1. 2015
  2. Mechanics of graphene and carbon nanotubes under uniaxial compression and tension

    Poelma, RH. & Zhang, GQ., 2015, Molecular modeling and multiscaling issues for electronic material applications. Wymyslowski, A., Iwamoto, N., Yuen, M. & Fan, H. (eds.). Dordrecht: Springer, p. 149-173 194 p.

    Research output: Chapter in Book/Report/Conference proceedingChapterScientific

  3. Tunable binary Fresnel lens based on stretchable PDMS/CNT composite

    Li, X., Wei, L., Vollebregt, S., Poelma, RH., Shen, Y., Wei, J., Urbach, HP., Sarro, PM. & Zhang, GQ., 2015, Proceedings of the 2015 Transducers - 2015 18th Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS. Kenny, TW. & Bright, VM. (eds.). Piscataway: IEEE Society, p. 2041-2044 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  4. 2014
  5. Stiction-induced sealing of surface micromachined channels

    Morana, B., Poelma, RH., Fiorentino, G., Wei, J., Creemer, JF. & Sarro, PM., 2014, In : IEEE Journal of Microelectromechanical Systems. 23, 2, p. 459-470 12 p.

    Research output: Contribution to journalArticleScientificpeer-review

  6. Tailoring the Mechanical Properties of High-Aspect-Ratio Carbon Nanotube Arrays using Amorphous Silicon Carbide Coatings

    Poelma, R. H., Morana, B., Vollebregt, S., Schlangen, E., van Zeijl, HW., Fan, X. & Zhang, GQ., 2014, In : Advanced Functional Materials. 24, 36, p. 5737-5744 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  7. Through-Polymer-Via for 3D heterogeneous integration and packaging, and method of manufacture thereof

    Poelma, RH., Zhang, GQ. & van Zeijl, HW., 2014, Patent No. 2010077, Priority date 3 Jul 2014

    Research output: PatentOther research output

  8. 2013
  9. A new self-sealing thin-film encapsulation process for MEMS

    Santagata, F., Zaccaria, I., Poelma, RH., Creemer, JF., Zhang, GQ. & Sarro, PM., 2013, Proceedings 17th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXVII. Morante, JR. & Hierold, C. (eds.). Piscataway, NJ, USA: IEEE Society, p. 822-825 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  10. Low temperature hybrid wafer bonding for 3D integration

    Damian, AA., Poelma, RH., van Zeijl, HW. & Zhang, GQ., 2013, Proceedings of the 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2013). Zhang, GQ. (ed.). Piscataway, NJ: IEEE Society, p. 1-5 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  11. Multi-LED package design, fabrication and thermal analysis

    Poelma, RH., Tarashioon, S., van Zeijl, HW., Goldbach, S., Zijl, JLJ. & Zhang, GQ., 2013, In : Journal of Semiconductors. 34, 5, p. 1-5 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  12. Transfer molding of primary LED optics: High aspect ratio domes

    Kersjes, S. H. M., Zijl, J. L. J., Poelma, R. & Wensink, H. W., 2013, 2013 Eurpoean Microelectronics Packaging Conference (EMPC). Piscataway: IEEE, p. 1-6 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  13. 2012
  14. Effects of single vacancy defect position on the stability of carbon nanotubes

    Poelma, RH., Sadeghian Marnani, H., Koh, SW. & Zhang, GQ., 2012, In : Microelectronics Reliability. 52, 7, p. 1279-1284 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

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