Research output

  1. Fracture toughness of Cu-EMC interfaces in pressurized steam

    Research output: Contribution to journalArticleScientificpeer-review

  2. Failure and delamination in microelectronic packages

    Research output: ThesisDissertation (TU Delft)Scientific

  3. Mechanical characterization of epoxy moulding compound in pressurized steam

    Research output: Contribution to journalArticleScientificpeer-review

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ID: 168567