1. 2013
  2. Multi-LED package design, fabrication and thermal analysis

    Poelma, RH., Tarashioon, S., van Zeijl, HW., Goldbach, S., Zijl, JLJ. & Zhang, GQ., 2013, In : Journal of Semiconductors. 34, 5, p. 1-5 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  3. Transfer molding of primary LED optics: High aspect ratio domes

    Kersjes, S. H. M., Zijl, J. L. J., Poelma, R. & Wensink, H. W., 2013, 2013 Eurpoean Microelectronics Packaging Conference (EMPC). Piscataway: IEEE, p. 1-6 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  4. 2012
  5. Effects of single vacancy defect position on the stability of carbon nanotubes

    Poelma, RH., Sadeghian Marnani, H., Koh, SW. & Zhang, GQ., 2012, In : Microelectronics Reliability. 52, 7, p. 1279-1284 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

  6. Establishment of the coarse grained parameters for epoxy-copper interfacial separation

    Wong, KY., Leung, YY., Poelma, RH., Jansen, KMB., Yuan, CA., van Driel, WD. & Zhang, GQ., 2012, In : Journal of Applied Physics. 111, May, p. 1-7 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  7. Establishment of the coarse grained parameters for epoxy-copper interfacial separation

    Wong, KY., Leung, YY., Poelma, RH., Jansen, KMB., Yuan, CA., van Driel, WD. & Zhang, GQ., 2012, Electronic packaging technology and high density packaging (ICEPT-HDP), 2012 Proceedings of the 13th international conference. s.n. (ed.). Piscataway: IEEE Society, p. 1467-1473 7 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  8. Establishment of the mesoscale parameters for epoxy-copper interfacial separation

    Wong, CKY., Leung, SYY., Poelma, RH., Jansen, KMB., Yuan, CCA., van Driel, WD. & Zhang, GQ., 2012, 13th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (EuroSimE 2012). s.l.: IEEE Society, p. 1-6 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  9. Fully back-end TSV process by Cu electro-less plating for 3D smart sensor systems

    Santagata, F., Fiorentino, G., Nie, M., Farriciello, C., Poelma, RH., Zhang, GQ. & Sarro, PM., 2012, Proceedings 11th IEEE Sensors Conference. Fang et al, W. (ed.). Piscataway, NJ, USA: IEEE Society, p. 668-671 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  10. Mechanical characterization of individual polycrystalline carbon tubes for use in electrical nano-interconnects

    Khiat, A., Poelma, RH., Zhang, GQ., Heuck, FCA., Tichelaar, FD., Sarno, M., Ciambelli, P., Fontorbes, S., Arurault, L. & Staufer, U., 2012, In : Microelectronic Engineering. 98, p. 317-320 4 p.

    Research output: Contribution to journalArticleScientificpeer-review

  11. The mechanical properties modeling of nano-scale materials by molecular dynamics

    Yuan, C., van Driel, WD., Poelma, RH. & Zhang, GQ., 2012, Molecular Modeling and Multiscaling Issues for Electronic Material Applications. Iwamoto, N., Yuen, MMF. & Fan, H. (eds.). New York: Springer, p. 115-131 258 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeChapterScientific

  12. 2011
  13. A numerical experimental approach for characterizing the elastic properties of thin films: application of nanocantilevers

    Poelma, RH., Sadeghian Marnani, H., Noijen, SPM., Zaal, JJM. & Zhang, GQ., 2011, In : Journal of Micromechanics and Microengineering. 21, 6, p. 1-11 11 p.

    Research output: Contribution to journalArticleScientificpeer-review

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