A novel method to transfer porous PDMS membranes for high throughput Organ-on-Chip and Lab-on-Chip assembly

W.F. Quiros-Solano; N. Gaio; C. Silvestri; Y.B. Arik; O.M.J.A. Stassen; A.D. van der Meer; C.V.C. Bouten; A. van den Berg; R. Dekker; P.M. Sarro

doi:10.1109/MEMSYS.2018.8346550

A novel method to transfer porous PDMS membranes for high throughput Organ-on-Chip and Lab-on-Chip assembly

W.F. Quiros-Solano^*, N. Gaio, C. Silvestri, Y.B. Arik, O.M.J.A. Stassen, A.D. van der Meer, C.V.C. Bouten, A. van den Berg, R. Dekker, P.M. Sarro

^*Corresponding author for this work

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

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Abstract

We present a novel method to easily and reliably transfer highly porous, large area, thin microfabricated Polydimethylsiloxane (PDMS) porous membranes on Lab-on-Chip (LOC) and Organ-on-Chip (OOC) devices. The use of silicon as carrier substrate and a water-soluble sacrificial layer allows a simple and reproducible transfer of the membranes to any PDMS-based OOC and LOC device. The use of IC and MEMS compatible techniques reduces significantly the fabrication time and the need of manual handling. Our method is suitable for automatic assembling systems, such as pick-and-place, crucial to significantly increase the throughput of OOC and LOC devices assembling. Membranes with 8 μm pore size and as thin as 4 μm are successfully transferred. The viability and biocompatibility of the transfer was assessed by culturing two different cell lines on an OOC with transferred porous PDMS membranes.

Original language	English
Title of host publication	2018 IEEE Micro Electro Mechanical Systems, MEMS 2018
Place of Publication	Piscataway, NJ
Publisher	IEEE
Pages	318-321
Number of pages	4
Volume	2018-January
ISBN (Electronic)	978-1-5386-4782-0
DOIs	https://doi.org/10.1109/MEMSYS.2018.8346550
Publication status	Published - 2018
Event	MEMS 2018: 31st IEEE International Conference on Micro Electro Mechanical Systems - Belfast, United Kingdom Duration: 21 Jan 2018 → 25 Jan 2018 https://www.mems2018.org/

Conference

Conference	MEMS 2018
Country/Territory	United Kingdom
City	Belfast
Period	21/01/18 → 25/01/18
Internet address	https://www.mems2018.org/

Keywords

Biomembranes
Fabrication
Silicon
Throughput
Microchannels
Micromechanical devices
Manuals

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10.1109/MEMSYS.2018.8346550

08346550Final published version, 732 KB

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Quiros-Solano, W. F., Gaio, N., Silvestri, C., Arik, Y. B., Stassen, O. M. J. A., van der Meer, A. D., Bouten, C. V. C., van den Berg, A., Dekker, R., & Sarro, P. M. (2018). A novel method to transfer porous PDMS membranes for high throughput Organ-on-Chip and Lab-on-Chip assembly. In 2018 IEEE Micro Electro Mechanical Systems, MEMS 2018 (Vol. 2018-January, pp. 318-321). IEEE. https://doi.org/10.1109/MEMSYS.2018.8346550

@inproceedings{df392e755fd04e1eaf548565dba7efb1,

title = "A novel method to transfer porous PDMS membranes for high throughput Organ-on-Chip and Lab-on-Chip assembly",

abstract = "We present a novel method to easily and reliably transfer highly porous, large area, thin microfabricated Polydimethylsiloxane (PDMS) porous membranes on Lab-on-Chip (LOC) and Organ-on-Chip (OOC) devices. The use of silicon as carrier substrate and a water-soluble sacrificial layer allows a simple and reproducible transfer of the membranes to any PDMS-based OOC and LOC device. The use of IC and MEMS compatible techniques reduces significantly the fabrication time and the need of manual handling. Our method is suitable for automatic assembling systems, such as pick-and-place, crucial to significantly increase the throughput of OOC and LOC devices assembling. Membranes with 8 μm pore size and as thin as 4 μm are successfully transferred. The viability and biocompatibility of the transfer was assessed by culturing two different cell lines on an OOC with transferred porous PDMS membranes.",

keywords = "Biomembranes, Fabrication, Silicon, Throughput, Microchannels, Micromechanical devices, Manuals",

author = "W.F. Quiros-Solano and N. Gaio and C. Silvestri and Y.B. Arik and O.M.J.A. Stassen and {van der Meer}, A.D. and C.V.C. Bouten and {van den Berg}, A. and R. Dekker and P.M. Sarro",

