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A multi-step etch method for fabricating slightly tapered through-silicon vias based on modified Bosch process. / Lin, Pengrong; Xie, Xiaochen; Wang, Yong; Lian, Binhao; Zhang, Guoqi.

In: Microsystem Technologies, Vol. 25, No. 7, 2019, p. 2693-2698.

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Lin, Pengrong ; Xie, Xiaochen ; Wang, Yong ; Lian, Binhao ; Zhang, Guoqi. / A multi-step etch method for fabricating slightly tapered through-silicon vias based on modified Bosch process. In: Microsystem Technologies. 2019 ; Vol. 25, No. 7. pp. 2693-2698.

BibTeX

@article{aa43c75ee9e7458b90bdcf1ac855cfdf,
title = "A multi-step etch method for fabricating slightly tapered through-silicon vias based on modified Bosch process",
abstract = "In this paper, a multi-step etching method based on Bosch process was investigated to fabricate a slightly tapered via. The diameter of vias was scaled from 40 to 100 µm. Isotropic etching step was added into Bosch process to control the angle of the tapered vias. The slope angle could be adjusted by changing the time settings of isotropic etching step. The influence of the platen temperature was also studied. The passivation and etching steps are extremely sensitive to temperature. Silicon grass could be formed at low temperature. The two different processes of isotropic SF6 etching and Cl2/HBr etching were also compared. The wrinkles and cracks were observed on the surface after treatment with isotropic SF6 etching. The Cl2/HBr etching method is much better for removing the scallops.",
author = "Pengrong Lin and Xiaochen Xie and Yong Wang and Binhao Lian and Guoqi Zhang",
year = "2019",
doi = "10.1007/s00542-018-4249-8",
language = "English",
volume = "25",
pages = "2693--2698",
journal = "Microsystem Technologies: micro and nanosystems - information storage and processing systems",
issn = "0946-7076",
publisher = "Springer",
number = "7",

}

RIS

TY - JOUR

T1 - A multi-step etch method for fabricating slightly tapered through-silicon vias based on modified Bosch process

AU - Lin, Pengrong

AU - Xie, Xiaochen

AU - Wang, Yong

AU - Lian, Binhao

AU - Zhang, Guoqi

PY - 2019

Y1 - 2019

N2 - In this paper, a multi-step etching method based on Bosch process was investigated to fabricate a slightly tapered via. The diameter of vias was scaled from 40 to 100 µm. Isotropic etching step was added into Bosch process to control the angle of the tapered vias. The slope angle could be adjusted by changing the time settings of isotropic etching step. The influence of the platen temperature was also studied. The passivation and etching steps are extremely sensitive to temperature. Silicon grass could be formed at low temperature. The two different processes of isotropic SF6 etching and Cl2/HBr etching were also compared. The wrinkles and cracks were observed on the surface after treatment with isotropic SF6 etching. The Cl2/HBr etching method is much better for removing the scallops.

AB - In this paper, a multi-step etching method based on Bosch process was investigated to fabricate a slightly tapered via. The diameter of vias was scaled from 40 to 100 µm. Isotropic etching step was added into Bosch process to control the angle of the tapered vias. The slope angle could be adjusted by changing the time settings of isotropic etching step. The influence of the platen temperature was also studied. The passivation and etching steps are extremely sensitive to temperature. Silicon grass could be formed at low temperature. The two different processes of isotropic SF6 etching and Cl2/HBr etching were also compared. The wrinkles and cracks were observed on the surface after treatment with isotropic SF6 etching. The Cl2/HBr etching method is much better for removing the scallops.

UR - http://www.scopus.com/inward/record.url?scp=85058039032&partnerID=8YFLogxK

U2 - 10.1007/s00542-018-4249-8

DO - 10.1007/s00542-018-4249-8

M3 - Article

AN - SCOPUS:85058039032

VL - 25

SP - 2693

EP - 2698

JO - Microsystem Technologies: micro and nanosystems - information storage and processing systems

JF - Microsystem Technologies: micro and nanosystems - information storage and processing systems

SN - 0946-7076

IS - 7

ER -

ID: 55453294