1. 2017
  2. High aspect ratio spiral resonators for process variation investigation and MEMS applications

    Middelburg, L. M., Mansouri, B. E., Van Zeijl, H. W., Zhang, G. Q. & Poelma, R. H., 2017, Proceedings of IEEE Sensors Conference 2017. Piscataway, NJ: IEEE, p. 1-3 3 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  3. Prognostics & health management for LED-based applications

    van Driel, W., Jacobs, B., Schenkelaars, D., Klompenhouwer, M., Poelma, R., El Mansouri, B. & Middelburg, L., 2017, 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017. IEEE, p. 1-4 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  4. Smart Systems Integration in the era of Solid State Lighting

    van Driel, W., Zhang, G. Q., van Zeijl, H., Poelma, R., Koladouz Esfahani, Z., Ramachandrappa Venkatesh, M., Middelburg, L. & El Mansouri, B., 2017, Smart Systems Integration 2017: International Conference and Exhibition on Integration Issues of Miniaturized Systems. Otto, T. (ed.). Frankfurt: Mesago Messe Frankfurt GmbH, p. 160-165 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  5. 2016
  6. Stretchable Binary Fresnel Lens for Focus Tuning

    Li, X., Wei, L., Poelma, R., Vollebregt, S., Wei, J., Urbach, P., Sarro, L. & Zhang, G. Q., 3 May 2016, In : Scientific Reports. 6, 8 p., 25348 .

    Research output: Contribution to journalArticleScientificpeer-review

  7. Thermal characterization of carbon nanotube foam using MEMS microhotplates and thermographic analysis

    Silvestri, C., Riccio, M., Poelma, R., Morana, B., Vollebregt, S., Santagata, F., Irace, A., Zhang, G. Q. & Sarro, L., 31 Mar 2016, In : Nanoscale. 15, p. 1-10 10 p.

    Research output: Contribution to journalArticleScientificpeer-review

  8. 3D interconnect technology based on low temperature copper nanoparticle sintering

    Zhang, B., Carisey, Y., Damian, A., Poelma, R., Zhang, G. Q. & van Zeijl, H., 2016, Proceedings of the 17th International Conference on Electronic Packaging Technology (ICEPT). Bi, K., Liu, S. & Zhou, S. (eds.). IEEE, p. 1163-1167

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  9. Effects of Nanostructure and Coating on the Mechanics of Carbon Nanotube Arrays

    Poelma, RH., Fan, X., Hu, Z-Y., Van Tendeloo, G., van Zeijl, H. & Zhang, GQ., 2016, In : Advanced Functional Materials. 26, 8, p. 1233-1242 10 p.

    Research output: Contribution to journalArticleScientificpeer-review

  10. Metallic Nanoparticle Based Interconnect for Heterogeneous 3D Integration

    van Zeijl, H., Carisey, Y., Damian, A., Poelma, R., A, Z. & Zhang, G. Q., 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC). O'Conner, L. (ed.). Piscataway: IEEE, p. 217-224 8 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  11. Multi-Scale Material and Technology for Heterogeneous Integration

    Poelma, RH., 2016, Delft: R.H. Poelma. 227 p.

    Research output: ThesisDissertation (TU Delft)

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