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A highly miniturized single-chip MOEMS scanner for all-in-one imaging solution. / Jovic, Aleksandar; Uto, Toshihiko; Hei, Kefei; Sancho, Juan; Sanchez, Nuria; Zinoviev, Kirill; Rubio, Jose L.; Margallo, Eduardo; Pandraud, Gregory; Sarro, Pasqualina M.

2018 IEEE Micro Electro Mechanical Systems, MEMS 2018. Vol. 2018-January Piscataway, NJ : IEEE, 2018. p. 25-28.

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

Harvard

Jovic, A, Uto, T, Hei, K, Sancho, J, Sanchez, N, Zinoviev, K, Rubio, JL, Margallo, E, Pandraud, G & Sarro, PM 2018, A highly miniturized single-chip MOEMS scanner for all-in-one imaging solution. in 2018 IEEE Micro Electro Mechanical Systems, MEMS 2018. vol. 2018-January, IEEE, Piscataway, NJ, pp. 25-28, MEMS 2018, Belfast, United Kingdom, 21/01/18. https://doi.org/10.1109/MEMSYS.2018.8346472

APA

Jovic, A., Uto, T., Hei, K., Sancho, J., Sanchez, N., Zinoviev, K., ... Sarro, P. M. (2018). A highly miniturized single-chip MOEMS scanner for all-in-one imaging solution. In 2018 IEEE Micro Electro Mechanical Systems, MEMS 2018 (Vol. 2018-January, pp. 25-28). Piscataway, NJ: IEEE. https://doi.org/10.1109/MEMSYS.2018.8346472

Vancouver

Jovic A, Uto T, Hei K, Sancho J, Sanchez N, Zinoviev K et al. A highly miniturized single-chip MOEMS scanner for all-in-one imaging solution. In 2018 IEEE Micro Electro Mechanical Systems, MEMS 2018. Vol. 2018-January. Piscataway, NJ: IEEE. 2018. p. 25-28 https://doi.org/10.1109/MEMSYS.2018.8346472

Author

Jovic, Aleksandar ; Uto, Toshihiko ; Hei, Kefei ; Sancho, Juan ; Sanchez, Nuria ; Zinoviev, Kirill ; Rubio, Jose L. ; Margallo, Eduardo ; Pandraud, Gregory ; Sarro, Pasqualina M. / A highly miniturized single-chip MOEMS scanner for all-in-one imaging solution. 2018 IEEE Micro Electro Mechanical Systems, MEMS 2018. Vol. 2018-January Piscataway, NJ : IEEE, 2018. pp. 25-28

BibTeX

@inproceedings{f8ffad40f6604c7bab8f2c927072032f,
title = "A highly miniturized single-chip MOEMS scanner for all-in-one imaging solution",
abstract = "A highly miniaturized, single-chip, large scanning range MOEMS scanner is demonstrated. This intrinsically-aligned, monolithically integrated device uses small angular displacement to provide a linear scanning range of 2000 μm in the lateral and 1000 μm in the vertical direction, at a working distance of 2 cm, with an average operating power lower than 170 mW. Within a footprint of only 7×10 mm2, the presented system fully integrates a photonic interferometer comprising a mirror, a silicon microlens and the MEMS actuator into a single chip, thus offering an unprecedentedly miniaturized scanning solution. The monolithic integration of all photonic components provides intrinsic alignment and excludes coupling losses often encountered in systems composed of discrete parts. No additional attenuation of the optical signal is observed during device operation. This small and high-performance device is suitable as complete system-on-chip for commercial, portable imaging applications.",
keywords = "Optical waveguides, Lenses, Optical interferometry, Silicon, Mirrors, Optical device fabrication, Optical imaging",
author = "Aleksandar Jovic and Toshihiko Uto and Kefei Hei and Juan Sancho and Nuria Sanchez and Kirill Zinoviev and Rubio, {Jose L.} and Eduardo Margallo and Gregory Pandraud and Sarro, {Pasqualina M.}",
year = "2018",
doi = "10.1109/MEMSYS.2018.8346472",
language = "English",
volume = "2018-January",
pages = "25--28",
booktitle = "2018 IEEE Micro Electro Mechanical Systems, MEMS 2018",
publisher = "IEEE",
address = "United States",

}

RIS

TY - GEN

T1 - A highly miniturized single-chip MOEMS scanner for all-in-one imaging solution

AU - Jovic, Aleksandar

AU - Uto, Toshihiko

AU - Hei, Kefei

AU - Sancho, Juan

AU - Sanchez, Nuria

AU - Zinoviev, Kirill

AU - Rubio, Jose L.

AU - Margallo, Eduardo

AU - Pandraud, Gregory

AU - Sarro, Pasqualina M.

PY - 2018

Y1 - 2018

N2 - A highly miniaturized, single-chip, large scanning range MOEMS scanner is demonstrated. This intrinsically-aligned, monolithically integrated device uses small angular displacement to provide a linear scanning range of 2000 μm in the lateral and 1000 μm in the vertical direction, at a working distance of 2 cm, with an average operating power lower than 170 mW. Within a footprint of only 7×10 mm2, the presented system fully integrates a photonic interferometer comprising a mirror, a silicon microlens and the MEMS actuator into a single chip, thus offering an unprecedentedly miniaturized scanning solution. The monolithic integration of all photonic components provides intrinsic alignment and excludes coupling losses often encountered in systems composed of discrete parts. No additional attenuation of the optical signal is observed during device operation. This small and high-performance device is suitable as complete system-on-chip for commercial, portable imaging applications.

AB - A highly miniaturized, single-chip, large scanning range MOEMS scanner is demonstrated. This intrinsically-aligned, monolithically integrated device uses small angular displacement to provide a linear scanning range of 2000 μm in the lateral and 1000 μm in the vertical direction, at a working distance of 2 cm, with an average operating power lower than 170 mW. Within a footprint of only 7×10 mm2, the presented system fully integrates a photonic interferometer comprising a mirror, a silicon microlens and the MEMS actuator into a single chip, thus offering an unprecedentedly miniaturized scanning solution. The monolithic integration of all photonic components provides intrinsic alignment and excludes coupling losses often encountered in systems composed of discrete parts. No additional attenuation of the optical signal is observed during device operation. This small and high-performance device is suitable as complete system-on-chip for commercial, portable imaging applications.

KW - Optical waveguides

KW - Lenses

KW - Optical interferometry

KW - Silicon

KW - Mirrors

KW - Optical device fabrication

KW - Optical imaging

UR - http://www.scopus.com/inward/record.url?scp=85047008331&partnerID=8YFLogxK

U2 - 10.1109/MEMSYS.2018.8346472

DO - 10.1109/MEMSYS.2018.8346472

M3 - Conference contribution

VL - 2018-January

SP - 25

EP - 28

BT - 2018 IEEE Micro Electro Mechanical Systems, MEMS 2018

PB - IEEE

CY - Piscataway, NJ

ER -

ID: 45355564