A novel dual-side fabrication method for silicon plate springs with high out-of-plane stiffness

J Su; HW van Zeijl; SL Paalvast; PM Sarro; J van Eijk

A novel dual-side fabrication method for silicon plate springs with high out-of-plane stiffness

J Su, HW van Zeijl, SL Paalvast, PM Sarro, J van Eijk

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

49 Citations (Scopus)

Original language	Undefined/Unknown
Title of host publication	Proceedings of SAFE 2006 Workshop on Semiconductor Advances for Future Electronics and Sensors
Editors	s.n.
Place of Publication	Veldhoven
Publisher	s.l.
Pages	394-397
Number of pages	4
ISBN (Print)	90-73461-44-8
Publication status	Published - 2006
Event	9th Annual Workshop on Semiconductor Advances for future Electronics and Sensors (SAFE 2006), Veldhoven, the Netherlands - Utrecht Duration: 23 Nov 2006 → 24 Nov 2006

Publication series

Name
Publisher	s.l.

Conference

Conference	9th Annual Workshop on Semiconductor Advances for future Electronics and Sensors (SAFE 2006), Veldhoven, the Netherlands
Period	23/11/06 → 24/11/06

Keywords

conference contrib. refereed
Conf.proc. > 3 pag

Cite this

@inproceedings{f880ca1751144340b37b161e983a0db5,

title = "A novel dual-side fabrication method for silicon plate springs with high out-of-plane stiffness",

keywords = "conference contrib. refereed, Conf.proc. > 3 pag",

author = "J Su and {van Zeijl}, HW and SL Paalvast and PM Sarro and {van Eijk}, J",

year = "2006",

language = "Undefined/Unknown",

isbn = "90-73461-44-8",

publisher = "s.l.",

pages = "394--397",

editor = "s.n.",

booktitle = "Proceedings of SAFE 2006 Workshop on Semiconductor Advances for Future Electronics and Sensors",

note = "9th Annual Workshop on Semiconductor Advances for future Electronics and Sensors (SAFE 2006), Veldhoven, the Netherlands ; Conference date: 23-11-2006 Through 24-11-2006",

}

Su, J, van Zeijl, HW, Paalvast, SL, Sarro, PM & van Eijk, J 2006, A novel dual-side fabrication method for silicon plate springs with high out-of-plane stiffness. in s.n. (ed.), Proceedings of SAFE 2006 Workshop on Semiconductor Advances for Future Electronics and Sensors. s.l., Veldhoven, pp. 394-397, 9th Annual Workshop on Semiconductor Advances for future Electronics and Sensors (SAFE 2006), Veldhoven, the Netherlands, 23/11/06.

A novel dual-side fabrication method for silicon plate springs with high out-of-plane stiffness. / Su, J; van Zeijl, HW; Paalvast, SL et al.
Proceedings of SAFE 2006 Workshop on Semiconductor Advances for Future Electronics and Sensors. ed. / s.n. Veldhoven: s.l., 2006. p. 394-397.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - A novel dual-side fabrication method for silicon plate springs with high out-of-plane stiffness

AU - Su, J

AU - van Zeijl, HW

AU - Paalvast, SL

AU - Sarro, PM

AU - van Eijk, J

PY - 2006

Y1 - 2006

KW - conference contrib. refereed

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 90-73461-44-8

SP - 394

EP - 397

BT - Proceedings of SAFE 2006 Workshop on Semiconductor Advances for Future Electronics and Sensors

A2 - s.n., null

PB - s.l.

CY - Veldhoven

T2 - 9th Annual Workshop on Semiconductor Advances for future Electronics and Sensors (SAFE 2006), Veldhoven, the Netherlands

Y2 - 23 November 2006 through 24 November 2006

ER -