year = "2018",

doi = "10.1109/MEMSYS.2018.8346550",

language = "English",

volume = "2018-January",

pages = "318--321",

booktitle = "2018 IEEE Micro Electro Mechanical Systems, MEMS 2018",

publisher = "IEEE",

address = "United States",

note = "MEMS 2018 : 31st IEEE International Conference on Micro Electro Mechanical Systems ; Conference date: 21-01-2018 Through 25-01-2018",

url = "https://www.mems2018.org/",

}

Quiros-Solano, WF, Gaio, N , Silvestri, C, Arik, YB, Stassen, OMJA, van der Meer, AD, Bouten, CVC, van den Berg, A, Dekker, R & Sarro, PM 2018, A novel method to transfer porous PDMS membranes for high throughput Organ-on-Chip and Lab-on-Chip assembly. in 2018 IEEE Micro Electro Mechanical Systems, MEMS 2018. vol. 2018-January, IEEE, Piscataway, NJ, pp. 318-321, MEMS 2018, Belfast, United Kingdom, 21/01/18. https://doi.org/10.1109/MEMSYS.2018.8346550

A novel method to transfer porous PDMS membranes for high throughput Organ-on-Chip and Lab-on-Chip assembly. / Quiros-Solano, W.F.; Gaio, N.; Silvestri, C. et al.
2018 IEEE Micro Electro Mechanical Systems, MEMS 2018. Vol. 2018-January Piscataway, NJ: IEEE, 2018. p. 318-321.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - A novel method to transfer porous PDMS membranes for high throughput Organ-on-Chip and Lab-on-Chip assembly

AU - Quiros-Solano, W.F.

AU - Gaio, N.

AU - Silvestri, C.

AU - Arik, Y.B.

AU - Stassen, O.M.J.A.

AU - van der Meer, A.D.

AU - Bouten, C.V.C.

AU - van den Berg, A.

AU - Dekker, R.

AU - Sarro, P.M.

PY - 2018

Y1 - 2018

N2 - We present a novel method to easily and reliably transfer highly porous, large area, thin microfabricated Polydimethylsiloxane (PDMS) porous membranes on Lab-on-Chip (LOC) and Organ-on-Chip (OOC) devices. The use of silicon as carrier substrate and a water-soluble sacrificial layer allows a simple and reproducible transfer of the membranes to any PDMS-based OOC and LOC device. The use of IC and MEMS compatible techniques reduces significantly the fabrication time and the need of manual handling. Our method is suitable for automatic assembling systems, such as pick-and-place, crucial to significantly increase the throughput of OOC and LOC devices assembling. Membranes with 8 μm pore size and as thin as 4 μm are successfully transferred. The viability and biocompatibility of the transfer was assessed by culturing two different cell lines on an OOC with transferred porous PDMS membranes.

AB - We present a novel method to easily and reliably transfer highly porous, large area, thin microfabricated Polydimethylsiloxane (PDMS) porous membranes on Lab-on-Chip (LOC) and Organ-on-Chip (OOC) devices. The use of silicon as carrier substrate and a water-soluble sacrificial layer allows a simple and reproducible transfer of the membranes to any PDMS-based OOC and LOC device. The use of IC and MEMS compatible techniques reduces significantly the fabrication time and the need of manual handling. Our method is suitable for automatic assembling systems, such as pick-and-place, crucial to significantly increase the throughput of OOC and LOC devices assembling. Membranes with 8 μm pore size and as thin as 4 μm are successfully transferred. The viability and biocompatibility of the transfer was assessed by culturing two different cell lines on an OOC with transferred porous PDMS membranes.

KW - Biomembranes

KW - Fabrication

KW - Silicon

KW - Throughput

KW - Microchannels

KW - Micromechanical devices

KW - Manuals

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U2 - 10.1109/MEMSYS.2018.8346550

DO - 10.1109/MEMSYS.2018.8346550

M3 - Conference contribution

AN - SCOPUS:85047015523

VL - 2018-January

SP - 318

EP - 321

BT - 2018 IEEE Micro Electro Mechanical Systems, MEMS 2018

PB - IEEE

CY - Piscataway, NJ

T2 - MEMS 2018

Y2 - 21 January 2018 through 25 January 2018

ER -

A novel method to transfer porous PDMS membranes for high throughput Organ-on-Chip and Lab-on-Chip assembly

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Monolithic integration of silicon and polymer microstructures for Organ-on-Chip applications

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