Research output: Contribution to journalArticleScientificpeer-review

  260. Application of the network alteration theory for modeling the time-dependent constitutive behaviour of rubbers: part 1

    Septanika, EG. & Ernst, LJ., 1998, In : Mechanics of Materials. 30, p. 253-263 11 p.

    Research output: Contribution to journalArticleScientificpeer-review

  261. Hysteresis and time-dependent constitutive modeling of filled vulcanized rubber

    Ernst, LJ. & Septanika, EG., 1998, Euromech - Mecamat: 3rd European Mechanics of Materials conference on mechanics and multi-physics processes in solids, Oxford, UK, 23-25 November 1998. E Busso & G Cailletaud (eds.). London: s.n., p. 1-10 10 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  262. Transverse behavior of a unidirectional composite(glass fibre reinforced unsaturated polyester): part 2. Influence of shrinkage strains

    Zhang, L., Ernst, LJ. & Brouwer, DJWM., 1998, In : Mechanics of Materials. 27, p. 37-61 25 p.

    Research output: Contribution to journalArticleScientificpeer-review

  263. Transverse behaviour of a unidirectional composite (glass fibre reinforced unsaturated polyester): part 1. Influence of fibre packing geometry

    Zhang, L., Ernst, LJ. & Brouwer, HR., 1998, In : Mechanics of Materials. 27, p. 13-36 24 p.

    Research output: Contribution to journalArticleScientificpeer-review

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