1. 2020
  2. The interface adhesion of CaAlSiN3: Eu2+ phosphor/silicone used in light-emitting diode packaging: A first principles study

    Cui, Z., Fan, J., van Ginkel, H. J., Fan, X. & Zhang, G., 30 Apr 2020, In : Applied Surface Science. 510, 8 p., 145251.

    Research output: Contribution to journalArticleScientificpeer-review

  3. Hydrolysis kinetic study of CaAlSiN3:Eu2+ red phosphor with both water immersion test and first-principles calculation

    Fan, J., Zhou, L., Cui, Z., Chen, S., Fan, X. & Zhang, G., 1 Mar 2020, In : Journal of Luminescence. 219, p. 1-11 11 p., 116874.

    Research output: Contribution to journalArticleScientificpeer-review

  4. 2019
  5. General coupling model for electromigration and one-dimensional numerical solutions

    Cui, Z., Fan, X. & Zhang, G., 2019, In : Journal of Applied Physics. 125, 10, p. 1-9 9 p., 105101.

    Research output: Contribution to journalArticleScientificpeer-review

  6. PVP-Mediated Galvanic Replacement Synthesis of Smart Elliptic Cu-Ag Nanoflakes for Electrically Conductive Pastes

    Zhang, Y., Zhu, P., Li, G., Cui, Z., Cui, C., Zhang, K., Gao, J., Chen, X., Zhang, G., Sun, R. & Wong, C., 2019, In : ACS Applied Materials and Interfaces. 11, 8, p. 8382-8390 9 p.

    Research output: Contribution to journalArticleScientificpeer-review

  7. 2018
  8. Interfacial Failure Characterization of Electronic Packaging Component Using a Multiscale Modelling Approach

    Cui, Z., Zhang, Y., Yang, Q., Zhang, G. & Chen, X., 2018, Proceedings - 2018 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2018. Piscataway, NJ: IEEE, p. 68-70 3 p. 8421434

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  9. Interfacial properties of Cu/SiO2 using a multiscale modelling approach in electronic packages

    Cui, Z., Chen, X., Fan, X. & Zhang, G., 2018, 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018. Piscataway, NJ: IEEE, p. 1-4 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

ID: 25572826