A study on the creep damage of epoxy molding compound in IC package

S Liu; L Qin; D Yang; LJ Ernst; GQ Zhang

A study on the creep damage of epoxy molding compound in IC package

S Liu, L Qin, D Yang, LJ Ernst, GQ Zhang

Dynamics of Micro and Nano Systems

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

2 Citations (Scopus)

Original language	Undefined/Unknown
Title of host publication	ICEPT 2003
Editors	K Bi, PG Barnwell, J Wang
Place of Publication	Piscataway
Publisher	IEEE Society
Pages	254-259
Number of pages	6
ISBN (Print)	0-7803-8168-8
Publication status	Published - 2003
Event	5th international conference on electronic packaging technology, Shanghai - Piscataway Duration: 28 Oct 2003 → 30 Oct 2003

Publication series

Name
Publisher	IEEE

Conference

Conference	5th international conference on electronic packaging technology, Shanghai
Period	28/10/03 → 30/10/03

Keywords

Conf.proc. > 3 pag

Cite this

@inproceedings{1e78466c5fd9405fbbaef05827a47496,

title = "A study on the creep damage of epoxy molding compound in IC package",

keywords = "Conf.proc. > 3 pag",

author = "S Liu and L Qin and D Yang and LJ Ernst and GQ Zhang",

year = "2003",

language = "Undefined/Unknown",

isbn = "0-7803-8168-8",

publisher = "IEEE Society",

pages = "254--259",

editor = "K Bi and PG Barnwell and J Wang",

booktitle = "ICEPT 2003",

note = "5th international conference on electronic packaging technology, Shanghai ; Conference date: 28-10-2003 Through 30-10-2003",

}

TY - GEN

T1 - A study on the creep damage of epoxy molding compound in IC package

AU - Liu, S

AU - Qin, L

AU - Yang, D

AU - Ernst, LJ

AU - Zhang, GQ

PY - 2003

Y1 - 2003

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 0-7803-8168-8

SP - 254

EP - 259

BT - ICEPT 2003

A2 - Bi, K

A2 - Barnwell, PG

A2 - Wang, J

PB - IEEE Society

CY - Piscataway

T2 - 5th international conference on electronic packaging technology, Shanghai

Y2 - 28 October 2003 through 30 October 2003

ER -