A novel silicon interposer for measuring devices requiring complex two-sided contacting

J Derakhshandeh Kheljani; N Golshani; LA Steenweg; W van der Vlist; LK Nanver

doi:10.1109/ICMTS.2013.6528143

A novel silicon interposer for measuring devices requiring complex two-sided contacting

J Derakhshandeh Kheljani, N Golshani, LA Steenweg, W van der Vlist, LK Nanver

Electronic Components, Technology and Materials

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

2 Citations (Scopus)

Original language	English
Title of host publication	Proceedings - 2013 IEEE International Conference on Microelectronic Test Structures
Editors	T Ohguro
Place of Publication	Piscataway, NJ, USA
Publisher	IEEE Society
Pages	43-46
Number of pages	4
ISBN (Print)	978-1-4673-4845-4
DOIs	https://doi.org/10.1109/ICMTS.2013.6528143
Publication status	Published - 2013
Event	2013 IEEE CMTS, Osaka, Japan - Piscataway, NJ, USA Duration: 25 Mar 2013 → 28 Mar 2013

Publication series

Name
Publisher	IEEE

Conference

Conference	2013 IEEE CMTS, Osaka, Japan
Period	25/03/13 → 28/03/13

Bibliographical note

Harvest

Access to Document

10.1109/ICMTS.2013.6528143

Cite this

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title = "A novel silicon interposer for measuring devices requiring complex two-sided contacting",

author = "{Derakhshandeh Kheljani}, J and N Golshani and LA Steenweg and {van der Vlist}, W and LK Nanver",

note = "Harvest; 2013 IEEE CMTS, Osaka, Japan ; Conference date: 25-03-2013 Through 28-03-2013",

year = "2013",

doi = "10.1109/ICMTS.2013.6528143",

language = "English",

isbn = "978-1-4673-4845-4",

publisher = "IEEE Society",

pages = "43--46",

editor = "T Ohguro",

booktitle = "Proceedings - 2013 IEEE International Conference on Microelectronic Test Structures",

}

Derakhshandeh Kheljani, J, Golshani, N, Steenweg, LA, van der Vlist, W & Nanver, LK 2013, A novel silicon interposer for measuring devices requiring complex two-sided contacting. in T Ohguro (ed.), Proceedings - 2013 IEEE International Conference on Microelectronic Test Structures. IEEE Society, Piscataway, NJ, USA, pp. 43-46, 2013 IEEE CMTS, Osaka, Japan, 25/03/13. https://doi.org/10.1109/ICMTS.2013.6528143

A novel silicon interposer for measuring devices requiring complex two-sided contacting. / Derakhshandeh Kheljani, J; Golshani, N; Steenweg, LA et al.
Proceedings - 2013 IEEE International Conference on Microelectronic Test Structures. ed. / T Ohguro. Piscataway, NJ, USA: IEEE Society, 2013. p. 43-46.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - A novel silicon interposer for measuring devices requiring complex two-sided contacting

AU - Derakhshandeh Kheljani, J

AU - Golshani, N

AU - Steenweg, LA

AU - van der Vlist, W

AU - Nanver, LK

N1 - Harvest

PY - 2013

Y1 - 2013

U2 - 10.1109/ICMTS.2013.6528143

DO - 10.1109/ICMTS.2013.6528143

M3 - Conference contribution

SN - 978-1-4673-4845-4

SP - 43

EP - 46

BT - Proceedings - 2013 IEEE International Conference on Microelectronic Test Structures

A2 - Ohguro, T

PB - IEEE Society

CY - Piscataway, NJ, USA

T2 - 2013 IEEE CMTS, Osaka, Japan

Y2 - 25 March 2013 through 28 March 2013

ER -