Original languageEnglish
Title of host publicationProceedings 15th International Conference on Thermal, Mechanical and Multi-physics Simulation and Experiments in Microelectronics and Microsystems
EditorsB Vandevelde
Place of PublicationPiscataway, NJ, USA
PublisherIEEE Society
Pages1-5
Number of pages5
ISBN (Print)978-1-4799-4791-1
DOIs
Publication statusPublished - 2014
EventEuroSimE 2014: IEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Ghent, Belgium
Duration: 7 Apr 20149 Apr 2014

Publication series

Name
PublisherIEEE

Conference

ConferenceEuroSimE 2014
CountryBelgium
CityGhent
Period7/04/149/04/14

    Research areas

  • Conf.proc. > 3 pag

ID: 2809355