Original language | English |
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Pages (from-to) | 63-72 |
Number of pages | 10 |
Journal | Microelectronics International: an international journal |
Volume | 32 |
Issue number | 2 |
DOIs | |
Publication status | Published - 2015 |
3D system-in-package design using stacked silicon submount technology
M Dong, F Santagata, R Sokolovskij, J Wei, C Yuan, GQ Zhang
Research output: Contribution to journal › Article › Scientific › peer-review
7
Citations
(Scopus)