Standard

A new self-sealing thin-film encapsulation process for MEMS. / Santagata, F; Zaccaria, I; Poelma, RH; Creemer, JF; Zhang, GQ; Sarro, PM.

Proceedings 17th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXVII. ed. / JR Morante; C Hierold. Piscataway, NJ, USA : IEEE Society, 2013. p. 822-825.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Harvard

Santagata, F, Zaccaria, I, Poelma, RH, Creemer, JF, Zhang, GQ & Sarro, PM 2013, A new self-sealing thin-film encapsulation process for MEMS. in JR Morante & C Hierold (eds), Proceedings 17th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXVII. IEEE Society, Piscataway, NJ, USA, pp. 822-825, Transducers 2013 & Eurosensors XXVII, Barcelona, Spain, 16/06/13. https://doi.org/10.1109/Transducers.2013.6626893

APA

Santagata, F., Zaccaria, I., Poelma, RH., Creemer, JF., Zhang, GQ., & Sarro, PM. (2013). A new self-sealing thin-film encapsulation process for MEMS. In JR. Morante, & C. Hierold (Eds.), Proceedings 17th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXVII (pp. 822-825). Piscataway, NJ, USA: IEEE Society. https://doi.org/10.1109/Transducers.2013.6626893

Vancouver

Santagata F, Zaccaria I, Poelma RH, Creemer JF, Zhang GQ, Sarro PM. A new self-sealing thin-film encapsulation process for MEMS. In Morante JR, Hierold C, editors, Proceedings 17th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXVII. Piscataway, NJ, USA: IEEE Society. 2013. p. 822-825 https://doi.org/10.1109/Transducers.2013.6626893

Author

Santagata, F ; Zaccaria, I ; Poelma, RH ; Creemer, JF ; Zhang, GQ ; Sarro, PM. / A new self-sealing thin-film encapsulation process for MEMS. Proceedings 17th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXVII. editor / JR Morante ; C Hierold. Piscataway, NJ, USA : IEEE Society, 2013. pp. 822-825

BibTeX

@inproceedings{b469dea471744b3e98e3a626e1ba6d27,
title = "A new self-sealing thin-film encapsulation process for MEMS",
author = "F Santagata and I Zaccaria and RH Poelma and JF Creemer and GQ Zhang and PM Sarro",
year = "2013",
doi = "10.1109/Transducers.2013.6626893",
language = "English",
isbn = "978-1-4673-5983-2",
publisher = "IEEE Society",
pages = "822--825",
editor = "JR Morante and C Hierold",
booktitle = "Proceedings 17th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXVII",

}

RIS

TY - GEN

T1 - A new self-sealing thin-film encapsulation process for MEMS

AU - Santagata, F

AU - Zaccaria, I

AU - Poelma, RH

AU - Creemer, JF

AU - Zhang, GQ

AU - Sarro, PM

PY - 2013

Y1 - 2013

U2 - 10.1109/Transducers.2013.6626893

DO - 10.1109/Transducers.2013.6626893

M3 - Conference contribution

SN - 978-1-4673-5983-2

SP - 822

EP - 825

BT - Proceedings 17th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXVII

A2 - Morante, JR

A2 - Hierold, C

PB - IEEE Society

CY - Piscataway, NJ, USA

ER -

ID: 3582772