Abstract
This paper presents an integrated shunt-based current-sensing system (CSS) capable of handling ±36A currents, the highest ever reported. It also achieves 0.3% gain error and 400μA offset, which is significantly better than the state-of-the-art. The heart of the system is a robust 260μΩ shunt made from the lead-frame of a standard HVQFN plastic package. The resulting voltage drop is then digitized by a ΔΣ ADC and a bandgap reference (BGR). At the expense of current handling capability, a ±5A version of the CSS uses a 10mΩ on-chip metal shunt to achieve just 4μA offset. Both designs were realized in a standard 0.13μm CMOS process.
Original language | English |
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Title of host publication | 2016 IEEE Symposium on VLSI Circuits, VLSI-Circuits 2016 |
Subtitle of host publication | Digest of Technical Papers |
Place of Publication | Piscataway, NJ |
Publisher | IEEE |
Pages | 1-2 |
Number of pages | 2 |
ISBN (Electronic) | 978-1-5090-0635-9 |
ISBN (Print) | 978-1-5090-0636-6 |
DOIs | |
Publication status | Published - 15 Jun 2016 |
Event | 30th IEEE Symposium on VLSI Circuits, VLSI Circuits 2016 - Honolulu, United States Duration: 14 Jun 2016 → 17 Jun 2016 |
Conference
Conference | 30th IEEE Symposium on VLSI Circuits, VLSI Circuits 2016 |
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Country/Territory | United States |
City | Honolulu |
Period | 14/06/16 → 17/06/16 |
Keywords
- Cascading style sheets
- Temperature measurement
- Calibration
- Standards
- Lead
- System-on-chip
- Temperature distribution