This paper presents an integrated shunt-based current-sensing system (CSS) capable of handling ±36A currents, the highest ever reported. It also achieves 0.3% gain error and 400μA offset, which is significantly better than the state-of-the-art. The heart of the system is a robust 260μΩ shunt made from the lead-frame of a standard HVQFN plastic package. The resulting voltage drop is then digitized by a ΔΣ ADC and a bandgap reference (BGR). At the expense of current handling capability, a ±5A version of the CSS uses a 10mΩ on-chip metal shunt to achieve just 4μA offset. Both designs were realized in a standard 0.13μm CMOS process.
Original languageEnglish
Title of host publication2016 IEEE Symposium on VLSI Circuits, VLSI-Circuits 2016
Subtitle of host publicationDigest of Technical Papers
Place of PublicationPiscataway, NJ
PublisherIEEE
Pages1-2
Number of pages2
ISBN (Electronic)978-1-5090-0635-9
ISBN (Print)978-1-5090-0636-6
DOIs
Publication statusPublished - 15 Jun 2016
Event30th IEEE Symposium on VLSI Circuits, VLSI Circuits 2016 - Honolulu, United States
Duration: 14 Jun 201617 Jun 2016

Conference

Conference30th IEEE Symposium on VLSI Circuits, VLSI Circuits 2016
CountryUnited States
CityHonolulu
Period14/06/1617/06/16

    Research areas

  • Cascading style sheets, Temperature measurement, Calibration, Standards, Lead, System-on-chip, Temperature distribution

ID: 11340757