1. 2016
  2. Tailoring material properties for 3D microfabrication: In-situ experimentation and multi-scale modelling

    Poelma, R., Fan, X. J., Schlangen, E., van Zeijl, H. & Zhang, G. Q., 2016, 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE, p. 1-6 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  3. 2015
  4. Through-polymer-via for 3D heterogeneous integration and packaging

    Hamelink, J., Poelma, R. & Kengen, M., Dec 2015, 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC). IEEE Society, p. 1-7 7 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  5. Establishment of the mesoscale parameters for separation: A nonequilibrium molecular dynamics model

    Wong, CKY., Leung, SYY., Poelma, RH., Jansen, KMB., Yuan, CCA., van Driel, WD. & Zhang, GQ., 2015, Molecular modeling and multiscaling issues for electronic material applications - Volume 2. Wymyslowski, A., Iwamoto, N., Yuen, M. & Fan, H. (eds.). Cham, Switzerland: Springer, p. 133-148 194 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeChapterScientific

  6. Mechanics of graphene and carbon nanotubes under uniaxial compression and tension

    Poelma, RH. & Zhang, GQ., 2015, Molecular modeling and multiscaling issues for electronic material applications. Wymyslowski, A., Iwamoto, N., Yuen, M. & Fan, H. (eds.). Dordrecht: Springer, p. 149-173 194 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeChapterScientific

  7. Tunable binary Fresnel lens based on stretchable PDMS/CNT composite

    Li, X., Wei, L., Vollebregt, S., Poelma, RH., Shen, Y., Wei, J., Urbach, HP., Sarro, PM. & Zhang, GQ., 2015, Proceedings of the 2015 Transducers - 2015 18th Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS. Kenny, TW. & Bright, VM. (eds.). Piscataway: IEEE Society, p. 2041-2044 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  8. 2014
  9. Stiction-induced sealing of surface micromachined channels

    Morana, B., Poelma, RH., Fiorentino, G., Wei, J., Creemer, JF. & Sarro, PM., 2014, In : IEEE Journal of Microelectromechanical Systems. 23, 2, p. 459-470 12 p.

    Research output: Contribution to journalArticleScientificpeer-review

  10. Tailoring the Mechanical Properties of High-Aspect-Ratio Carbon Nanotube Arrays using Amorphous Silicon Carbide Coatings

    Poelma, R. H., Morana, B., Vollebregt, S., Schlangen, E., van Zeijl, HW., Fan, X. & Zhang, GQ., 2014, In : Advanced Functional Materials. 24, 36, p. 5737-5744 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  11. 2013
  12. A new self-sealing thin-film encapsulation process for MEMS

    Santagata, F., Zaccaria, I., Poelma, RH., Creemer, JF., Zhang, GQ. & Sarro, PM., 2013, Proceedings 17th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXVII. Morante, JR. & Hierold, C. (eds.). Piscataway, NJ, USA: IEEE Society, p. 822-825 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  13. Low temperature hybrid wafer bonding for 3D integration

    Damian, AA., Poelma, RH., van Zeijl, HW. & Zhang, GQ., 2013, Proceedings of the 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2013). Zhang, GQ. (ed.). Piscataway, NJ: IEEE Society, p. 1-5 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  14. Multi-LED package design, fabrication and thermal analysis

    Poelma, RH., Tarashioon, S., van Zeijl, HW., Goldbach, S., Zijl, JLJ. & Zhang, GQ., 2013, In : Journal of Semiconductors. 34, 5, p. 1-5 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  15. Transfer molding of primary LED optics: High aspect ratio domes

    Kersjes, S. H. M., Zijl, J. L. J., Poelma, R. & Wensink, H. W., 2013, 2013 Eurpoean Microelectronics Packaging Conference (EMPC). Piscataway: IEEE, p. 1-6 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  16. 2012
  17. Effects of single vacancy defect position on the stability of carbon nanotubes

    Poelma, RH., Sadeghian Marnani, H., Koh, SW. & Zhang, GQ., 2012, In : Microelectronics Reliability. 52, 7, p. 1279-1284 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

  18. Establishment of the coarse grained parameters for epoxy-copper interfacial separation

    Wong, KY., Leung, YY., Poelma, RH., Jansen, KMB., Yuan, CA., van Driel, WD. & Zhang, GQ., 2012, In : Journal of Applied Physics. 111, May, p. 1-7 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  19. Establishment of the coarse grained parameters for epoxy-copper interfacial separation

    Wong, KY., Leung, YY., Poelma, RH., Jansen, KMB., Yuan, CA., van Driel, WD. & Zhang, GQ., 2012, Electronic packaging technology and high density packaging (ICEPT-HDP), 2012 Proceedings of the 13th international conference. s.n. (ed.). Piscataway: IEEE Society, p. 1467-1473 7 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  20. Establishment of the mesoscale parameters for epoxy-copper interfacial separation

    Wong, CKY., Leung, SYY., Poelma, RH., Jansen, KMB., Yuan, CCA., van Driel, WD. & Zhang, GQ., 2012, 13th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (EuroSimE 2012). s.l.: IEEE Society, p. 1-6 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  21. Fully back-end TSV process by Cu electro-less plating for 3D smart sensor systems

    Santagata, F., Fiorentino, G., Nie, M., Farriciello, C., Poelma, RH., Zhang, GQ. & Sarro, PM., 2012, Proceedings 11th IEEE Sensors Conference. Fang et al, W. (ed.). Piscataway, NJ, USA: IEEE Society, p. 668-671 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  22. Mechanical characterization of individual polycrystalline carbon tubes for use in electrical nano-interconnects

    Khiat, A., Poelma, RH., Zhang, GQ., Heuck, FCA., Tichelaar, FD., Sarno, M., Ciambelli, P., Fontorbes, S., Arurault, L. & Staufer, U., 2012, In : Microelectronic Engineering. 98, p. 317-320 4 p.

    Research output: Contribution to journalArticleScientificpeer-review

  23. The mechanical properties modeling of nano-scale materials by molecular dynamics

    Yuan, C., van Driel, WD., Poelma, RH. & Zhang, GQ., 2012, Molecular Modeling and Multiscaling Issues for Electronic Material Applications. Iwamoto, N., Yuen, MMF. & Fan, H. (eds.). New York: Springer, p. 115-131 258 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeChapterScientific

  24. 2011
  25. A numerical experimental approach for characterizing the elastic properties of thin films: application of nanocantilevers

    Poelma, RH., Sadeghian Marnani, H., Noijen, SPM., Zaal, JJM. & Zhang, GQ., 2011, In : Journal of Micromechanics and Microengineering. 21, 6, p. 1-11 11 p.

    Research output: Contribution to journalArticleScientificpeer-review

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