Systems-on-chip traditionally rely on bulky quartz crystals to comply with wired communication standards like CAN or USB 2.0. Integrated frequency references with better than 500ppm inaccuracy could meet this need, resulting in higher integration and lower cost. Candidate architectures have employed RC-, LC- or TD (thermal diffusivity)-based time constants, all of which can be realized in standard CMOS. Compared to LC (sim 20mathrm{mW}, sim 100mathrm{ppm}) [1] or TD (sim 2mathrm{mW},sim 1000mathrm{ppm}) [2] references, RC references offer the lowest power consumption and competitive accuracy (< 1mathrm{mW}, 200mathrm{ppm})[3]. However, due to the nonlinear temperature dependence of on-chip resistors, such references require complex temperature-compensation schemes based on higher-order correction polynomials and extensive calibration [3], [4], or complicated analog compensation networks [5].

Original languageEnglish
Title of host publication2020 IEEE International Solid-State Circuits Conference, ISSCC 2020
PublisherIEEE
Pages64-66
Number of pages3
ISBN (Electronic)978-1-7281-3205-1
ISBN (Print)978-1-7281-3206-8
DOIs
Publication statusPublished - 2020
Event2020 IEEE International Solid-State Circuits Conference, ISSCC 2020 - San Francisco, United States
Duration: 16 Feb 202020 Feb 2020

Conference

Conference2020 IEEE International Solid-State Circuits Conference, ISSCC 2020
CountryUnited States
CitySan Francisco
Period16/02/2020/02/20

ID: 72800125