A novel tool for cure dependent viscoelastic characterization of packaging polymers

C van t Hof, G Wisse, LJ Ernst, KMB Jansen, D Yang, GQ Zhang, HJL Bressers

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

6 Citations (Scopus)
Original languageUndefined/Unknown
Title of host publicationEuroSimE 2004: 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems
EditorsLJ Ernst, GQ Zhang, P Rodgers, O de Saint Leger
Place of PublicationPiscataway
PublisherIEEE Society
Pages385-389
Number of pages5
ISBN (Print)0-7803-8420-2
Publication statusPublished - 2004
EventEuroSimE 2004: 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems - Brussels, Belgium
Duration: 10 May 200412 May 2004

Publication series

Name
PublisherIEEE

Conference

ConferenceEuroSimE 2004: 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems
Country/TerritoryBelgium
CityBrussels
Period10/05/0412/05/04

Bibliographical note

IEEE Cat No. 04EX831

Keywords

  • Conf.proc. > 3 pag

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