A 0.008-mm2 area-optimized thermal-diffusivity-based temperature sensor in 160-nm CMOS for SoC thermal monitoring

U Sonmez; R Quan; F Sebastiano; KAA Makinwa

doi:10.1109/ESSCIRC.2014.6942105

A 0.008-mm2 area-optimized thermal-diffusivity-based temperature sensor in 160-nm CMOS for SoC thermal monitoring

U Sonmez, R Quan, F Sebastiano, KAA Makinwa

Electronic Instrumentation

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

12 Citations (Scopus)

Original language	English
Title of host publication	Proceedings of the 40th European Solid-State Circuit Conference
Editors	P Andreani, A Bevilacqua, G Meneghesso
Place of Publication	Piscataway, NJ, USA
Publisher	IEEE Society
Pages	395-398
Number of pages	4
ISBN (Print)	978-1-4799-5694-4
DOIs	https://doi.org/10.1109/ESSCIRC.2014.6942105
Publication status	Published - 2014
Event	ESSCIRC 2014: 40th European Solid-State Circuits Conference - Venice, Italy Duration: 22 Sept 2014 → 26 Sept 2014 Conference number: 40

Publication series

Name
Publisher	IEEE

Conference

Conference	ESSCIRC 2014
Abbreviated title	ESSCIRC
Country/Territory	Italy
City	Venice
Period	22/09/14 → 26/09/14

Bibliographical note

Harvest

Access to Document

10.1109/ESSCIRC.2014.6942105

Cite this

@inproceedings{7f086818c6454387a89085c891024195,

title = "A 0.008-mm2 area-optimized thermal-diffusivity-based temperature sensor in 160-nm CMOS for SoC thermal monitoring",

author = "U Sonmez and R Quan and F Sebastiano and KAA Makinwa",

note = "Harvest; ESSCIRC 2014 : 40th European Solid-State Circuits Conference, ESSCIRC ; Conference date: 22-09-2014 Through 26-09-2014",

year = "2014",

doi = "10.1109/ESSCIRC.2014.6942105",

language = "English",

isbn = "978-1-4799-5694-4",

publisher = "IEEE Society",

pages = "395--398",

editor = "P Andreani and A Bevilacqua and G Meneghesso",

booktitle = "Proceedings of the 40th European Solid-State Circuit Conference",

}

Sonmez, U, Quan, R, Sebastiano, F & Makinwa, KAA 2014, A 0.008-mm2 area-optimized thermal-diffusivity-based temperature sensor in 160-nm CMOS for SoC thermal monitoring. in P Andreani, A Bevilacqua & G Meneghesso (eds), Proceedings of the 40th European Solid-State Circuit Conference. IEEE Society, Piscataway, NJ, USA, pp. 395-398, ESSCIRC 2014, Venice, Italy, 22/09/14. https://doi.org/10.1109/ESSCIRC.2014.6942105

A 0.008-mm2 area-optimized thermal-diffusivity-based temperature sensor in 160-nm CMOS for SoC thermal monitoring. / Sonmez, U; Quan, R; Sebastiano, F et al.
Proceedings of the 40th European Solid-State Circuit Conference. ed. / P Andreani; A Bevilacqua; G Meneghesso. Piscataway, NJ, USA: IEEE Society, 2014. p. 395-398.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - A 0.008-mm2 area-optimized thermal-diffusivity-based temperature sensor in 160-nm CMOS for SoC thermal monitoring

AU - Sonmez, U

AU - Quan, R

AU - Sebastiano, F

AU - Makinwa, KAA

N1 - Conference code: 40

PY - 2014

Y1 - 2014

U2 - 10.1109/ESSCIRC.2014.6942105

DO - 10.1109/ESSCIRC.2014.6942105

M3 - Conference contribution

SN - 978-1-4799-5694-4

SP - 395

EP - 398

BT - Proceedings of the 40th European Solid-State Circuit Conference

A2 - Andreani, P

A2 - Bevilacqua, A

A2 - Meneghesso, G

PB - IEEE Society

CY - Piscataway, NJ, USA

T2 - ESSCIRC 2014

Y2 - 22 September 2014 through 26 September 2014

ER -