3D Integration with PCB technology

ECW de Jong; P Bauer; JA Ferreira

3D Integration with PCB technology

ECW de Jong, P Bauer, JA Ferreira

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

18 Citations (Scopus)

Original language	Undefined/Unknown
Title of host publication	APEC 2006 Proceedings
Editors	s.n.
Place of Publication	Piscataway
Publisher	IEEE Society
Pages	857-863
Number of pages	7
ISBN (Print)	0-7803-9547-6
Publication status	Published - 2006
Event	Twenty-first annual IEEE Applied Power Electronics Conference and Exposition, Dallas, Texas - Piscataway Duration: 19 Mar 2006 → 23 Mar 2006

Publication series

Name
Publisher	IEEE

Conference

Conference	Twenty-first annual IEEE Applied Power Electronics Conference and Exposition, Dallas, Texas
Period	19/03/06 → 23/03/06

Keywords

conference contrib. refereed
Conf.proc. > 3 pag

Cite this

@inproceedings{30ff301688b443eca17a4c5bab1e9e9b,

title = "3D Integration with PCB technology",

keywords = "conference contrib. refereed, Conf.proc. > 3 pag",

author = "{de Jong}, ECW and P Bauer and JA Ferreira",

year = "2006",

language = "Undefined/Unknown",

isbn = "0-7803-9547-6",

publisher = "IEEE Society",

pages = "857--863",

editor = "s.n.",

booktitle = "APEC 2006 Proceedings",

note = "Twenty-first annual IEEE Applied Power Electronics Conference and Exposition, Dallas, Texas ; Conference date: 19-03-2006 Through 23-03-2006",

}

TY - GEN

T1 - 3D Integration with PCB technology

AU - de Jong, ECW

AU - Bauer, P

AU - Ferreira, JA

PY - 2006

Y1 - 2006

KW - conference contrib. refereed

KW - Conf.proc. > 3 pag

UR - http://www.ieeexplore.ieee.org/iel5/10769/33947/01620639.pdf?isnumber=33947&prod=CNF&arnumber=1620639&arSt=+857&ared=+863&arAuthor=+de+Jong%2C+E.C.W.%3B++Ferreira%2C+J.A.%3B++Bauer%2C+P.

M3 - Conference contribution

SN - 0-7803-9547-6

SP - 857

EP - 863

BT - APEC 2006 Proceedings

A2 - s.n., null

PB - IEEE Society

CY - Piscataway

T2 - Twenty-first annual IEEE Applied Power Electronics Conference and Exposition, Dallas, Texas

Y2 - 19 March 2006 through 23 March 2006

ER -

3D Integration with PCB technology

Publication series

Conference

Keywords

Other files and links

Cite this