Research output

  1. Superconducting High-Aspect Ratio Through-Silicon Vias with DC-Sputtered Al for Quantum 3D integration

    Research output: Contribution to journalArticleScientificpeer-review

  2. Statistical reprogramming of macroscopic self-assembly with dynamic boundaries

    Research output: Contribution to journalArticleScientificpeer-review

  3. Three-dimensional self-assembly using dipolar interaction

    Research output: Contribution to journalArticleScientificpeer-review

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Activities

  1. Microengineering organs-on-chip

    Activity: Talk or presentationTalk or presentation at a workshop, seminar, course or other meeting

  2. Microelectromechanical organs-on-chip

    Activity: Talk or presentationTalk or presentation at a workshop, seminar, course or other meeting

  3. Microengineered organs-on-chip

    Activity: Talk or presentationTalk or presentation at a workshop, seminar, course or other meeting

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ID: 13310902